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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6544 Issued Date : 1992.11.25 Revised Date : 2002.01.25 Page No. : 1/4 HSD882S NPN EPITAXIAL PLANAR TRANSISTOR Description The HSD882S is suited for the output stage of 0.75W audio, voltage regulator, and relay driver. Absolute Maximum Ratings TO-92 * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 750 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ......................................................................................... 40 V VCEO Collector to Emitter Voltage ...................................................................................... 30 V VEBO Emitter to Base Voltage .............................................................................................. 5 V IC Collector Current............................................................................................................... 3 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) *VBE(sat) *hFE1 *hFE2 fT Cob Min. 40 30 5 30 100 Typ. 90 45 Max. 1 1 0.5 2 500 Unit V V V uA uA V V Test Conditions IC=100uA, IE=0 IC=1mA, IB=0 IE=10uA, IC=0 VCB=30V, IE=0 VEB=3V, IC=0 IC=2A, IB=200mA IC=2A, IB=200mA VCE=2V, IC=20mA VCE=2V, IC=1A VCE=5V, IC=0.1A, f=100MHz VCB=10V, f=1MHz, IE=0 *Pulse Test: Pulse Width 380us, Duty Cycle2% MHz pF Classification of hFE Rank Range Q 100-200 P 160-320 E 250-500 HSD882S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 Spec. No. : HE6544 Issued Date : 1992.11.25 Revised Date : 2002.01.25 Page No. : 2/4 Saturation Voltage & Collector Current 125 C o 75 C o 25 C o Saturation Voltage (mV) 75 C 100 o hFE 100 25 C o hFE @ VCE=2V 10 1 10 100 1000 10000 10 1 125 C VCE(sat) @ IC=10IB o 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 1000 Saturation Voltage & Collector Current Saturation Voltage (mV) 75 C o Saturation Voltage (mV) 75 C o 100 125 C o 100 25 C o 125 C o 25 C o VCE(sat) @ IC=40IB 10 1 10 100 1000 10000 10 1 10 100 VCE(sat) @ IC=20IB 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 10000 100 Capacitance & Reverse-Biased Voltage Saturation Voltage (mV) 75 C 1000 25 C o o Capacitance (pF) Cob 125 C VBE(sat) @ IC=10IB 100 1 10 100 1000 10000 10 0.1 1 10 100 o Collector Current-IC (mA) Reverse-Biased Voltage (V) HSD882S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6544 Issued Date : 1992.11.25 Revised Date : 2002.01.25 Page No. : 3/4 Cutoff Frequency & Collector Current 1000 Safe Operating Area 100 PT=1ms Cutoff Frequency (MHz). . Collector Current (mA) 10 PT=100ms PT=1s 1 0.1 VCE=5V 100 1 10 100 1000 0.01 1 10 100 Collector Curren (mA) Forward Biased Voltage (V) Power Derating 800 700 Power Dissipation-PD (mW) 600 500 400 300 200 100 0 0 50 100 o 150 200 Ambient Temperature-Ta( C) HSD882S HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 1 2 3 Date Code Spec. No. : HE6544 Issued Date : 1992.11.25 Revised Date : 2002.01.25 Page No. : 4/4 2 Marking: H SD 882S Rank Control Code 3 C Style: Pin 1.Emitter 2.Collector 3.Base D H I E F G 1 3-Lead TO-92 Plastic Package HSMC Package Code: A *: Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I 1 2 3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2 Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2 Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HSD882S HSMC Product Specification |
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