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NJL6165R/6165R-1
HIGH SPEED PIN PHOTO DIODE
s GENERAL DESCRIPTION
The NJL6165R/6165R-1 are the PIN photo diode, which attain high speed (fc : 300MHz) and high sensitivity (S : 0.65A/W). It shrinks the outline by COBP(Chip on Board volume compared with lead frame type.
2.5
s OUTLINE (typ.) Unit : mm
NJL6165R
2.5
Active area: 0.7mm square
1.16 0.5 1.0 0.3
0.3 0.7
(2x)R0.3
Package), and attain under half package
Active area
* High speed, high sensitivity * Super miniature, super thin type NJL6165R (2.5mmX4.9mmX1.16mm) NJL6165R-1 (1.8mmX3.6mmX1.16mm)
anode cathode
1.0
NJL6165R-1
Active area: 0.7mm square
s APPLICATIONS
* Laser monitor for CD-R/RW etc. * Reading the signal for optical communication etc.
0.5 0.3
0.3 0.3
(2x)R0.3
1.8
1.16
1.0
Active area
1.8 3.6
1.0
anode cathode
s ABSOLUTE MAXIMUM RATINGS (Ta=25C)
PARAMETER Reverse Voltage Operating Temperature Storage Temperature Reflow Soldering Temperature SYMBOL VR Topr Tstg Tsol RATINGS 35 -30 to +85 -40 to +100 260 (10sec.) UNIT V C C C
s ELECTRO-OPTICAL CHARACTERISTICS (Ta=25C)
PARAMETER Dark Current Forward Voltage Capacitance Peak Wavelength Sensitivity Cut off Frequency SYMBOL ID VF Ct P S fc TEST CONDITION VR=10V IF=1mA VR=2.0V, f=1MHz MIN
-- VR=2.0V, =780nm (note) VR=2.0V, =780nm, RL=50, -3dB
-- -- -- -- 0.50 --
TYP 0.1
-- 4 800 0.65 300
MAX 2.0 1.0
-- -- -- --
UNIT nA V pF nm A/W MHz
(note) in the case of illuminating all over the package
0.95
0.95
1.35
s FEATURES
4.9
1.35
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NJL6165R/6165R-1
s TYPICAL CHARACTERISTICS
Relative Sensitivity vs. Illuminance (Ta=25 C)
1.00E-03
100 90
Spectral Response (Ta=25C)
VR=2.0V, =780nm 1.00E-04
80 70 Relative Sensitivity (%)
Light Current()
1.00E-05
60 50 40 30 20
1.00E-06
1.00E-07
10 0
1.00E-08 0.01
0.1
1 Illuminance(mW/cm2)
10
100
500
600
700
800
900
1000
1100
Wavelength (nm)
Dark Current vs. Temperature
1.00E-08
Relative Sensitivity vs. Temperature
130% 125% VR=2.0V, =780nm
VR=2.0V, =780nm 1.00E-09
120% 115% 110%
1.00E-10
(%) Relative Sensitivity
Dark Current ID(A)
105% 100% 95% 90% 85%
1.00E-11
1.00E-12
80% 75%
1.00E-13 -40
70%
-20
0
20
40
60
80
100
-40
-20
0
20
40
60
80
100
Ambient Temperature Ta( )
Ambient Temperature Ta( )
Rise Time vs. Reverse Voltage (Ta=25C)
5
Fall Time vs. Reverse Voltage (Ta=25C)
5
=780nm, RL=50 4
=780nm, RL=50 4
Rise Time tr (ns)
Fall Timetr (ns)
0 1 2 3 4 5
3
3
2
2
1
1
0 Reverse VoltageVR(V)
0 0 1 2 3 4 5 Reverse VoltageVR(V)
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NJL6165R/6165R-1
Relative Sensitivity vs. Frequency ( Ta=25C)
0
Capacitance vs. Reverse Voltage ( Ta=25C)
7.0
6.5
-1
6.0
-2
Relative Sensitivity (dB) Capasitance Cj (pF) VR=2.0V, =780nm, RL=50 5.5
-3
5.0
4.5
-4
4.0
-5
3.5
-6
3.0
1
10
100
1000
0
1
2
3
4
5
Frequency f(MHz)
Reverse Voltage VR(V)
s MEASURING CIRCUIT FOR RESPONSE TIME
OSCILLOSCOPE Pulse Generator
Input 50 NJL6165R/ NJL6165R-1 Output 90% 10%
Laser
-3-
NJL6165R/6165R-1
PRECAUTION FOR HANDLING
1. Soldering to actual circuit board Soldering condition
- Heated condition of plastic package. Lower than 240 C of maximum surface temperature, less than 30 seconds of time kept higher than 200 C.
Soldering Method
1) Reflow Method Recommended temperature profile of its method. Preparatory heating condition : 120 to 150C about 60 sec. Recommended soldering temperature : 230 to 240C about 3 to 5 sec. Slowly cool down right after soldering. Soldering to be done within twice under this condition. (C) 250 200 150 100 50 0 Time 2) Reflow Method (In case of infrared heating) - Temperature profile : Same to the above - Avoid direct irradiation to the plastic package because it is mold resin, absorbs the Infrared Radiation and its surface temperature will be higher than lead itself. 3) The other method Avoid rapid heating up like dipping the devices directly into the melting solder or vapor phase method ( VPS). If the device is heated to high temperature and kept in its condition for longer time, it would affect to its reliability. It is necessary to solder in short time as soon as possible. Preparatory heating 60 to 120 sec. Less than 30 sec. 3 to 5 sec. 240C max.
2. Cleaning
Avoid washing of the device after soldering by reflow method.
3. Attention in handling
1) Treat not to touch the lens surface. 2) Avoid dust and any other foreign materials (paint, bonding material, etc.) on the lens surface. 3) When mounting, special care has to be taken on the mounting position and tilting of the device because it is very important to place the device to the optimum position to the object.
4. Storage
In order to prevent from degradation of this device in moisturing at reflow method, so that this device is contained in dampproof packaging. So that mount the device as short as possible after opening the envelope.
-4-
NJL6165R/6165R-1
NJL6165R Taping Specification
1. Taping Size
1) Carrier tape is used with Styrene type Carbonated Plastic. 2) Cover tape is used with electro statistically prevention treated Polyester type tape. 3) Product taping direction is to place the index mark against the pull out direction of the tape as in the drawing. Pull out direction of tape
2.0 4.0
1.5
(TE1)
5.5
1.75
0.3
5.4
2.9 4.0 Carrier tape Cover tape 1.5
2. Taping Strength
Pull up the cover tape from the carrier tape, and when the opening angle comes around 10 to 15, and the peeling-off strength is to be within the power of 20 to 70g.
3. Packaging
1) The taped products are to be rolled up on the taping reel as on the drawing. 2) Rolling up specification 2-1) Start Rolling : Carrier tape open space more than 20 Pieces. 2-2) End of Rolling : Carrier tape open space more than 20 Pieces, and 2 round of reel space at the cover tape only. 3) Taping quantity : 2,000 Pieces 4) Seal off after putting each reels in a dampproof bag with silica gel (3 bags).
13 Label
13
12.0
180
60
-5-
NJL6165R/6165R-1 MEMO
[CAUTION] The specifications on this databook are only given for information , without any guarantee as regards either mistakes or omissions. The application circuits in this databook are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial rights.
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