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| Preliminary data BUZ 101SL-4 SIPMOS (R) Power Transistor * Quad-channel * Enhancement mode * Logic level * Avalanche-rated * dv/dt rated Type BUZ 101SL-4 VDS 55 V ID 4.1 A RDS(on) 0.075 Package P-DSO-28 Ordering Code C67078-S. . . .- . . Maximum Ratings Parameter Continuous drain current one channel active Symbol Values 4.1 Unit A ID IDpuls 16.4 TA = 25 C Pulsed drain current one channel active TA = 25 C Avalanche energy, single pulse EAS 90 dv/dt 6 mJ ID = 4.1 A, VDD = 25 V, RGS = 25 L = 10.7 mH, Tj = 25 C Reverse diode dv/dt kV/s IS = 4.1 A, VDS = 40 V, diF/dt = 200 A/s Tjmax = 175 C Gate source voltage Power dissipation ,one channel active VGS Ptot 14 2.4 V W TA = 25 C Operating temperature Storage temperature IEC climatic category, DIN IEC 68-1 Tj Tstg -55 ... + 175 -55 ... + 175 55 / 175 / 56 C Semiconductor Group 1 02/Oct/1997 Preliminary data BUZ 101SL-4 Thermal Characteristics Parameter Symbol min. Thermal resistance, junction - soldering point 1) Thermal resistance, junction - ambient 2) Values typ. max. tbd 62.5 K/W Unit RthJS RthJA - 1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer,70m thick) copper area for Drain connection. PCB is vertical without blown air. 2) one channel active Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 55 1.6 0.1 10 0.06 2 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 1.2 VGS=VDS, ID = 30 A Zero gate voltage drain current IDSS 0.1 1 100 A VDS = 55 V, VGS = 0 V, Tj = -40 C VDS = 55 V, VGS = 0 V, Tj = 25 C VDS = 55 V, VGS = 0 V, Tj = 150 C Gate-source leakage current IGSS 100 nA 0.075 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 5 V, ID = 4.1 A Semiconductor Group 2 02/Oct/1997 Preliminary data BUZ 101SL-4 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 5 560 170 95 - S pF 700 215 120 ns 20 30 VDS 2 * ID * RDS(on)max, ID = 4.1 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 5 V, ID = 4.1 A RG = 9.8 Rise time tr 35 55 VDD = 30 V, VGS = 5 V, ID = 4.1 A RG = 9.8 Turn-off delay time td(off) 40 60 VDD = 30 V, VGS = 5 V, ID = 4.1 A RG = 9.8 Fall time tf 27 1.4 15 24 2.98 40 nC 2.1 22 36 V 3 02/Oct/1997 VDD = 30 V, VGS = 5 V, ID = 4.1 A RG = 9.8 Gate charge at threshold Qg(th) Qg(5) - VDD = 40 V, ID 0.1 A, VGS =0 to 1 V Gate charge at 5.0 V VDD = 40 V, ID = 4.1 A, VGS =0 to 5 V Gate charge total Qg(total) - VDD = 40 V, ID = 4.1 A, VGS =0 to 10 V Gate plateau voltage V(plateau) VDD = 40 V, ID = 4.1 A Semiconductor Group Preliminary data BUZ 101SL-4 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TA = 25 C Inverse diode direct current, pulsed A 0.95 50 80 4.1 16.4 V 1.6 ns 75 nC 120 Values typ. max. Unit ISM VSD trr Qrr TA = 25 C Inverse diode forward voltage VGS = 0 V, IF = 8.2 A Reverse recovery time VR = 30 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 30 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 02/Oct/1997 Preliminary data BUZ 101SL-4 Power dissipation Ptot = (TA) Drain current ID = (TA) parameter: VGS 5 V 4.5 A 2.8 W 2.4 Ptot 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 140 C 180 ID 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 20 40 60 80 100 120 140 C 180 TA TA Semiconductor Group 5 02/Oct/1997 Preliminary data BUZ 101SL-4 Typ. output characteristics ID = (VDS) parameter: tp = 80 s 10 A Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C 0.24 Ptot = 2W l ih kg jf d e VGS [V] a 2.5 b 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0 8.0 10.0 a b ID 8 7 6 5 4 3 2 1 c 0.20 RDS (on) 0.18 0.16 0.14 0.12 0.10 c c d e f g h i j 0.08 0.06 0.04 VGS [V] = d e gf h ki j b k l 0.02 a a 2.5 3.0 b 3.5 c 4.0 d 4.5 e f 5.0 5.5 g 6.0 h i 6.5 7.0 j 8.0 k 10.0 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 V 5.0 0.00 0.0 1.0 2.0 3.0 4.0 5.0 6.0 A 8.0 VDS ID Typ. transfer characteristics ID = f (VGS) parameter: tp = 80 s VDS2 x ID x RDS(on)max 90 A ID 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 V VGS 10 Semiconductor Group 6 02/Oct/1997 Preliminary data BUZ 101SL-4 Drain-source on-resistance RDS (on) = (Tj) parameter: ID = 4.1 A, VGS = 5 V 0.22 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 30 A 4.6 V 4.0 RDS (on) 0.18 0.16 VGS(th) 3.6 3.2 0.14 2.8 0.12 0.10 0.08 0.06 0.04 0.02 0.00 -60 -20 20 60 100 C 180 2.4 98% 2.0 98% typ 1.6 typ 2% 1.2 0.8 0.4 0.0 -60 -20 20 60 100 C 180 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 4 Forward characteristics of reverse diode IF = (VSD) parameter: Tj, tp = 80 s 10 2 pF C 10 3 Ciss A IF 10 1 Coss 10 2 Crss 10 0 Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%) 10 1 0 5 10 15 20 25 30 V 40 VDS 10 -1 0.0 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 02/Oct/1997 Preliminary data BUZ 101SL-4 Avalanche energy EAS = f (Tj) parameter:ID=4.1A,VDD =25 V RGS =25 , L = 10.7mH 100 mJ Typ. gate charge VGS = (QGate) parameter: ID puls = 4 A 16 V EAS 80 70 VGS 12 10 60 50 40 30 4 20 2 10 0 20 0 0 4 8 12 16 20 24 28 nC 34 8 0,2 VDS max 0,8 VDS max 6 40 60 80 100 120 140 C Tj 180 QGate Drain-source breakdown voltage V(BR)DSS = (Tj) 65 V V(BR)DSS 61 59 57 55 53 51 49 -60 -20 20 60 100 C 180 Tj Semiconductor Group 8 02/Oct/1997 |
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