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| NEW SD Memory Card Connectors DM1 Series Withstands higher force of card insertion. Card Standard type Metal cover extends over the back of the connector. sFeatures 1. Withstands higher force of card insertion Metal cover extends over the back of the connector allowing it to withstand force of up to 400 N (static load) when dropped or accidentally hit. Card Reverse type 2. No damage to the card when accidentally pulled-out The connectors will release the card when a moderate pull-out force of about 4 N is applied. There will be no damage to the lock components and all connector functions will not be affected. Metal cover extends over the back of the connector. No damage to the card when accidentally pulled-out. 3. Accidental card fall-out prevention Built-in lock feature holds the card securely in place. 4. Reliable Card Insertion and Withdrawal Built-in Push-in / Push-out ejection mechanism assures simple and reliable card insertion and withdrawal. 5. Designed to accept Secure Digital I/O card (Built-in Ground Contact) The connector allows use of various expansion modules, including the Bluetooth communication modules. Accidental card fall-out prevention sApplications Notebook PC's, digital cameras, PDA's, audio/video equipment and other devices utilizing SD I/O cards. 2003.4 1 sProduct Specifications Rating Current rating 0.5A DC Voltage rating 125 V AC Operating temperature range:-25c to +85c (Note 1) Storage temperature range:-40c to +85c (Note 2) Operating humidity range : Relative humidity 95% max. (No condensation) Item 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance 4. Vibration 5. Humidity 6. Temperature cycle Specification 1000 M ohms min. (Initial value) No flashover or insulation breakdown 100 m ohms max. (Initial value) No electrical discontinuity of 100 ns or more Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. Contact resistance: 40 m ohms max. from initial value Insulation resistance: 100 M ohms min. Conditions 500 V DC 500 V AC / one minute 100mA DC Frequency: 10 to 55 Hz, single amplitude of 0.75 mm, 2 hours / 3 axis 96 hours at temperature of 40c 2c and humidity of 90% to 95% Temperature: -55c/ +5c to +35c/ +85c/ +5c to +35c Duration: 30 / 5 / 30 / 5 (Minutes) 5 cycles 10000 cycles at 400 to 600 cycles per hour Reflow: At the recommended temperature profile Manual soldering: 300c for 3 seconds 7. Durability (mating/un-mating) Contact resistance: 40m ohms max. from initial value 8. Resistance to soldering heat No deformation of components affecting performance. Note1: Includes temperature rise caused by current flow. Note2: The term "storage" refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. sMaterials Component Insulator Contacts Cover Others Material Heat resistant thermoplastic compound Phosphor bronze Stainless steel Stainless steel Piano wire Finish Color: Black Contact area: Gold plating Termination area: Tinned copper plating Termination area: Tinned copper plating ------------------Nickel plating Remarks UL94V-0 ------------------------------------------------------- sOrdering information DM1 AA - SF - PEJ 1 1 Series name 2 Connector type 2 3 4 3 Terminal type SF : Right angle surface mount DSF : Reverse right angle surface mount 4 Eject mechanism codes PEJ : Card Push insert/Push withdraw : DM1 : AA : Standard receptacle : B : Reverse receptacle 2 sStandard type BPCB mounting pattern 25.40.05 4.1250.05 1.70.05 1.350.05 2 +0.1 0 20.750.05 18.150.05 9.20.05 1.60.05 4.550.05 22.40.05 150.05 P=2.50.05 20.05 +0 0 .1 2 +0.1 0 9-1.10.05 4-2 +0.1 0 1.20.05 23.20.05 3-1 +0.1 0 Part number DM1AA-SF-PEJ(21) HRS No. 609-0004-8-21 2 +0.1 0 1 C L 2 Write protection switch 1.20.05 1 13.2 9.75 8.05 t=0.2,W=0.6 5.625 28 1 15 P2.5 2.9 No.4 No.2 No.3 No.5 2.5 No.1 No.9 No.6 No.7 No.8 9.2 30.5 23.2 4.55 4-1.5 1 C L 1 C L 1 24.15 (Card slot dimension) 0.55 1 C indicates the center line of card slot. L Card detection switch When card When card is ejected is inserted OPEN CLOSE Write protection switch When card is inserted When card is ejected WRITE PROTECT WRITE ENABLE OPEN OPEN CLOSE 1 C L 22.4 2-O1.2 Weight:2.2g 2-O 1. 3-0.5 5 18.15 20.75 2 Card detection switch BCard insertion/withdrawal dimensions 5 6 SD Card SD Card Card pushed-in for insertion Card fully inserted 11 SD Card Card ejected (Card ejected dimension) 3 3 sReverse type BPCB mounting pattern 9.470.05 12.80.05 11.20.05 9.750.05 8.050.05 11-2.50.05 12.50.05 0.80.05 P=2.50.05 1.250.05 5.6250.05 0.80.05 1.40.05 CARD DETECT COMMON FOR CD & WP 1.050.05 8-1.10.05 3 A 5.62 2.030.05 11.230.05 14.130.05 1.40.05 A 23.480.05 28.250.05 26.980.05 12.570.05 Part number DM1B-DSF-PEJ HRS No. 609-0003-5 14.250.05 C 11.930.05 WP 3 A(5:1) hole) Center of Card dimension C(5:1) hole) B B(5:1) hole) +0.1 (Through 0 +0.1 (Through 0 +0.1 (Through 0 +0.1 -0.1 (Land) (Land) +0.1 (Land) 0 1.2 0.8 +0.1 (Land) 0 1.2 0.8 +0.1 (Land) 0 +0.1 (Through 0 1.2 0.8 +0.1 (Land) 0 +0.1 (Through 0 28.50.05 hole) +0.1 -0.1 2.4 1.9 1.7 1.3 1.5 +0.1 (Through 0 hole) hole) (R0 (R0 .4) .6) (R0 (R0 .4) 2 .6) (R0 (R0 .4) .6) 2 8.63 2 2 18.68 16.85 2 6.95 2 2 7.65 6-0.65 5.62 1 C L 28 (14.35) 1 2.9 2 1.85 1.5 C L No.7 No.8 1.05 No.6 No.5 No.4 No.3 No.2 No.1 No.9 10:Card ejected(Card ejected dimension) (5):Card pushed for insertion (6):Card fully inserted 27.45 2 0.35 2 29.9 29 2 (1.77) 1 C L (0.25) SD Card 1 2 C indicates the center line of the card slot. L indicates the dimension of DIP terminals. Card detection switch When card When card is ejected is ejected 1 C L OPEN CLOSE Write protection switch When card is ejected When card is ejected WRITE PROTECT WRITE ENABLE OPEN OPEN CLOSE Weight:2.1g 4 2 27.2 BPackaging specifications qEmbossed Carrier Tape Dimensions (Standard type) 450 pieces per reel 1.750.1 40.1 20.15 360.1 4.350.3 3.40.3 .5 O1 .1 +0 0 40.40.1 440.3 20.20.1 Unreeling direction qEmbossed Carrier Tape Dimensions(Reverse type) 450 pieces per reel 1.750.1 40.1 20.15 360.1 3.40.3 4.60.3 .5 O1 .1 +0 0 40.40.1 440.3 20.20.1 Unreeling direction qReel dimensions 44.4 +2 0 Unreeling direction D (O150) End section Mounting section(450) Blank section(160mm min.) Embossed carrier tape Blank section (100mm min.) Top cover tape Lead section (400mm min.) (O380) 5 sRecommended Temperature Profile 300c IR Reflow Conditions Preheating: 150c Soldering : 220c 200c 30 to 90 sec. MAX240c 220c Soldering : 2355c 10 sec. Max. 10 to 20 sec. Soldering 150c Preheating 100c 0c 0S 50S 100S 150S 200S Recommended Conditions Reflow system Solder Test board Metal mask thickness: 0.15 mm Recommended temperature profile. The temperature may be slightly changed according to the solder paste type and thickness. : IR reflow : Paste type 63 Sn/37 Pb(Flux content 9 wt%) : Glass epoxy 60mm x 100mm x 1.6 mm thick 6 |
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