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FEATURES Single 5 V Power Supply Meets All EIA-232-E and V.28 Specifications 120 kB/s Data Rate On-Board DC-DC Converters 9 V Output Swing with 5 V Supply Small 1 F Capacitors Low Power Shutdown 1 A Receivers Active in Shutdown (ADM223) 30 V Receiver Input Levels Latch-Up FREE Plug-In Upgrade for MAX223/230-241 Plug-In Upgrade for AD230-AD241 APPLICATIONS Computers Peripherals Modems Printers Instruments GENERAL DESCRIPTION
5 V Powered CMOS RS-232 Drivers/Receivers ADM223/ADM230L-ADM241L
ADM232L TYPICAL OPERATING CIRCUIT
5V INPUT C1+ C1- C2+ C2- +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER VCC V+ 1F 6.3V 1F 6.3V 1F 6.3V
1F 16V
V-
1F 16V T1OUT T2OUT R1IN R2IN RS-232 INPUTS** RS-232 OUTPUTS
TTL/CMOS INPUTS*
T1IN T2IN R1OUT R2OUT GND
T1 T2 R1 R2
TTL/CMOS OUTPUTS
ADM232L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
The ADM2xx family of line drivers/receivers is intended for all EIA-232-E and V.28 communications interfaces, especially in applications where 12 V is not available. The ADM223, ADM230L, ADM235L, ADM236L and ADM241L feature a low power shutdown mode that reduces power dissipation to less than 5 W, making them ideally suited for battery powered equipment. Two receivers remain enabled during shutdown on the ADM223. The ADM233L and ADM235L do not require any external components and are particularly useful in applications where printed circuit board space is critical.
All members of the ADM230L family, except the ADM231L and the ADM239L, include two internal charge pump voltage converters that allow operation from a single 5 V supply. These converters convert the 5 V input power to the 10 V required for RS-232 output levels. The ADM231L and ADM239L are designed to operate from 5 V and 12 V supplies. An internal +12 V to -12 V charge pump voltage converter generates the -12 V supply. The ADM2xxL is an enhanced upgrade for the AD2xx family featuring lower power consumption, faster slew rate and operation with smaller (1 F) capacitors.
Table I. Selection Table
Part Number ADM223 ADM230L ADM231L ADM232L ADM233L ADM234L ADM235L ADM236L ADM237L ADM238L ADM239L ADM241L REV. B
Power Supply Voltage 5V 5V 5 V and 7.5 V to 13.2 V 5V 5V 5V 5V 5V 5V 5V 5 V and 7.5 V to 13.2 V 5V
No. of RS-232 Drivers 4 5 2 2 2 4 5 4 5 4 3 4
No. of RS-232 Receivers 5 0 2 2 2 0 5 3 3 4 5 5
External Capacitors 4 4 2 4 None 4 None 4 4 4 2 4
Low Power Shutdown (SD) Yes (SD) Yes No No No No Yes Yes No No No Yes
TTL Three-State EN Yes (EN) No No No No No Yes Yes No No Yes Yes
No. of Pins 28 20 14 16 20 16 24 24 24 24 24 28
Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 (c) Analog Devices, Inc., 2001
= 5 V 10% (ADM223, ADM231L, ADM232L, ADM234L, ADM236L, ADM238L, ADM239L, ADM241L); VCC = 5 V 5% (ADM230L, ADM233L, ADM235L, ADM237L); V+ = 7.5 V to 13.2 V (ADM231L and ADM239L); C1-C4 = 1.0 F Ceramic. All Specifications TMIN to TMAX unless otherwise noted.)
CC
ADM223/ADM230L-ADM241L-SPECIFICATIONS (V
Min 5 Typ 9 2.5 3.5 1.5 1 12 -30 0.8 3 3.5 0.05 250 50 0.3 8 300 10 1.2 1.6 0.25 5 Max Unit Volts 6.0 mA 13 mA 4 mA 10 A 0.8 V V 25 A +30 V V 2.4 V V 7 k 0.4 V V 10 A ns ns s V/s mA
Parameter Output Voltage Swing VCC Power Supply Current V+ Power Supply Current Shutdown Supply Current Input Logic Threshold Low, VINL Input Logic Threshold High, VINH Logic Pull-Up Current RS-232 Input Voltage Range1 RS-232 Input Threshold Low RS-232 Input Threshold High RS-232 Input Hysteresis RS-232 Input Resistance TTL/CMOS Output Voltage Low, VOL TTL/CMOS Output Voltage High, VOH TTL/CMOS Output Leakage Current Output Enable Time (TEN) Output Disable Time (TDIS) Propagation Delay Transition Region Slew Rate Output Resistance RS-232 Output Short Circuit Current
NOTES 1 Guaranteed by design. Specifications subject to change without notice.
Test Conditions/Comments All Transmitter Outputs Loaded with 3 k to Ground No Load, (ADM232L only) No Load No Load, V+ = 12 V ADM231L and ADM239L Only TIN, EN, SD, EN, SD TIN, EN, SD, EN, SD TIN = 0 V
2.4
TA = 0C to 85C IOUT = -1.0 mA EN = VCC, 0 V ROUT VCC ADM223, ADM235L, ADM236L, ADM239L, ADM241L (Figure 25. CL = 150 pF) ADM223, ADM235L, ADM236L, ADM239L, ADM241L (Figure 25. RL = 1 k) RS-232 to TTL RL = 3 k, CL = 2500 pF Measured from +3 V to -3 V or -3 V to +3 V VCC = V+ = V- = 0 V, VOUT = 2 V
ABSOLUTE MAXIMUM RATINGS*
(TA = 25C unless otherwise noted)
VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to +6 V V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . (VCC - 0.3 V) to +14 V V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to -14 V Input Voltages TIN . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to (VCC + 0.3 V) RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V Output Voltages TOUT . . . . . . . . . . . . . . . . . . (V+, + 0.3 V) to (V-, - 0.3 V) ROUT . . . . . . . . . . . . . . . . . . . . . . . -0.3 V to (VCC + 0.3 V) Short Circuit Duration TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Power Dissipation N-14 DIP (Derate 10 mW/C above 70C) . . . . . . 800 mW N-16 DIP (Derate 10.5 mW/C above 70C) . . . . . 840 mW N-20 DIP (Derate 11 mW/C above 70C) . . . . . . 890 mW N-24 DIP (Derate 13.5 mW/C above 70C) . . . . 1000 mW N-24A DIP (Derate 13.5 mW/C above 70C) . . . 500 mW R-16 SOIC (Derate 9 mW/C above 70C) . . . . . . 760 mW R-20 SOIC (Derate 9.5 mW/C above 70C) . . . . 800 mW R-24 SOIC (Derate 12 mW/C above 70C) . . . . . 850 mW R-28 SOIC (Derate 12.5 mW/C above 70C) . . . 900 mW RS-28 SSOP (Derate 10 mW/C above 70C) . . . . 900 mW Q-14 Cerdip (Derate 10 mW/C above 70C) . . . . 720 mW Q-16 Cerdip (Derate 10 mW/C above 70C) . . . . 800 mW Q-20 Cerdip (Derate 11.2 mW/C above 70C) . . . . 890 mW Q-24 Cerdip (Derate 12.5 mW/C above 70C) . . . 1000 mW D-24 Ceramic (Derate 20 mW/C above 70C) . . 1000 mW
Thermal Impedance, JA N-14 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 140C/W N-16 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 135C/W N-20 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125C/W N-24 DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120C/W N-24A DIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110C/W R-16 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105C/W R-20 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105C/W R-24 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85C/W R-28 SOIC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 80C/W RS-28 SSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100C/W Q-14 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105C/W Q-16 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100C/W Q-20 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100C/W Q-24 Cerdip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55C/W D-24 Ceramic . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50C/W Operating Temperature Range Commercial (J Version) . . . . . . . . . . . . . . . . . . . . 0 to 70C Industrial (A Version) . . . . . . . . . . . . . . . -40C to +85C Storage Temperature Range . . . . . . . . . . . . -65C to +150C Lead Temperature, Soldering . . . . . . . . . . . . . . . . . . . 300C Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220C
*This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability.
-2-
REV. B
ADM223/ADM230L-ADM241L
ORDERING GUIDE
Model ADM223 ADM223AR ADM223ARS Temperature Range -40C to +85C -40C to +85C Package Option* R-28 RS-28 Model ADM230L ADM230LJN ADM230LJR ADM230LAN ADM230LAR ADM230LAQ ADM233L ADM233LJN ADM233LAN Temperature Range 0C to 70C 0C to 70C -40C to +85C -40C to +85C -40C to +85C 0C to 70C -40C to +85C Package Option* N-20 R-20 N-20 R-20 Q-20 N-20 N-20 Model ADM231L ADM231LJN ADM231LJR ADM231LAN ADM231LAR ADM231LAQ ADM234L ADM234LJN ADM234LJR ADM234LAN ADM234LAR ADM234LAQ ADM237L ADM237LJN ADM237LJR ADM237LAN ADM237LAR ADM237LAQ ADM241L ADM241LJR ADM241LAR ADM241LJRS ADM241LARS Temperature Range 0C to 70C 0C to 70C -40C to +85C -40C to +85C -40C to +85C 0C to 70C 0C to 70C -40C to +85C -40C to +85C -40C to +85C 0C to 70C 0C to 70C -40C to +85C -40C to +85C -40C to +85C 0C to 70C -40C to +85C 0C to 70C -40C to +85C Package Option* N-14 R-16 N-14 R-16 Q-14 N-16 R-16 N-16 R-16 Q-16 N-24 R-24 N-24 R-24 Q-24 R-28 R-28 RS-28 RS-28
ADM232L ADM232LJN ADM232LJR ADM232LAN ADM232LAR ADM232LAQ
0C to 70C 0C to 70C -40C to +85C -40C to +85C -40C to +85C
N-16 R-16 N-16 R-16 Q-16 N-24A N-24A D-24
ADM235L ADM235LJN 0C to 70C ADM235LAN -40C to +85C ADM235LAQ -40C to +85C
ADM236L ADM236LJN ADM236LJR ADM236LAN ADM236LAR ADM236LAQ ADM239L ADM239LJN ADM239LJR ADM239LAN ADM239LAR ADM239LAQ
0C to 70C 0C to 70C -40C to +85C -40C to +85C -40C to +85C 0C to 70C 0C to 70C -40C to +85C -40C to +85C -40C to +85C
N-24 R-24 N-24 R-24 Q-24 N-24 R-24 N-24 R-24 Q-24
ADM238L ADM238LJN ADM238LJR ADM238LAN ADM238LAR ADM238LAQ
0C to 70C 0C to 70C -40C to +85C -40C to +85C -40C to +85C
N-24 R-24 N-24 R-24 Q-24
*D = Ceramic DIP; N = Plastic DIP; Q = Cerdip; R = Small Outline IC (SOIC); RS = Small Shrink Outline Package (SSOP).
CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADM223/ADM230L-ADM241L features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
REV. B
-3-
ADM223/ADM230L-ADM241L
5V INPUT VCC V+ 1F 6.3V C1+ C1- C2+ C2- +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER 1F 6.3V 1F 6.3V
T3OUT T1OUT T2OUT T2IN T1IN GND VCC C1+ V+ C1-
1 2 3 4 5 6 7 8 9 10 NC = NO CONNECT
20 T4OUT 19 T5IN 18 NC 17 SD
1F 16V
V- 1F 16V T1OUT T2OUT T3OUT T4OUT T5OUT SD RS-232 OUTPUTS
T1IN T2IN TTL/CMOS INPUTS* T3IN T4IN T5IN NC GND
T1
ADM230L
TOP VIEW (Not to Scale)
16 T5OUT 15 T4IN 14 T3IN
T2
T3
13 V- 12 C2- 11 C2+
T4
T5
ADM230L
* INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
Figure 1. ADM230L DIP/SOIC Pin Configuration
Figure 2. ADM230L Typical Operating Circuit
DIP
C1+ C1- V- T2OUT R2IN R2OUT T2IN 1 2 3 4 5 6 7 14 V+ 13 VCC
ADM231L
TOP VIEW (Not to Scale)
12 GND 11 T1OUT
5V INPUT 1F
10 R1IN 9 8 R1OUT T1IN
VCC 1F 16V C1+ C1- +12V TO -12V VOLTAGE INVERTER
V+ V-
7.5V TO 13.2V
SOIC
T1IN T1
1F 16V T1OUT RS-232 OUTPUTS
C1+ C1- V- T2OUT R2IN R2OUT T2IN NC
1 2 3 4 5 6 7 8 NC = NO CONNECT
16 15 14
V+ VCC GND
TTL/CMOS INPUTS* T2IN R1OUT T2 T2OUT R1 R1IN
ADM231L
TOP VIEW (Not to Scale)
13 12
T1OUT R1IN
TTL/CMOS OUTPUTS R2OUT GND R2 R2IN
RS-232 INPUTS**
11 R1OUT 10 9 T1IN NC
ADM231L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 3. ADM231L DIP and SOIC Pin Configurations
Figure 4. ADM231L Typical Operating Circuit (DIP Pinout)
-4-
REV. B
ADM223/ADM230L-ADM241L
5V INPUT C1+ C1- C2+ C2- VCC V+ 1F 6.3V +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER 1F 6.3V 1F 6.3V
1F 16V
C1+ V+ C1- C2+ C2- V- T2OUT R2IN 1 2 3 4 5 6 7 8 16 VCC
V- 1F 16V T1OUT RS-232 OUTPUTS T2OUT R1IN RS-232 INPUTS** R2IN
15 GND 14 T1OUT
T1IN TTL/CMOS INPUTS* T2IN R1OUT TTL/CMOS OUTPUTS R2OUT
T1
ADM232L
TOP VIEW (Not to Scale)
T2
13 R1IN 12 R1OUT 11 T1IN 10 9 T2IN R2OUT
R1
R2 GND
ADM232L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 5. ADM232L DIP/SOIC Pin Configuration
Figure 6. ADM232L Typical Operating Circuit
5V INPUT
VCC T1IN TTL/CMOS INPUTS*
T2IN T1IN R1OUT R1IN T1OUT GND VCC C1+ GND C2- 1 2 3 4 5 6 7 8 9 10 20 R2OUT 19 R2IN 18 T2OUT 17 V-
T1
T1OUT RS-232 OUTPUTS T2OUT R1IN RS-232 INPUTS** R2IN C2+ C2+
T2IN R1OUT TTL/CMOS OUTPUTS R2OUT DO NOT MAKE CONNECTIONS TO THESE PINS INTERNAL -10V POWER SUPPLY INTERNAL +10V POWER SUPPLY C1+ C1-
T2
R1
R2
ADM233L
TOP VIEW (Not to Scale)
16 C2- 15 C2+ 14 V+
ADM233L
V- V- V+ GND GND C2- C2-
13 C1- 12 V- 11 C2+
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 7. ADM233L DIP Pin Configuration
Figure 8. ADM233L Typical Operating Circuit
REV. B
-5-
ADM223/ADM230L-ADM241L
5V INPUT VCC V+ 1F 6.3V
1F 6.3V
C1+ C1- C2+ C2-
+5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER
1F 6.3V
T1OUT T2OUT T2IN T1IN GND VCC C1+ V+
1 2 3 4 5 6 7 8
16 15 14
T3OUT T4OUT T4IN T3IN V- C2- C2+ C1-
1F 16V
V- 1F 16V T1OUT T2OUT RS-232 OUTPUTS
T1IN T2IN TTL/CMOS INPUTS* T3IN T4IN GND
T1
ADM234L
TOP VIEW (Not to Scale)
13 12 11 10 9
T2
T3
T3OUT T4OUT
T4
ADM234L
* INTERNAL 400k
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
Figure 9. ADM234L DIP/SOIC Pin Configuration
Figure 10. ADM234L Typical Operating Circuit
5V INPUT 1F
T1IN T2IN
VCC T1
T1OUT T2OUT T3OUT T4OUT T5OUT R1IN R2IN R3IN R4IN R5IN SD RS-232 INPUTS** RS-232 OUTPUTS
T2
T4OUT T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN R1OUT
1 2 3 4 5 6 7 8 9
24
R3IN
23 R3OUT 22 T5IN
TTL/CMOS INPUTS*
T3IN T4IN T5IN R1OUT R2OUT
T3
T4
21 SD 20 EN
T5
ADM235L
TOP VIEW (Not to Scale)
19
T5OUT
R1
18 R4IN 17 16 15 14 13 R4OUT T4IN T3IN R5OUT R5IN
TTL/CMOS OUTPUTS
R2
R3OUT R4OUT R5OUT EN
R3
R1IN 10 GND VCC 11 12
R4
R5
GND
ADM235L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 11. ADM235L DIP Pin Configuration
Figure 12. ADM235L Typical Operating Circuit
-6-
REV. B
ADM223/ADM230L-ADM241L
5V INPUT C1+ C1- C2+ C2- VCC V+ 1F 6.3V +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER 1F 6.3V 1F 6.3V
1F 16V
V- 1F 16V T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN SD RS-232 INPUTS** RS-232 OUTPUTS
T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN GND VCC C1+
1 2 3 4 5 6 7 8 9 10
24 T4OUT 23 R2IN 22 R2OUT
T2IN T1IN
T1
T2
21 SD 20 EN
TTL/CMOS INPUTS* T3IN T4IN R1OUT TTL/CMOS OUTPUTS R2OUT R3OUT EN T3
ADM236L
TOP VIEW (Not to Scale)
19
T4IN
T4
18 T3IN 17 R3OUT 16 R3IN 15 V- 14 C2-
R1
R2
V+ 11 C1- 12
R3
13 C2+
GND
ADM236L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 13. ADM236L DIP/SOIC Pin Configuration
Figure 14. ADM236L Typical Operating Circuit
5V INPUT C1+ C1- C2+ C2- VCC V+
1F 6.3V
+5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER
1F 6.3V
1F 6.3V
1F 16V
T3OUT T1OUT T2OUT R1IN R1OUT T2IN T1IN GND VCC C1+ V+ C1- 24 T4OUT 23 R2IN 22 R2OUT 21 T5IN 20 T5OUT
V- 1F 16V T1OUT T2OUT T3OUT T4OUT
20
1 2 3 4 5 6 7 8 9 10 11 12
T1IN T2IN TTL/CMOS INPUTS* T3IN T4IN T5IN R1OUT TTL/CMOS OUTPUTS R2OUT R3OUT
T1
T2
T3
RS-232 OUTPUTS
ADM237L
TOP VIEW (Not to Scale)
19 T4IN 18 T3IN 17 R3OUT 16 R3IN 15 V- 14 C2- 13 C2+
T4
T5 R1
T5OUT R1IN R2IN R3IN RS-232 INPUTS**
R2
R3 GND
ADM237L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 15. ADM237L DIP/SOIC Pin Configuration
Figure 16. ADM237L Typical Operating Circuit
REV. B
-7-
ADM223/ADM230L-ADM241L
5V INPUT 1F 6.3V C1+ C1- C2+ C2- +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER VCC V+ 1F 6.3V 1F 6.3V
1F 16V
V- 1F 16V T1OUT T2OUT T3OUT T4OUT R1IN R2IN RS-232 INPUTS** RS-232 OUTPUTS
T2OUT T1OUT R2IN R2OUT T1IN R1OUT R1IN GND VCC C1+
1 2 3 4 5 6 7 8 9 10
24
T3OUT
T1IN T2IN TTL/CMOS INPUTS* T3IN T4IN R1OUT R2OUT TTL/CMOS OUTPUTS R3OUT R4OUT
T1
23 R3IN 22 R3OUT 21 T4IN 20 T4OUT
T2
T3
ADM238L
TOP VIEW (Not to Scale)
T4
19
T3IN
18 T2IN 17 R4OUT 16 R4IN 15 V- 14 C2-
R1
R2
R3
R3IN R4IN
V+ 11 C1- 12
13 C2+
R4 GND
ADM238L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 17. ADM238L DIP/SOIC Pin Configuration
Figure 18. ADM238L Typical Operating Circuit
5V INPUT 1F VCC 1F 16V C1+ C1- +12V TO -12V VOLTAGE INVERTER V+ V- 1F 16V 7.5V TO 13.2V INPUT
R1OUT R1IN GND VCC V+ C+ C- V- R5IN R5OUT R4OUT R4IN
1 2 3 4 5 6 7 8 9 10 11 12
24 T1IN 23 T2IN 22 R2OUT 21 R2IN 20 T2OUT
TTL/CMOS INPUTS*
T1IN T2IN T3IN R1OUT R2OUT TTL/CMOS OUTPUTS R3OUT R4OUT R5OUT EN
T1
T1OUT T2OUT T3OUT R1IN R2IN R3IN R4IN R5IN NC RS-232 INPUTS** RS-232 OUTPUTS
T2
T3 R1
ADM239L
TOP VIEW (Not to Scale)
19 T1OUT 18 R3IN 17 R3OUT 16 T3IN 15 NC 14 EN 13 T3OUT
R2
R3
R4
R5
GND
ADM239L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 19. ADM239L DIP/SOIC Pin Configuration
Figure 20. ADM239L Typical Operating Circuit
-8-
REV. B
ADM223/ADM230L-ADM241L
5V INPUT 1F 16V C1+ C1- C2+ C2- +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 VCC V+ V- 1F 6.3V 1F 6.3V
1F 16V
T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN R1OUT R1IN
1 2 3 4 5 6 7 8 9
28 T4OUT 27 R3IN 26 R3OUT 25 SD 24 EN 23 R4IN
TTL/CMOS INPUTS* T1IN T2IN T3IN T4IN R1OUT R2OUT TTL/CMOS OUTPUTS R3OUT R4OUT R5OUT
1F 16V T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN R5IN SD RS-232 INPUTS** RS-232 OUTPUTS
T2
T3
T4 R1
ADM241L
TOP VIEW (Not to Scale)
22 R4OUT 21 T4IN 20 T3IN 19 R5OUT 18 R5IN 17 V- 16 C2-
R5 GND
R2
GND 10 VCC C1+ V+ C1- 11 12 13 14
R3
R4
15 C2+
EN
ADM241L
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
Figure 21. ADM241L SOIC/SSOP Pin Configuration
Figure 22. ADM241L Typical Operating Circuit
5V INPUT C1+ C1- C2+ C2- +5V TO +10V VOLTAGE DOUBLER +10V TO -10V VOLTAGE INVERTER T1 VCC V+ V-
1F 16V
1F 6.3V
1F 6.3V
1F 16V T3OUT T1OUT T2OUT R2IN R2OUT T2IN T1IN R1OUT R1IN 1 2 3 4 5 6 7 8 9 28 T4OUT 27 R3IN 26 R3OUT 25 SD 24 EN 23 R4IN T4IN R1OUT R2OUT TTL/CMOS OUTPUTS R3OUT R4OUT R5OUT EN TTL/CMOS INPUTS* T2IN T3IN T1IN
1F 16V T1OUT T2OUT T3OUT T4OUT R1IN R2IN R3IN R4IN R5IN SD RS-232 INPUTS** RS-232 OUTPUTS
T2
T3
T4 R1
ADM223
TOP VIEW (Not to Scale)
22 R4OUT 21 T4IN
R2
20 T3IN 19 R5OUT 18 R5IN
GND 10 VCC C1+ V+ C1- 11 12 13 14
R3
R4
17 V- 16 C2- 15 C2+
R5 GND
ADM223
* INTERNAL 400k PULL-UP RESISTOR ON EACH TTL/CMOS INPUT. ** INTERNAL 5k PULL-DOWN RESISTOR ON EACH RS-232 INPUT. NOTE: RECEIVERS R4 AND R5 REMAIN ACTIVE IN SHUTDOWN.
Figure 23. ADM223 SOIC/SSOP Pin Configuration
Figure 24. ADM223 Typical Operating Circuit
REV. B
-9-
ADM223/ADM230L-ADM241L
PIN FUNCTION DESCRIPTION
Mnemonic VCC V+ V- GND C+ C- C1+
Function Power Supply Input 5 V 10% (5 V 5% ADM233L, ADM235L). Internally generated positive supply (+10 V nominal) on all parts except ADM231L and ADM239L. ADM231L, ADM239L requires external 7.5 V to 13.2 V supply. Internally generated negative supply (-10 V nominal). Ground pin. Must be connected to 0 V. (ADM231L and ADM239L only). External capacitor (+ terminal) is connected to this pin. (ADM231L and ADM239L only). External capacitor (- terminal) is connected to this pin. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (+ terminal) is connected to this pin. (ADM233L) The capacitor is connected internally and no external connection to this pin is required. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (- terminal) is connected to this pin. (ADM233L) The capacitor is connected internally and no external connection to this pin is required. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (+ terminal) is connected to this pin. (ADM233L) Internal capacitor connections, Pins 11 and 15 must be connected together. (ADM230L, ADM232L, ADM234L, ADM236L, ADM237L, ADM238L, ADM241L) External capacitor (- terminal) is connected to this pin. (ADM233L) Internal capacitor connections, Pins 10 and 16 must be connected together. Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 k pull-up resistor to VCC is connected on each input. Transmitter (Driver) Outputs. These are RS-232 levels (typically 10 V). Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 k pull-down resistor to GND is connected on each input. Receiver Outputs. These are TTL/CMOS levels. Enable Input. Active low on ADM235L, ADM236L, ADM239L, ADM241L. Active high ADM223. This input is used to enable/disable the receiver outputs. With EN = low (EN = high ADM223), the receiver outputs are enabled. With EN = high (EN = low ADM223), the outputs are placed in a high impedance state. This facility is useful for connecting to microprocessor systems. Shutdown Input. Active high on ADM235L, ADM236L, ADM241L. Active low on ADM223. With SD = high on the ADM235L, ADM236L, ADM241L, the charge pump is disabled, the receiver outputs are placed in a high impedance state and the driver outputs are turned off. With SD low on the ADM223, the charge pump is disabled, the driver outputs are turned off and all receivers except R4 and R5 are placed in a high impedance state. In shutdown, the power consumption reduces to 5 W. No Connect. No connections are required to this pin.
C1-
C2+
C2-
TIN TOUT RIN ROUT EN/EN
SD/SD
NC
Table I. ADM235L, ADM236L, ADM241L Truth Table
Table II. ADM223 Truth Table
SD 0 0 1
EN 0 1 0
Status Normal Operation Normal Operation Shutdown
Transmitters T1-T5 Enabled Enabled Disabled
Receivers R1-R5 Enabled Disabled Disabled
SD EN Status 0 0 1 1 0 1 0 1 Shutdown Shutdown Normal Operation Normal Operation
Transmitters Receivers T1-T4 R1-R3 R4, R5 Disabled Disabled Enabled Enabled Disabled Disabled Disabled Enabled Disabled Enabled Disabled Enabled
-10-
REV. B
ADM223/ADM230L-ADM241L
15 V+ 10
5 9 7 Tx O/P HI LOADED
5
Tx O/P - V
3 1 -1 -3
V+/V- - V
0
-5 V- -10
-5 -7
Tx O/P LO LOADED 4.0 4.5 5.0 VCC - V 5.5 6.0
-15
0
5
10 LOAD CURRENT - mA
15
20
-9
Figure 25. Charge Pump V+, V- vs. Current
Figure 27. Transmitter Output Voltage vs. VCC
50 45 40
15
10 Tx O/P HI 5
Tx O/P - V
SLEW RATE - V/ s
35 30 25 20 15 10 5 0 0 500 1500 2000 1000 LOAD CAPACITANCE - pF 2500 3000 POSITIVE SLEW NEGATIVE SLEW
0
-5 Tx O/P LO
-10
-15
0
2
4 6 LOAD CURRENT - mA
8
10
Figure 26. Transmitter Slew Rate vs. Load Capacitance
Figure 28. Transmitter Output Voltage vs. Current
350 300 V+ IMP 250
IMPEDANCE -
200
150
100 V- IMP 50
0
4.5
4.7
4.9 VCC - V
5.1
5.3
5.5
Figure 29. Charge Pump Impedance vs. VCC
REV. B
-11-
ADM223/ADM230L-ADM241L
1 T T SD V+
Tx INPUT 1 T T 2
T
Tx OUTPUT
V- CH1 5.00V CH2 5.00V M50.0 s CH1 CH3 5.00V BW V+, V- EXITING SD 3.1V
CH1 5.00V
CH2 5.00V M1.00 s CH1
800mV
Figure 30. Charge Pump, V+, V- Exiting Shutdown
Figure 31. Transmitter Output Loaded Slew Rate
1
T T
Tx INPUT
2 Tx OUTPUT
CH1 5.00V
CH2 5.00V M1.00 s CH1
800mV
Figure 32. Transmitter Output Unloaded Slew Rate
GENERAL INFORMATION
CIRCUIT DESCRIPTION
The ADM223/ADM230L-ADM241L family of RS-232 drivers/ receivers are designed to solve interface problems by meeting the EIA-232-E specifications while using a single digital 5 V supply. The EIA-232-E standard requires transmitters which will deliver 5 V minimum on the transmission channel and receivers which can accept signal levels down to 3 V. The ADM223/ADM230L-ADM241L meet these requirements by integrating step up voltage converters and level shifting transmitters and receivers onto the same chip. CMOS technology is used to keep the power dissipation to an absolute minimum. A comprehensive range of transmitter/receiver combinations is available to cover most communications needs. The ADM223, ADM230L, ADM235L, ADM236L and ADM241L are particularly useful in battery powered systems as they feature a low power shutdown mode which reduces power dissipation to less than 5 W. The ADM233L and ADM235L are designed for applications where space saving is important as the charge pump capacitors are molded into the package. The ADM231L and ADM239L include only a negative charge pump converter and are intended for applications where a positive 12 V is available. To facilitate sharing a common line or for connection to a microprocessor data bus the ADM235L, ADM236L, ADM239L and ADM241L feature an enable (EN, EN) function. When disabled, the receiver outputs are placed in a high impedance state.
The internal circuitry in the ADM230L-ADM241L consists of three main sections. These are: (a) A charge pump voltage converter (b) RS-232 to TTL/CMOS receivers (c) TTL/CMOS to RS-232 transmitters
Charge Pump DC-DC Voltage Converter
The charge pump voltage converter consists of an oscillator and a switching matrix. The converter generates a 10 V supply from the input 5 V level. This is done in two stages using a switched capacitor technique as illustrated in Figures 33 and 34. First, the 5 V input supply is doubled to 10 V using capacitor C1 as the charge storage element. The 10 V level is then inverted to generate -10 V using C2 as the storage element.
S1 VCC C1 S2 GND S4 VCC C3 S3 V+ = 2VCC
INTERNAL OSCILLATOR
Figure 33. Charge-Pump Voltage Doubler
-12-
REV. B
ADM223/ADM230L-ADM241L
S1 V+ FROM VOLTAGE DOUBLER GND C2 S2 + S4 V- = -(V+) C4 + S3 GND
and all receivers except R4 and R5 on the ADM223 are put into a high-impedance disabled state. Receivers R4 and R5 on the ADM223 remain enabled during shutdown. This feature allows monitoring external activity such as ring indicator monitoring while the device is in a low power shutdown mode. The shutdown control input is active high on all parts except the ADM223 where it is active low. Refer to Tables I and II. Enable Input The ADM235, ADM239, ADM241L and ADM223 feature an enable input used to enable or disable the receiver outputs. The enable input is active low on the ADM235L, ADM239L, ADM241L and active high on the ADM223. Refer to Tables I and II. When disabled, all receiver outputs are placed in a high impedance state. This function allows the outputs to be connected directly to a microprocessor data bus. It can also be used to allow receivers from different devices to share a common data line. The timing diagram for the enable function is shown in Figure 35.
3V EN* 0V TEN 3.5V ROUT 0.8V TDIS VOH - 0.1V VOL + 0.1V
INTERNAL OSCILLATOR
Figure 34. Charge-Pump Voltage Inverter
Capacitors C3 and C4 are used to reduce the output ripple. Their values are not critical and can be reduced if higher levels of ripple are acceptable. The charge pump capacitors C1 and C2 may also be reduced at the expense of higher output impedance on the V+ and V- supplies. The V+ and V- supplies may also be used to power external circuitry if the current requirements are small.
Transmitter (Driver) Section
The drivers convert TTL/CMOS input levels into EIA-232-E output levels. With VCC = +5 V and driving a typical EIA-232-E load, the output voltage swing is 9 V. Even under worst-case conditions the drivers are guaranteed to meet the 5 V EIA-232-E minimum requirement. The input threshold levels are both TTL and CMOS compatible with the switching threshold set at VCC/4. With a nominal VCC = 5 V the switching threshold is 1.25 V typical. Unused inputs may be left unconnected, as an internal 400 k pull-up resistor pulls them high forcing the outputs into a low state. As required by the EIA-232-E standard, the slew rate is limited to less than 30 V/s without the need for an external slew limiting capacitor and the output impedance in the power-off state is greater than 300 .
Receiver Section
*POLARITY OF EN IS REVERSED FOR ADM223.
Figure 35. Enable Timing
APPLICATION HINTS Driving Long Cables
The receivers are inverting level shifters which accept EIA-232-E input levels ( 5 V to 15 V) and translate them into 5 V TTL/ CMOS levels. The inputs have internal 5 k pull-down resistors to ground and are also protected against overvoltages of up to 30 V. The guaranteed switching thresholds are 0.8 V minimum and 2.4 V maximum which are well within the 3 V EIA-232-E requirement. The low level threshold is deliberately positive as it ensures that an unconnected input will be interpreted as a low level. The receivers have Schmitt trigger inputs with a hysteresis level of 0.5 V. This ensures error-free reception for both noisy inputs and for inputs with slow transition times.
Shutdown (SD)
In accordance with the EIA-232-E standard, long cables are permissible provided that the total load capacitance does not exceed 2500 pF. For longer cables which do exceed this, then it is possible to trade off baud rate vs. cable length. Large load capacitances cause a reduction in slew rate, and hence the maximum transmission baud rate is decreased. The ADM230L-ADM241L are designed so that the slew rate reduction with increasing load capacitance is minimized. For the receivers, it is important that a high level of noise immunity be inbuilt so that slow rise and fall times do not cause multiple output transitions as the signal passes slowly through the transition region. The ADM230L-ADM241L have 0.5 V of hysteresis to guard against this. This ensures that, even in noisy environments, error-free reception can be achieved.
High Baud Rate Operation
The ADM223, ADM230L, ADM235L, ADM236L and ADM241L feature a control input that may be used to disable the part and reduce the power consumption to less than 5 W. This is very useful in battery operated systems. During shutdown the charge pump is turned off, the transmitters are disabled
The ADM230L-ADM241L feature high slew rates permitting data transmission at rates well in excess of the EIA-232-E specification. The drivers maintain 5 V signal levels at data rates up to 100-kB/s under worst-case loading conditions.
REV. B
-13-
ADM223/ADM230L-ADM241L
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
14-Lead Plastic DIP (N-14)
14 8
14-Lead Cerdip (Q-14)
14 8
PIN 1
1 7
0.280 (7.11) 0.240 (6.10)
PIN 1
1 7
0.271 (6.89) 0.240 (6.09) 0.300 (7.62) REF 0.163 (4.14) 0.133 (3.378)
0.795 (20.19) 0.725 (18.42) 0.210 (5.33) 0.200 (5.05) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) BSC 0.070 (1.77) 0.045 (1.15) 0.060 (1.52) 0.015 (0.38)
0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93) 0.015 (0.381) 0.008 (0.204)
0.780 (19.81)
0.150 (3.81) SEATING PLANE
0.125 (3.17) MIN 0.02 (0.5) 0.11 (2.79) 0.06 (1.52) 0.016 (0.406) 0.099 (2.28) 0.05 (1.27)
0.21 (5.33) 0.15 (3.81) SEATING PLANE 15 0 0.012 (0.305) 0.008 (0.203)
16-Lead Plastic DIP (N-16)
16 9
16-Lead Cerdip (Q-16)
16 9
PIN 1
1 8
0.280 (7.11) 0.240 (6.10)
PIN 1
1 8
0.271 (6.89) 0.240 (6.09) 0.300 (7.62) REF 0.163 (4.14) 0.133 (3.378)
0.840 (21.33) 0.745 (18.93) 0.210 (5.33) 0.200 (5.05) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) BSC 0.070 (1.77) 0.045 (1.15) 0.060 (1.52) 0.015 (0.38)
0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93) 0.015 (0.381) 0.008 (0.204)
0.780 (19.81)
0.150 (3.81) SEATING PLANE
0.125 (3.17) MIN 0.02 (0.5) 0.11 (2.79) 0.016 (0.406) 0.099 (2.28) 0.06 (1.52) 0.05 (1.27)
0.21 (5.33) 0.15 (3.81) SEATING PLANE 15 0 0.012 (0.305) 0.008 (0.203)
16-Lead SOIC (R-16)
16
9
0.299 (7.60) 0.291 (7.40) 0.419 (10.65) 0.404 (10.26)
1 8
PIN 1
0.413 (10.50) 0.348 (10.10)
0.107 (2.72) 0.089 (2.26)
0.364 (9.246) 0.344 (8.738)
0.010 (0.25) 0.004 (0.10)
0.050 (1.27) BSC
0.018 (0.46) 0.014 (0.36)
0.015 (0.38) 0.007 (1.18)
0.045 (1.15) 0.020 (0.50)
-14-
REV. B
ADM223/ADM230L-ADM241L
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
20-Lead Plastic DIP (N-20)
1.060 (26.90) 0.925 (23.50)
20 11
20-Lead Cerdip (Q-20)
0.97 (24.64) 0.935 (23.75)
20 11
PIN 1
1 10
0.280 (7.11) 0.240 (6.10)
PIN 1
1 10
0.28 (7.11) 0.24 (6.1) 0.18 (4.57) 0.125 (3.18)
0.060 (1.52) 0.015 (0.38) 0.210 (5.33) 0.200 (5.05) 0.125 (3.18) 0.022 (0.558) 0.014 (0.356) 0.100 (2.54) BSC 0.150 (3.81) 0.070 (1.78) SEATING 0.045 (1.15) PLANE
0.325 (8.25) 0.300 (7.62) 0.195 (4.95) 0.115 (2.93)
0.32 (8.128) 0.29 (7.366)
0.20 (5.0) 0.14 (3.56) 0.15 (3.8) 0.125 (3.18) 0.02 (0.5) 0.016 (0.41) 0.11 (2.79) 0.09 (2.28) 0.07 (1.78) 0.05 (1.27) SEATING 15 PLANE 0 0.011 (0.28) 0.009 (0.23)
0.015 (0.381) 0.008 (0.204)
LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH
20-Lead SOIC (R-20)
0.5118 (13.00) 0.4961 (12.60)
24
20 11
24-Lead Ceramic DIP (D-24)
1.290 (32.77) 0.005 (0.13)
13
0.098 (2.49)
0.2992 (7.60) 0.2914 (7.40) 0.4193 (10.65) 0.3937 (10.00)
1 10
PIN 1
1 12
0.610 (15.49) 0.500 (12.70)
PIN 1
0.075 (1.91) 0.015 (0.38) 0.225 (5.72)
0.620 (15.75) 0.590 (14.99)
0.1043 (2.65) 0.0926 (2.35)
0.0291 (0.74) 0.0098 (0.25)
45
0.200 (5.08) 0.120 (3.05) 0.023 (0.58) 0.014 (0.36) 0.110 (2.79) 0.090 (2.29) 0.070 (1.78) 0.030 (0.76)
0.150 (3.81) SEATING PLANE
0.015 (0.38) 0.008 (0.20)
0.0118 (0.30) 0.0040 (0.10)
0.0500 (1.27) BSC
8 0.0192 (0.49) 0.0125 (0.32) 0 0.0138 (0.35) 0.0091 (0.23)
0.0500 (1.27) 0.0157 (0.40)
24-Lead Plastic DIP (N-24A) 24-Lead Plastic DIP (N-24)
24 13
PIN 1
24 1
13 12
0.260 (6.61
0.001 0.03) 0.32 (8.128) 0.30 (7.62)
PIN 1
1 12
0.55 (13.97) 0.53 (13.47)
1.228 (31.19) 1.226 (31.14) 0.130 (3.30) 0.128 (3.25)
1.25 (31.75) 1.24 (31.5) 0.2 (5.08) MAX 0.175 (4.45) 0.12 (3.05) 0.02 (0.508) 0.105 (2.67) 0.065 (1.66) 0.015 (0.381) 0.095 (2.42) 0.045 (1.15) 0.16 (4.07) 0.14 (3.56)
0.606 (15.4) 0.594 (15.09)
SEATING 0.011 (0.28) PLANE 0.02 (0.5) 0.11 (2.79) 0.07 (1.78) 0.009 (0.23) 15 0.016 (0.41) 0.09 (2.28) 0.05 (1.27) 0 NOTES 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH 2. PLASTIC LEADS WILL BE EITHER SOLDER DIPPED OR TIN PLATED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
SEATING PLANE
15 0
0.012 (0.305) 0.008 (0.203)
REV. B
-15-
ADM223/ADM230L-ADM241L
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
24-Lead Cerdip (Q-24)
24 13
28-Lead SOIC (R-28)
0.708 (18.02) 0.696 (17.67)
0.320 (8.128) 0.290 (7.366)
PIN 1
1 12
28
15
1.290 (32.77) MAX 0.225 (5.715) MAX 0.180 (4.572) MAX
0.299 (7.6) 0.291 (7.39) PIN 1
1 14
0.414 (10.52) 0.398 (10.10)
0.125 SEATING (3.175) PLANE MIN 0.012 (0.305) 0.070 (1.778) 15 0.021 (0.533) 0.110 (2.794) 0.008 (0.203) 0.065 (1.651) 0.020 (0.508) 0 0.015 (0.381) 0.090 (2.286) TYP 0.055 (1.397) TYP TYP TYP 1. LEAD NO. 1 IDENTIFIED BY DOT OR NOTCH. 2. CERDIP LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
0.096 (2.44) 0.089 (2.26)
0.03 (0.76) 0.02 (0.51)
0.01 (0.254) 0.006 (0.15)
0.05 (1.27) BSC
0.019 (0.49) 0.014 (0.35)
6 0.013 (0.32) 0 0.009 (0.23)
0.042 (1.067) 0.018 (0.457)
1. LEAD NO. IDENTIFIED BY A DOT. 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
24-Lead SOIC (R-24)
0.608 (15.45) 0.596 (15.13)
28-Lead SSOP (RS-28)
0.407 (10.34) 0.397 (10.08)
24
13 28 15
0.299 (7.6) 0.291 (7.39) PIN 1
1 12
0.414 (10.52) 0.398 (10.10)
0.212 (5.38) 0.205 (5.207) PIN 1
1 14
0.311 (7.9) 0.301 (7.64)
0.096 (2.44) 0.089 (2.26)
0.03 (0.76) 0.02 (0.51)
0.07 (1.78) 0.066 (1.67)
0.01 (0.254) 0.006 (0.15)
0.05 (1.27) BSC
0.019 (0.49) 0.014 (0.35)
0.013 (0.32) 0.009 (0.23)
6 0
0.042 (1.067) 0.018 (0.447) 0.008 (0.203) 0.002 (0.050)
1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. SOIC LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
0.037 (0.94) 8 0 0.022 (0.559) 0.009 (0.229) 0.005 (0.127) 1. LEAD NO. 1 IDENTIFIED BY A DOT. 2. LEADS WILL BE EITHER TIN PLATED OR SOLDER DIPPED IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS 0.0256 (0.65) BSC
Location
Page
05/01 Data Sheet changed from REV. A to REV. B. Edits to Test Conditions/Comments of Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Location Page
01/01 Data Sheet changed from REV. 0 to REV. A. Removed ESD information from FEATURES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 SPECIFICATIONS changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Removed ESD information from ABSOLUTE MAXIMUM RATINGS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 -16- REV. B
PRINTED IN U.S.A.
ADM223/ADM230L-ADM241L-Revision History
C00070-0-6/01(B)
0.295 (7.493) MAX

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