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 Power Transistors
2SD1964
Silicon NPN epitaxial planar type
For power switching
Unit: mm
0.70.1
s Features
q q q q
10.00.2 5.50.2 2.70.2 4.20.2 3.10.1 1.40.1
4.20.2
Low collector to emitter saturation voltage VCE(sat) Satisfactory linearity of foward current transfer ratio hFE Large collector current IC Full-pack package which can be installed to the heat sink with one screw (TC=25C)
Ratings 130 80 7 25 15 50 2 150 -55 to +150 Unit V V V A A W C C
Solder Dip
Parameter Collector to base voltage Collector to emitter voltage Emitter to base voltage Peak collector current Collector current Collector power TC=25C dissipation Ta=25C Junction temperature Storage temperature
Symbol VCBO VCEO VEBO ICP IC PC Tj Tstg
14.00.5
4.0
s Absolute Maximum Ratings
16.70.3
7.50.2
1.30.2
0.5 +0.2 -0.1 0.80.1
2.540.25 5.080.5 1 2 3
1:Base 2:Collector 3:Emitter TO-220 Full Pack Package(a)
s Electrical Characteristics
Parameter Collector cutoff current Emitter cutoff current Collector to emitter voltage
(TC=25C)
Symbol ICBO IEBO VCEO hFE1 hFE2* hFE3 VCE(sat)1 VCE(sat)2 VBE(sat)1 VBE(sat)2 fT ton tstg tf Conditions VCB = 100V, IE = 0 VEB = 5V, IC = 0 IC = 10mA, IB = 0 VCE = 2V, IC = 0.1A VCE = 2V, IC = 3A VCE = 2V, IC = 8A IC = 7A, IB = 0.35A IC = 15A, IB = 1.5A IC = 7A, IB = 0.35A IC = 15A, IB = 1.5A VCE = 10V, IC = 0.5A, f = 1MHz IC = 7A, IB1 = 0.7A, IB2 = - 0.7A, VCC = 50V 20 0.5 2.0 0.2 80 45 90 30 0.5 1.5 1.5 2.5 V V V V MHz s s s 260 min typ max 10 50 Unit A A V
Forward current transfer ratio
Collector to emitter saturation voltage
Base to emitter saturation voltage Transition frequency Turn-on time Storage time Fall time
*h FE2
Rank classification
Q 90 to 180 P 130 to 260
Rank hFE2
1
Power Transistors
PC -- Ta
60 20 (1) (1) TC=Ta (2) With a 100 x 100 x 2mm Al heat sink (3) With a 50 x 50 x 2mm Al heat sink (4) Without heat sink (PC=2W) TC=25C IB=300mA
2SD1964
IC -- VCE
Collector to emitter saturation voltage VCE(sat) (V)
10 (1) IC/IB=10 (2) IC/IB=20 TC=25C
VCE(sat) -- IC
Collector power dissipation PC (W)
50
40
Collector current IC (A)
16
3
12
200mA 140mA 100mA
1 (2) 0.3 (1)
30
8
80mA 60mA
20 (2) (3) 0 0 20 40 60 80 100 120 140 160 (4)
0.1
10
4
40mA 20mA
0.03
0 0 2 4 6 8 10 12
0.01 0.1
0.3
1
3
10
Ambient temperature Ta (C)
Collector to emitter voltage VCE (V)
Collector current IC (A)
VCE(sat) -- IC
Collector to emitter saturation voltage VCE(sat) (V)
10
VBE(sat) -- IC
Base to emitter saturation voltage VBE(sat) (V)
IC/IB=10 100 IC/IB=10 1000 30 10 3 1 0.3 0.1 0.03 0.01 0.01 0.03 TC=-25C 100C
hFE -- IC
VCE=10V
3
Forward current transfer ratio hFE
300
TC=100C 25C
1 TC=100C 0.3 25C -25C 0.1
100 -25C 30
25C
10
0.03
3
0.01 0.1
0.3
1
3
10
0.1
0.3
1
3
10
1 0.1
0.3
1
3
10
30
Collector current IC (A)
Collector current IC (A)
Collector current IC (A)
fT -- IC
1000 300 100 30 10 3 1 0.3 0.1 0.01 0.03 0.01 0.1 0.3 1 3 10 0 1 VCE=10V f=1MHz TC=25C 10
ton, tstg, tf -- IC
Area of safe operation (ASO)
100 30 ICP 10ms DC 3 1 0.3 0.1 0.03 0.01 8 1 3 10 30 100 300 1000 Non repetitive pulse TC=25C t=1ms
Transition frequency fT (MHz)
Switching time ton,tstg,tf (s)
3
Collector current IC (A)
10
IC
1
tstg
0.3
ton tf
0.1 Pulsed tw=1ms Duty cycle=1% IC/IB=10 (IB1=-IB2) VCC=50V TC=25C 2 3 4 5 6 7
0.03
Collector current IC (A)
Collector current IC (A)
Collector to emitter voltage VCE (V)
2
Power Transistors
Rth(t) -- t
10000 Note: Rth was measured at Ta=25C and under natural convection. (1) PT=10V x 0.2A (2W) and without heat sink (2) PT=10V x 1.0A (10W) and with a 100 x 100 x 2mm Al heat sink
2SD1964
Thermal resistance Rth(t) (C/W)
1000
100 (1) 10
(2)
1
0.1 10-4
10-3
10-2
10-1
1
10
102
103
104
Time t (s)
3
Request for your special attention and precautions in using the technical information and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuit examples of the products. It does not constitute the warranting of industrial property, the granting of relative rights, or the granting of any license. (3) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (4) The products and product specifications described in this material are subject to change without notice for reasons of modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (5) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, redundant design is recommended, so that such equipment may not violate relevant laws or regulations because of the function of our products. (6) When using products for which dry packing is required, observe the conditions (including shelf life and after-unpacking standby time) agreed upon when specification sheets are individually exchanged. (7) No part of this material may be reprinted or reproduced by any means without written permission from our company.
Please read the following notes before using the datasheets
A. These materials are intended as a reference to assist customers with the selection of Panasonic semiconductor products best suited to their applications. Due to modification or other reasons, any information contained in this material, such as available product types, technical data, and so on, is subject to change without notice. Customers are advised to contact our semiconductor sales office and obtain the latest information before starting precise technical research and/or purchasing activities. B. Panasonic is endeavoring to continually improve the quality and reliability of these materials but there is always the possibility that further rectifications will be required in the future. Therefore, Panasonic will not assume any liability for any damages arising from any errors etc. that may appear in this material. C. These materials are solely intended for a customer's individual use. Therefore, without the prior written approval of Panasonic, any other use such as reproducing, selling, or distributing this material to a third party, via the Internet or in any other way, is prohibited.
2001 MAR


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