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INDEX
MX27C512
512K-BIT [64Kx8] CMOS EPROM
FEATURES
* * * * *
64K x 8 organization Single +5V power supply +12.5V programming voltage Fast access time: 45/55/70/90/100/120/150ns Totally static operation
* * * *
Completely TTL compatible Operating current: 30mA Standby current: 100uA Package type: - 28 pin ceramic DIP, plastic DIP, plastic SOP - 32 pin PLCC - 28 pin 8 x 13.4 mm TSOP(I)
GENERAL DESCRIPTION
The MX27C512 is a 5V only, 512K-bit, ultraviolet Erasable Programmable Read Only Memory. It is organized as 64K words by 8 bits per word, operates from a single +5volt supply, has a static standby mode, and features fast single address location programming. All programming signals are TTL levels, requiring a single pulse. For programming outside from the system, existing EPROM programmers may be used. The MX27C512 supports intelligent fast programming algorithm which can result in programming time of less than fifteen seconds. This EPROM is packaged in industry standard 28 pin dual-in-line packages 32 lead PLCC, 28 lead SOP , and 28 lead TSOP(I) packages.
PIN CONFIGURATIONS
VCC A12 A15 A14 A13
BLOCK DIAGRAM
PLCC
A7
CE OE/VPP CONTROL LOGIC OUTPUT BUFFERS
CDIP/PDIP/SOP
A15 A12 A7 A6 A5 A4 A3 A2 A1 A0 Q0 Q1 Q2 GND 1 2 3 4 5 6 7 8 9 10 11 12 13 14 28 27 26 25 24 23 22 21 20 19 18 17 16 15 VCC A14 A13 A8 A9 A11 OE/VPP A10 CE Q7 Q6 Q5 Q4 Q3
NC
Q0~Q7
A6 A5 A4 A3 A2 A1 A0 NC Q0
5
4
1
32
30 29
A8 A9 A11 NC
. . . A0~A15 ADDRESS INPUTS . . . . . Y-DECODER . . . . . . . . Y-SELECT
MX27C512
9
MX27C512
25
OE/VPP A10 CE Q7
X-DECODER
512K BIT CELL MAXTRIX
13 14
Q1 Q2 GND
17
NC Q3 Q4
21 20
Q5
Q6
VCC GND
8 x 13.4mm 28TSOP(I)
OE/VPP A11 A9 A8 A13 A14 VCC A15 A12 A7 A6 A5 A4 A3 22 23 24 25 26 27 28 1 2 3 4 5 6 7 21 20 19 18 17 16 15 14 13 12 11 10 9 8 A10 CE Q7 Q6 Q5 Q4 Q3 GND Q2 Q1 Q0 A0 A1 A2
PIN DESCRIPTION
SYMBOL A0~A15 Q0~Q7 CE OE/VPP NC VCC GND PIN NAME Address Input Data Input/Output Chip Enable Input Output Enable Input/Program Supply Voltage No Internal Connection Power Supply Pin (+5V) Ground Pin
MX27C512
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MX27C512
FUNCTIONAL DESCRIPTION
THE ERASURE OF THE MX27C512 The MX27C512 is erased by exposing the chip to an ultraviolet light source. A dosage of 15 W seconds/cm2 is required to completely erase a MX27C512. This dosage can be obtained by exposure to an ultraviolet lamp - wavelength of 2537 Angstroms (A) - with intensity of 12,000 uW/cm2 for 15 to 20 minutes. The MX27C512 should be directly under and about one inch from the source and all filters should be removed from the UV light source prior to erasure. It is important to note that the MX27C512, and similar devices, will be cleared for all bits of their programmed states with light sources having wavelengths shorter than 4000 A. Although erasure times will be much longer than that with UV sources at 2537 A, nevertheless the exposure to fluorescent light and sunlight will eventually erase the MX27C512 and exposure to them should be prevented to realize maximum system reliability. If used in such an environment, the package window should be covered by an opaque label or substance. THE PROGRAMMING OF THE MX27C512 When the MX27C512 is delivered, or it is erased, the chip has all 512K bits in the "ONE" or HIGH state. "ZEROs" are loaded into the MX27C512 through the procedure of programming. For programming, the data to be programmed is applied with 8 bits in parallel to the data pins. Vcc must be applied simultaneously or before Vpp, and removed simultaneously or after Vpp. When programming an MXIC EPROM, a 0.1uF capacitor is required across Vpp and ground to suppress spurious voltage transients which may damage the device. FAST PROGRAMMING The device is set up in the fast programming mode when the programming voltage OE/VPP = 12.75V is applied, with VCC = 6.25 V, (Algorithm is shown in Figure 1). The programming is achieved by applying a single TTL low level 100us pulse to the CE input after addresses and data line are stable. If the data is not verified, an additional pulse is applied for a maximum of 25 pulses. This process is repeated while sequencing through each address of the device. When the programming mode is completed, the data in all address is verified at VCC = 5V 10%. PROGRAM INHIBIT MODE Programming of multiple MX27C512s in parallel with different data is also easily accomplished by using the Program Inhibit Mode. Except for CE and OE, all like inputs of the parallel MX27C512 may be common. A TTL low-level program pulse applied to an MX27C512 CE input with OE/VPP = 12.5 0.5V will program that MX27C512. A high-level CE input inhibits the other MX27C512s from being programmed. PROGRAM VERIFY MODE Verification should be performed on the programmed bits to determine that they were correctly programmed. The verification should be performed with OE/VPP and CE, at VIL. Data should be verified tDV after the falling edge of CE. AUTO IDENTIFY MODE The auto identify mode allows the reading out of a binary code from an EPROM that will identify its manufacturer and device type. This mode is intended for use by programming equipment for the purpose of automatically matching the device to be programmed with its corresponding programming algorithm. This mode is functional in the 25 5C ambient temperature range C that is required when programming the MX27C512. To activate this mode, the programming equipment must force 12.0 0.5(VH) on address line A9 of the device. Two identifier bytes may then be sequenced from the device outputs by toggling address line A0 from VIL to VIH. All other address lines must be held at VIL during auto identify mode. Byte 0 ( A0 = VIL) represents the manufacturer code, and byte 1 (A0 = VIH), the device identifier code. For the MX27C512, these two identifier bytes are given in the Mode Select Table. All identifiers for manufacturer and device codes will possess odd parity, with the MSB (Q7) defined as the parity bit. READ MODE The MX27C512 has two control functions, both of which must be logically satisfied in order to obtain data at the outputs. Chip Enable (CE) is the power control and should be used for device selection. Output Enable (OE) is the output control and should be used to gate data to the output pins, independent of device selection. Assuming
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MX27C512
that addresses are stable, address access time (tACC) is equal to the delay from CE to output (tCE). Data is available at the outputs tOE after the falling edge of OE, assuming that CE has been LOW and addresses have been stable for at least tACC - tOE. STANDBY MODE The MX27C512 has a CMOS standby mode which reduces the maximum VCC current to 100uA . It is placed in CMOS standby when CE is at VCC 0.3 V. The MX27C512 also has a TTL-standby mode which reduces the maximum VCC current to 1.5 mA. It is placed in TTLstandby when CE is at VIH. When in standby mode, the outputs are in a high-impedance state, independent of the OE input. TWO-LINE OUTPUT CONTROL FUNCTION To accommodate multiple memory connections, a twoline control function is provided to allow for: 1. Low memory power dissipation, 2. Assurance that output bus contention will not occur. It is recommended that CE be decoded and used as the primary device-selecting function, while OE be made a common connection to all devices in the array and connected to the READ line from the system control bus. This assures that all deselected memory devices are in their low-power standby mode and that the output pins are only active when data is desired from a particular memory device. SYSTEM CONSIDERATIONS During the switch between active and standby conditions, transient current peaks are produced on the rising and falling edges of Chip Enable. The magnitude of these transient current peaks is dependent on the output capacitance loading of the device. At a minimum, a 0.1 uF ceramic capacitor (high frequency, low inherent inductance) should be used on each device between VCC and GND to minimize transient effects. In addition, to overcome the voltage drop caused by the inductive effects of the printed circuit board traces on EPROM arrays, a 4.7 uF bulk electrolytic capacitor should be used between VCC and GND for each eight devices. The location of the capacitor should be close to where the power supply is connected to the array.
MODE SELECT TABLE
PINS MODE Read Output Disable Standby (TTL) Standby (CMOS) Program Program Verify Program Inhibit Manufacturer Code(3) Device Code(3) CE VIL VIL VIH VCC0.3V VIL VIL VIH VIL VIL OE/VPP VIL VIH X X VPP VIL VPP VIL VIL A0 X X X X X X X VIL VIH A9 X X X X X X X VH VH OUTPUTS DOUT High Z High Z High Z DIN DOUT High Z C2H 91H
NOTES: 1. VH = 12.0 V 0.5 V 2. X = Either VIH or VIL
3. A1 - A8 = A10 - A15 = VIL(For auto select) 4. See DC Programming Characteristics for VPP voltage during programming.
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MX27C512
Figure1. FAST PROGRAMMING FLOW CHART
START
ADDRESS = FIRST LOCATION
VCC = 6.25V OE/VPP = 12.75V
PROGRAM ONE 100us PULSE
NO INCREMENT ADDRESS
LAST ADDRESS ?
YES
ADDRESS = FIRST LOCATION
INCREMENT ADDRESS NO
LAST ADDRESS ?
X=0
PASS
VERIFY BYTE
FAIL
INCREMENT X
YES NO
PROGRAM ONE 100us PULSE X = 25 ?
VCC = 5.25V OE/VPP = VIL
YES
COMPARE ALL BYTES TO ORIGINAL DATA
FAIL
DEVICE FAILED
PASS
DEVICE PASSED
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MX27C512
SWITCHING TEST CIRCUITS
DEVICE UNDER TEST
1.8K ohm +5V
CL 6.2K ohm
DIODES = IN3064 OR EQUIVALENT
CL = 100 pF including jig capacitance (30pF for 45/55/70 ns parts)
SWITCHING TEST WAVEFORMS
2.0V
AC driving levels
2.0V TEST POINTS 0.8V OUTPUT
0.8V INPUT
AC TESTING: AC driving levels are 2.4V/0.4V for commercial grade, 3.0V/0V for industrial grade. Input pulse rise and fall times are < 10ns.
AC driving levels
1.5V
TEST POINTS OUTPUT
1.5V
INPUT
AC TESTING: (1) AC driving levels are 3.0V/0V for both commercial grade and industrial grade. Input pulse rise and fall times are < 10ns. (2) For MX27C1000-45, MX27C1000/1001-55, MX27C1000/1001-70.
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MX27C512
ABSOLUTE MAXIMUM RATINGS
RATING Ambient Operating Temperature Storage Temperature Applied Input Voltage Applied Output Voltage VCC to Ground Potential A9 & Vpp VALUE -40oC to 85oC -65oC to 125oC -0.5V to 7.0V -0.5V to VCC + 0.5V -0.5V to 7.0V -0.5V to 13.5V
NOTICE: Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended period may affect reliability. NOTICE: Specifications contained within the following tables are subject to change.
DC/AC Operating Conditions for Read Operation
MX27C512 -45 Operating Temperature Commercial 0C to 55 C Industrial -55 0C to 70 C -70 0C to 70 C -90 0 to 70C C -10 0C to 70 C -12 0 to 70C C -15 0C to 70 C
-40C to 85 -40C to 85C -40C to 85C -40 to 85C -40C to 85C -40 to 85C -40C to 85C C C C 5V 5% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10% 5V 10%
Vcc Power Supply
DC CHARACTERISTICS
SYMBOL VOH VOL VIH VIL ILI ILO ICC3 ICC2 ICC1 IPP PARAMETER Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current Output Leakage Current VCC Power-Down Current VCC Standby Current VCC Active Current VPP Supply Current Read 2.0 -0.2 -10 -10 MIN. 2.4 0.4 VCC + 0.5 0.8 10 10 100 1.5 30 10 MAX. UNIT V V V V uA uA uA mA mA uA VIN = 0 to 5.5V VOUT = 0 to 5.5V CE = VCC 0.3V CE = VIH CE = VIL, f=5MHz, Iout = 0mA CE = VIL, VPP = 5.5V CONDITIONS IOH = -0.4mA IOL = 2.1mA
CAPACITANCE TA = 25oC, f = 1.0 MHz (Sampled only)
SYMBOL CIN COUT Vpp PARAMETER Input Capacitance Output Capacitance VPP Capacitance MIN. 8 8 18 MAX. 12 12 25 UNIT pF pF pF CONDITIONS VIN = 0V VOUT = 0V VPP = 0V
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MX27C512
AC CHARACTERISTICS
27C512-45 SYMBOL PARAMETER tACC tCE tOE tDF tOH Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay OE High to Output Float, or CE High to Output Float Output Hold from Address, CE or OE which ever occurred first 0 0 MIN. MAX. 45 45 25 17 0 0 27C512-55 MIN. MAX. 55 55 30 20 0 0 27C512-70 MIN. MAX. 70 70 35 20 0 0 27C512-90 MIN. MAX. 90 90 40 25 UNIT ns ns ns ns ns CONDITIONS CE = OE = VIL OE = VIL CE = VIL
27C512-10 SYMBOL tACC tCE tOE tDF tOH PARAMETER Address to Output Delay Chip Enable to Output Delay Output Enable to Output Delay OE High to Output Float, or CE High to Output Float Output Hold from Address, CE or OE which ever occurred first 0 0 MIN. MAX. 100 100 45 30 0 0
27C512-12 MIN. MAX. 120 120 50 35 0 0
27C512-15 MIN. MAX. 150 150 65 50 UNIT ns ns ns ns ns CONDITIONS CE = OE = VIL OE = VIL CE = VIL
DC PROGRAMMING CHARACTERISTICS TA = 25oC 5C
SYMBOL VOH VOL VIH VIL ILI VH ICC3 IPP2 VCC1 VPP1 PARAMETER Output High Voltage Output Low Voltage Input High Voltage Input Low Voltage Input Leakage Current A9 Auto Select Voltage VCC Supply Current(Program & Verify) VPP Supply Current(Program) Fast Programming Supply Voltage Fast Programming Voltage 6.00 12.5 2.0 -0.2 -10 11.5 MIN. 2.4 0.4 VCC + 0.5 0.8 10 12.5 40 30 6.50 13.0 MAX. UNIT V V V V uA V mA mA V V CE = VIL VIN = 0 to 5.5V CONDITIONS IOH = -0.40mA IOL = 2.1mA
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MX27C512
AC PROGRAMMING CHARACTERISTICS TA = 25oC 5C
SYMBOL tAS tDS tAH tDH tDFP tVPS tPW tVCS tDV tOEH tVR PARAMETER Address Setup Time Data Setup Time Address Hold Time Data Hold Time Chip Enable to Output Float Delay VPP Setup Time CE Program Pulse Width Vcc Setup Time Data Valid from CE OE/VPP Hold Time OE/VPP Recovery Time 2 2 MIN. 2 2 0 2 0 2 95 2 150 105 130 MAX. UNIT us us us us ns us us us ns ns ns CONDITIONS
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MX27C512
WAVEFORMS
READ CYCLE ADDRESS INPUTS
tACC
DATA ADDRESS
CE
tCE
OE
tDF
DATA OUT
tOE
VALID DATA
tOH
FAST PROGRAMMING ALGORITHM WAVEFORM
PROGRAM VIH
PROGRAM VERIFY
Addresses
VIL
tAS
Hi-z DATA OUT VALID
tDV
DATA
tDS VPP1 tDH
tDFP
OE/VPP
VIL tVPS VIH tPW tVPS tVR tAH
CE
VIL
tVCS VCC1
VCC
VCC
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MX27C512
ORDERING INFORMATION
CERAMIC PACKAGE
PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) MX27C512DC-45 MX27C512DC-55 MX27C512DI-45 MX27C512DI-55 45 55 45 55 30 30 30 30 STANDBY CURRENT MAX.(uA) 100 100 100 100 OPERATING TEMPERATURE 0C to 70 C 0C to 70 C -40C to 85C -40C to 85C 28 Pin DIP 28 Pin DIP 28 Pin DIP 28 Pin DIP PACKAGE
PLASTIC PACKAGE
PART NO. ACCESS TIME(ns) OPERATING CURRENT MAX.(mA) MX27C512MC-45 MX27C512PC-45 MX27C512QC-45 MX27C512TC-45 MX27C512MC-55 MX27C512PC-55 MX27C512QC-55 MX27C512TC-55 MX27C512MC-70 MX27C512PC-70 MX27C512QC-70 MX27C512TC-70 MX27C512MC-90 MX27C512PC-90 MX27C512QC-90 MX27C512TC-90 MX27C512MC-12 MX27C512PC-12 MX27C512QC-12 MX27C512TC-12 MX27C512MC-15 MX27C512PC-15 MX27C512QC-15 MX27C512TC-15 MX27C512MI-45 MX27C512PI-45 MX27C512QI-45 MX27C512TI-45 45 45 45 45 55 55 55 55 70 70 70 70 90 90 90 90 120 120 120 120 150 150 150 150 45 45 45 45 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 STANDBY CURRENT MAX.(uA) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 OPERATING TEMPERATURE 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C 0C to 70C -40C to 85C -40C to 85C -40C to 85C -40C to 85C 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 PinTSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 PinTSOP(I) PACKAGE
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MX27C512
MX27C512MI-55 MX27C512PI-55 MX27C512QI-55 MX27C512TI-55 MX27C512MI-70 MX27C512PI-70 MX27C512QI-70 MX27C512TI-70 MX27C512MI-90 MX27C512PI-90 MX27C512QI-90 MX27C512TI-90 MX27C512MI-12 MX27C512PI-12 MX27C512QI-12 MX27C512TI-12 MX27C512MI-15 MX27C512PI-15 MX27C512QI-15 MX27C512TI-15 55 55 55 55 70 70 70 70 90 90 90 90 120 120 120 120 150 150 150 150 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 30 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C -40 to 85 C C 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I) 28 Pin SOP 28 Pin DIP 32 Pin PLCC 28 Pin TSOP(I)
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MX27C512
PACKAGE INFORMATION
28-PIN CERDIP(MSI) WITH WINDOW (600 mil)
ITEM A B C D E F G H I J K L M N
NOTE:
MILLIMETERS 37.69 max 1.85 .30 2.54 [TP] .46 .05 33.02 1.40 .05 3.43 .38 .96 .43 4.87 15.48 .13 13.38 .38 .25 .13 0 ~ 15 o7.11
INCHES 1.485 max .073 .012 .100 [TP] .018 .002 1.300 .055 .002 .135 .015 .038 .017 .198 .610 .005 .527 .015 .010 .005 0 ~ 15 o.280
E F D C B L H I G 1 A 14 J K 28 N 15
M
Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition.
28-PIN PLASTIC DIP (600 mil)
ITEM A B C D E F G H I J K L M
NOTE:
MILLIMETERS 37.34 max 2.03 [REF] 2.54 [TP] .46 [Typ.] 32.99 1.52 [Typ.] 3.30 .25 .51 [REF] 3.94 .25 5.33 max. 15.22 .25 13.84 .25 .25 [Typ.]
INCHES 1.470 max .080 [REF] .100 [TP] .018 [Typ.] 1.300 .060 [Typ.] .130 .010 .020 [REF] .155 .010 .210 max. .600 .010 .545 .010 .010 [Typ.]
28
15
1 A
14 K L
I H F D E
J G
C
Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition.
B
M
0~15
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MX27C512
PACKAGE INFORMATION
32-PIN PLASTIC LEADED CHIP CARRIER (PLCC)
A B 1
ITEM A B C D E F G H I J K L M N
NOTE:
MILLIMETERS 12.44 .13 11.50 .13 14.04 .13 14.98 .13 1.93 3.30 .25 2.03 .13 .51 .13 1.27 [Typ.] .71[REF] .46 [REF] 10.40/12.94 (W) (L) .89 R .25 (TYP.)
INCHES .490 .005 .453 .005 .553 .005 .590 .005 .076 .130 .010 .080 .005 .020 .005 .050 [Typ.] .028[REF] .018 [REF] .410/.510 (W) (L) .035 R .010 (TYP.)
F G H 13 9 5
4
32
30 29
25
C
D
21 14 20 E N M K L J
17
Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition.
I
28-PIN PLASTIC SOP(330 mil)
28
15
ITEM A B C D E F G H I J K L
NOTE:
MILLIMETERS 18.11 max. 1.194 max 1.27 [TP] .41 [Typ.] .10 min. 2.84 max. 2.49 .13 11.81 .31 8.41 .13 1.70 .20 .25 [Typ.] .762
INCHES .713 max. .047 max .050 [TP] .016 [Typ.] .004 min. .112 max. .098 .005 .465 .012 .331 .005 .067 .008 .010 [Typ.] .03
D C B E L G F K 1 A 14
H I J
Each lead centerline is located within .25 mm[.01 inch] of its true position [TP] at maximum material condition.
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MX27C512
8 x 13.4mm 28-PIN PLASTIC TSOP
ITEM A B C D F H I J K L M N
MILLIMETERS 13.4 .2 11.8 .1 8.0 .1 .15 .01 .2 .03 .55 [Typ.] .425 [Typ.] .05 [Min.] 1.00 .05 1.25 [Max.] .05 .20 O ~ 5
A B
C
N M
K D E F G H I J
L
NOTE: Each lead centerline is located within .25 mm of its true position [TP] at maximum material condition.
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MX27C512
Revision History
Revision # 3.3 4.0 Description Programming Flow Chart corrected, programming verify after whole array programmed with 1 pulse. 1) Reduce operating current change from 40mA to 30mA. 2) Add 28-TSOP(I) and 28-SOP packages offering. 3) Eliminate Interactive Programming Mode. IPP 100uA --> 10uA CDIP 70/90/100/120/150ns speed grades deleted from ordering information. Date
4.1 4.2
08/07/1997 05/07/1998
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MX27L512
MACRONIX INTERNATIONAL CO., LTD.
HEADQUARTERS:
TEL:+886-3-578-8888 FAX:+886-3-578-8887
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TEL:+32-2-456-8020 FAX:+32-2-456-8021
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TEL:+1-408-453-8088 FAX:+1-408-453-8488
CHICAGO OFFICE:
TEL:+1-847-963-1900 FAX:+1-847-963-1909
http : //www.macronix.com
MACRONIX INTERNATIONAL CO., LTD. reserves the rignt to change product and specifications without notice.
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