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Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
MLN SurgeArrayTM Suppressor
The MLN SurgeArrayTM Suppressor is designed to help protect components from transient voltages that exist at the circuit board level. This device provides four independent suppressors in a single "1206" leadless chip in order to reduce part count and placement time as well as save space on printed circuit boards. SurgeArrayTM devices are intended to suppress ESD, EFT and other transients in order to protect integrated circuits or other sensitive components operating at any voltage up to 18VDC. SurgeArray devices are rated to the IEC 61000-4-2 human body model ESD to help products attain EMC compliance. The array offers excellent isolation and low crosstalk between sections. The inherent capacitance of the SurgeArray Suppressor permits it to function as a filter/suppressor, thereby replacing separate zener/ capacitor combinations. The MLN array is manufactured using the Littelfuse Multilayer technology process and is similar to the Littelfuse ML and MLE Series of discrete leadless chips. The MLN can also be provided in a Dual version. Contact Littelfuse for information.
3
SURFACE MOUNT VARISTORS
151
Features
* Four Individual Devices in One 1206 Chip * ESD Rated to IEC 61000-4-2 (Level 4) * AC Characterized for Impedance and Capacitance * Low Adjacent Channel Crosstalk, -55dB at 10MHz (Typ) * Low Leakage (6nA at 5.5V, 30nA at 15V) * Operating Voltage up to 18VM(DC) * -55oC to 125oC Operating Temperature Range * Low-Profile, PCMCIA Compatible
Applications
* Data, Diagnostic I/O Ports * Analog Signal/Sensor Lines * Portable/Hand-Held Products * Mobile Communications/Cellular Phones * Computer/DSP Products * Industrial Instruments Including Medical
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Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
MLN SurgeArrayTM Suppressor
Absolute Maximum Ratings For ratings of individual members of a series, see device ratings and specifications table. MLN ARRAY Continuous: Steady State Applied Voltage: DC Voltage Range (VM(DC)). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Operating Ambient Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 125 Storage Temperature Range (TSTG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55 to 150 Device Ratings and Specifications Any Single Section
MAX RATINGS (125 oC) MAXIMUM NONMAXIMUM REPETITIVE CONTINUOUS SURGE WORKING CURRENT VOLTAGE (8/20s) VM(DC) ITM MAXIMUM CLAMPING VOLTAGE (AT NOTED 8/20s) CURRENT VC (See Fig. 3) (V) V5.5MLN41206 V9MLN41206 V14MLN41206 V18MLN41206 V18MLN41206L NOTES: 1. Tested to IEC61000-4-2 Human Body Model (HBM) discharge test circuit. See explanation of Terms on page 7. 2. Direct discharge to device terminals (IEC preffered test method). See figure 2. 3. Corona discharge through air (represents actual ESD event) 4. Capacitance may be customized, contact Sales. 5.5 9 14 18 18 (A) 30 30 30 30 20 (V) 15.5 at 2A 23 at 2A 30 at 2A 40 at 2A 50 at 1A (J) 0.1 0.1 0.1 0.1 0.05 PERFORMANCE SPECIFICATIONS (25 oC) MAXIMUM NONREPETITIVE SURGE ENERGY (10/1000s) WTM
UNITS
V C O C
O
PART NUMBER
TYPICAL ESD SUPPRESSION VOLTAGE (NOTE 1)
NOMINAL VOLTAGE AT 1mA DC CURRENT
CAPACITANCE AT 1MHz (1V p-p)
(NOTE 2) (NOTE 3) 8kV CONTACT 15kV AIR
Peak Clamp (V) 60 95 110 165 200 (V) 35 50 55 60 95
Peak (V) 45 75 85 100 130
VN(DC) MIN
VN(DC) MAX
(NOTE 4) C
TYP (pF) 430 250 140 100 45
MAX (pF) 520 300 175 125 75
(V) 7.1 11.0 15.9 22.0 25.0
(V) 9.3 16.0 20.3 28.0 35.0
Temperature Derating
PERCENT OF RATED VALUE
For applications exceeding 125oC ambient temperature, the peak surge current and energy ratings must be reduced as shown in Figure 1.
100 90 80 70 60 50 40 30 20 10 0 -55 50 60 70 80 90 100 110 120 130 140 150
AMBIENT TEMPERATURE ( oC)
FIGURE 1. PEAK CURRENT AND ENERGY DERATING CURVE
PERCENT OF PEAK VALUE 100 90 O1 = VIRTUAL ORIGIN OF WAVE t = TIME FROM 10% TO 90% OF PEAK t1 = VIRTUAL FRONT TIME = 1.25 x t t2 = VIRTUAL TIME TO HALF VALUE (IMPULSE DURA TION) EXAMPLE: FOR AN 8/20s CURRENT WAVEFORM: 8s = t1 = VIRTUAL FRONT TIME 20s = t2 = VIRTUAL TIME TO HALF VALUE
50
10 O1 t t1 t2 TIME
FIGURE 2. PEAK PULSE CURRENT TEST WAVEFORM FOR CLAMPING VOLTAGE
152
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Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
MLN SurgeArrayTM Suppressor
Typical Performance Curves
40
Any Single Section
70 60
30 50 SAMPLES VNOM 40 30 20 10 0 1 10 100 1000 10,000 0
20
3
SURFACE MOUNT VARISTORS
10
30
35
40
45
50
55
60
65
70
NUMBER OF DISCHARGES
CAPACITANCE (pF)
FIGURE 4. PRODUCT DISTRIBUTION OF CAPACITANCE (1MHz)
Typical Performance Curves
90 80 VARISTOR VOLTAGE (V) 70 60 50 40 30 20 10 0 1.0E-07 1.0E-06 1.0E-05
Any Single Section
MAXIMUM CLAMP VOLTAGE MAXIMUM STANDBY CURRENT (LEAKAGE)
TYPICAL
1.0E-04
1.0E-03
1.0E-02
1.0E-01
1.0E+00
1.0E+01
1.0E+02
CURRENT (A)
FIGURE 5. V-I CHARACTERISTICS
100 NUMBER OF SURGES 1 SURGE CURRENT (A) 10 2 10 100 103 104 105 106
1
0.1 10
100 SQUARE WAVE PULSE DURA TION ( s)
1000
10000
FIGURE 6. PULSE RATING FOR LONG DURATION SURGES (ANY SINGLE SECTION)
153
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Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
MLN SurgeArrayTM Suppressor
Typical Performance Curves
100 NORMALIZED VARISTOR VOLTAGE (%) -40oC 25oC 85oC 125oC
Any Single Section (Continued)
10 0.1A
1
A
1
0A CURRENT (A)
100A
1mA
FIGURE 7. STANDBY CURRENT AT NORMALIZED VARISTOR VOLTAGE AND TEMPERATURE (ANY SINGLE SECTION)
70
65 CAPACITANCE (pF)
60
55
50
45
40 1MHz
10MHz FREQUENCY
100MHz
1GHz
FIGURE 8. CAPACITANCE vs FREQUENCY
1000
100
OHMS
10
1
0.1 1MHz
10MHz
100MHz FREQUENCY
1GHz
10GHz
FIGURE 9. EQUIVALENT SERIES RESISTANCE
154
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Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
MLN SurgeArrayTM Suppressor
Typical Performance Curves
10000
Any Single Section (Continued)
1000 IMPEDANCE (Z)
100
10
3
SURFACE MOUNT VARISTORS
155
1
0.1 1MHz
10MHz
100MHz FREQUENCY
1GHz
10GHz
FIGURE 10. IMPEDANCE vs FREQUENCY
0
-20 CROSSTALK (dB)
-40
-60 VIN = 1VRMS Z = 50
-80
-100
-120 1kHz
10kHz
100kHz
1MHz FREQUENCY
10MHz
100MHz
1GHz
FIGURE 11. ADJACENT CHANNEL CROSSTALK
Soldering Recommendations
The principal techniques used for the soldering of components in surface mount technology are Infrared (IR) Reflow, Vapour Phase Reflow, and Wave Soldering. Typical profiles are shown in Figures 12, 13 and 14. When wave soldering, the MLN suppressor is attached to the circuit board by means of an adhesive. The assembly is then placed on a conveyor and run through the soldering process to contact the wave. With IR and Vapour Phase Reflow, the device is placed in a solder paste on the substrate. As the solder paste is heated, it reflows and solders the unit to the board. The recommended solder for the MLN suppressor is a 62/36/2 (Sn/Pb/Ag), 60/40 (Sn/Pb), or 63/37 (Sn/Pb). Littelfuse also recommends an RMA solder flux. Wave soldering is the most strenuous of the processes. To avoid the possibility of generating stresses due to thermal shock, a preheat stage in the soldering process is recommended, and the peak temperature of the solder process should be rigidly controlled. When using a reflow process, care should be taken to ensure that the MLN chip is not subjected to a thermal gradient steeper than 4 degrees per second; the ideal gradient being 2 degrees per second. During the soldering process, preheating to within 100 degrees of the solders peak temperature is essential to minimize thermal shock. Examples of the soldering conditions for the MLN array of suppressors are given in the tables below. Once the soldering process has been completed, it is still necessary to ensure that any further thermal shocks are avoided. One possible cause of thermal shock is hot printed circuit boards being removed from the solder process and subjected to cleaning solvents at room temperature. The boards must be allowed to gradually cool to less than 50oC before cleaning.
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Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
MLN SurgeArrayTM Suppressor
250 MAXIMUM TEMPERATURE 222 oC 200 TEMPERATURE ( oC) TEMPERATURE ( oC) 40-80 SECONDS ABOVE 183 oC RAMP RA TE <2oC/s 100 PREHEAT DWELL 50 PREHEAT ZONE 200 250 MAXIMUM TEMPERATURE 222 oC 40-80 SECONDS ABOVE 183 oC RAMP RA TE >50oC/s 100 PREHEAT ZONE 50
150
150
0 0
0 0.5 1.0 1.5 2.0 2.5 TIME (MINUTES) 3.0 3.5 4.0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 TIME (MINUTES)
FIGURE 12. IR REFLOW SOLDER PROFILE
FIGURE 14. VAPOR PHASE SOLDER PROFILE
300 MAXIMUM WAVE 260 oC 250 TEMPERATURE ( oC) 200
Recommended Pad Outline
E D
A 150 SECOND PREHEAT C 100 FIRST PREHEAT 50 0 0 B
0.5
1.0
1.5
2.0 2.5 3.0 TIME (MINUTES)
3.5
4.0
4.5
TABLE 1. PAD LAYOUT DIMENSIONS
DIMENSION Millimeters Inches A 0.89 0.035 B 1.65 0.065 C 2.54 0.100 D 0.46 0.018 E 0.79 0.030
FIGURE 13. WAVE SOLDER PROFILE
Mechanical Dimensions
T W
X P L S BW
BL
L Inch Millimeter
156
W 0.063 0.008 1.6 0.2
T 0.053 Max 1.35 Max
BW
BL
P 0.030 Ref 0.76 Ref
X 0.045 0.004 1.14 0.1
S 0.015 0.004 0.38 0.1
0.126 0.008 3.2 0.2
0.016 0.004 0.007 +0.01/- 0.002 0.41 0.1 0.18 +0.25/-0.05
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Surface Mount Varistors
Multiline Transient Voltage Surge Suppressor
MLN SurgeArrayTM Suppressor
Ordering Information
VXXMLN TYPES
V
DEVICE FAMILY TVSS Device MAXIMUM DC WORKING VOLTAGE
18
ML
N
4
1206
W
T
PACKING OPTIONS A: 2500 Piece Bulk Pack H: 7in (178mm) Diameter Reel (Note) T: 13in (330mm) Diameter Reel (Note) NOTE: See Standard Shipping Quantities table.
MULTILAYER DESIGNATOR SERIES DESIGNATOR N: Array DEVICE SIZE: i.e., 120 mil x 60 mil NUMBER OF SECTIONS END TERMINATION OPTION W: Ag/Pd/Pt
3
SURFACE MOUNT VARISTORS
Tape and Reel Specifications
* Conforms to EIA - 481, Revision A * Can be Supplied to IEC Publication 286 - 3
SYMBOL A0 B0 K0 W F E P1 P2 P0 D0 D1 t1 t2 Width of Cavity Length of Cavity Depth of Cavity Width of Tape Distance Between Drive Hole Centers and Cavity Centers Distance Between Drive Hole Centers and Tape Edge Distance Between Cavity Center Axial Distance Between Drive Hole Centers and Cavity Centers Axial Distance Between Drive Hole Centers Drive Hole Diameter Diameter of Cavity Piercing Embossed Tape Thickness Top Tape Thickness DESCRIPTION MILLIMETERS Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. Dependent on Chip Size to Minimize Rotation. 8 0.2 3.5 0.5 1.75 0.1 4 0.1 2 0.1 4 0.1 1.55 0.05 1.05 0.05 0.3 Max 0.1 Max
NOTE: Dimensions in millimeters.
t1 D0 P0 P2 E PLASTIC CARRIER TAPE PRODUCT IDENTIFYING LABEL
F K0 B0
W
t2
D1
P1
A0
EMBOSSMENT TOP TAPE
8mm NOMINAL
178mm OR 330mm DIA. REEL
Standard Shipping Quantities
DEVICE SIZE 1206 "13" INCH REEL ("T" OPTION) 10,000 "7" INCH REEL ("H"OPTION) 2,500 BULK PACK ("A" OPTION) 2,500
157
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