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19-2844; Rev 0; 4/03
15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP
General Description
The MAX3355E integrates a charge pump and comparators to enable a system with an integrated USB onthe-go (OTG) dual-role transceiver to function as a USB OTG dual-role device. USB OTG facilitates the direct connection of peripherals and mobile devices such as PDAs, cellular phones, MP3 players, and digital cameras to one another without a host PC. The MAX3355E's internal charge pump supplies VBUS power and signaling that is required by the transceiver as defined in On-the-Go Supplement to the USB 2.0 Specification, Revision 1.0. The MAX3355E features ID detection and internal comparators for monitoring VBUS. The VBUS status outputs are used during negotiation for the USB according to the session request protocol (SRP) and host negotiation protocol (HNP). The MAX3355E operates with logic supply voltages (VL) as low as 1.65V, ensuring compatibility with lowvoltage ASICs. The device also features a logic-selectable 1A shutdown mode. The MAX3355E has built-in 15kV ESD-protection circuitry to protect the VBUS and ID_IN pins. The device is available in a miniature 4 x 3 chip-scale package (UCSP), as well as a 14-pin TSSOP package, and is specified for operation over the -40C to +85C extended temperature range.
Features
o Guaranteed 8mA (min) VBUS Charge-Pump Output o 15kV ESD Protection on VBUS and ID_IN o Up to +6.0V Backdrive Capability for VBUS o +2.6V to +5.5V Operating Voltage Range o VL Operates Down to +1.65V o Guaranteed VBUS Input Impedance When Not Driven o Automatic CLOAD Detection o Comparators for Host Negotiation Protocol o ID_IN Detection o Available in 4 x 3 UCSP or 14-Pin TSSOP Package
MAX3355E
Ordering Information
PART MAX3355EEBC-T* MAX3355EEUD TEMP RANGE -40C to +85C -40C to +85C PINPACKAGE 4 x 3 UCSP 14 TSSOP TOP MARK ABE --
*Future product--contact factory for availability. Pin Configurations appear at end of data sheet.
Applications
Cell Phones PDAs MP3 Players Digital Cameras
Functional Diagram
VCC C+ CVCC LOGIC SUPPLY +1.65V TO VCC VL CURRENT SOURCE ESD OFFVBUS SHDN STATUS1 STATUS2 DUAL-ROLE ASIC ID_OUT ESD LEVEL SHIFTER ON/OFF CHARGE PUMP 5V AT 8mA STATUS1 STATUS2 VBUS COMPARATORS 40k TO 100k USB CONNECTOR GND GND VBUS VBUS
MAX3355E
ID_IN
ID
USB XCVR
D+ D-
________________________________________________________________ Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim's website at www.maxim-ic.com.
15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP MAX3355E
ABSOLUTE MAXIMUM RATINGS
(All voltages referenced to GND) VCC, VL, VBUS, ID_IN.............................................-0.3V to +6.0V C+..................................................................(VCC - 0.3V) to +6V C-................................................................-0.3V to (VCC + 0.3V) OFFVBUS, SHDN, STATUS1, STATUS2, ID_OUT ....................................-0.3V to (VL + 0.3V) VBUS Short Circuit to GND .........................................Continuous Output Current (all other pins)..........................................15mA Continuous Power Dissipation (TA = +70C) 4 x 3 UCSP (derate 6.5mW/C above +70C) .............520mW 14-Pin TSSOP (derate 9.1mW/C above +70C) .........727mW Operating Temperature Range ...........................-40C to +85C Storage Temperature Range .............................-65C to +150C Junction Temperature ......................................................+150C Lead Temperature (soldering 10s) ..................................+300C Bump Temperature (soldering) Infrared (15s) ...............................................................+200C Vapor Phase (20s) .......................................................+215C
Stresses beyond those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
ELECTRICAL CHARACTERISTICS
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, C1 = 0.1F, VCC decoupled with 1F capacitor to GND, VL decoupled with 0.1F capacitor to GND, CLOAD = 1F (min), ESRLOAD = 1 (max), TA = TMIN to TMAX. Typical values are at VCC = +3.0V, VL = 1.8V, TA = +25C, unless otherwise noted.) (Notes 1, 2)
PARAMETER Supply Voltage Logic Supply Voltage Logic Supply Current SYMBOL VCC VL IL No activity on VBUS; comparator and reference active Operating Supply Current ICC Device A configured, OFFVBUS = VL, ILOAD = 8mA, charge pump on Device B configured, SHDN = GND Device A configured, SHDN = GND Device A configured, OFFVBUS = VL, charge pump on Device A configured, OFFVBUS = VL, charge pump on VOH VOL VIH VIL ILKG OFFVBUS, SHDN = GND or VL ILOAD = 0 to 8mA, CLOAD = 1F, OFFVBUS = VL, ID_IN = GND No load, CLOAD = 1F, OFFVBUS = VL, ID_IN = GND OFFVBUS = GND OFFVBUS = GND, VBUS = +6.0V ISOURCE = +1mA ISINK = -1mA 2/3 x VL 0.4 1 2/3 x VL 0.4 30 +150 +20 CONDITIONS MIN 2.6 1.65 TYP MAX 5.5 VCC 100 200 20 1 UNITS V V A A mA A C C
Shutdown Supply Current Thermal-Shutdown Protection Threshold Thermal-Shutdown Protection Hysteresis LOGIC INPUTS AND OUTPUTS STATUS1, STATUS2, ID_OUT Output Voltage OFFVBUS, SHDN Input Voltage Input Leakage Current
ICCSHDN
V V A
VBUS OUTPUT VOLTAGE: DEVICE A CONFIGURED 4.63 4.8 200 150 mV A 5.25 V
VBUS Output Voltage
VBUS Leakage Voltage VBUS Sink Current
2
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15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP
ELECTRICAL CHARACTERISTICS (continued)
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, C1 = 0.1F, VCC decoupled with 1F capacitor to GND, VL decoupled with 0.1F capacitor to GND, CLOAD = 1F (min), ESRLOAD = 1 (max), TA = TMIN to TMAX. Typical values are at VCC = +3.0V, VL = 1.8V, TA = +25C, unless otherwise noted.) (Notes 1, 2)
PARAMETER VBUS Source Current VBUS Short-Circuit Current Limit VBUS Output Ripple Charge-Pump Switching Frequency VBUS Input Impedance RINVBUS OFFVBUS = GND or SHDN = GND CLOAD = 20F, OFFVBUS = VL, ID_IN = VCC, IBUS source on-time = tVBUSCHRG CLOAD = 95F, OFFVBUS = VL, ID_IN = VCC, IBUS source on-time = tVBUSCHRG OFFVBUS = VL, ID_IN = VCC (Note 4) tVBUSCHRG OFFVBUS = VL, ID_IN = VCC, Device B (Note 4) VBUS rising 450 155 (max) 4.4 600 105 40 LOAD DETECTION VBUS OUTPUT VOLTAGE 2.1 V 1.9 850 56 (min) 4.63 A ms SYMBOL CONDITIONS OFFVBUS = VL, ID_IN = GND VBUS shorted to GND ILOAD = 8mA, CLOAD = 1F, OFFVBUS = VL, ID_IN = GND (Note 3) 100 500 100 MIN 8 200 TYP MAX UNITS mA mA mV kHz k
MAX3355E
VBUS Output Voltage
VBUS Source Current VBUS Current Gate Time VBUS COMPARATOR VBUS Valid Comparator Threshold VBUS Valid Comparator Hysteresis Session Valid Comparator Threshold Session Valid Comparator Hysteresis B-Session End Comparator Threshold B-Session End Comparator Hysteresis Shutdown Comparator ID_IN ID_IN Voltage Input for Device B ID_IN Voltage Input for Device A ID_IN Input Impedance ESD PROTECTION (ID_IN, VBUS) Human Body Model IFC 1000-4-2 Air-Gap Discharge IFC 1000-4-2 Contact Discharge VTH,SHDN VTHSESEND VTHSESVLD VTHVBUSVLD
4.55 20
V mV
1.12
1.4 15
1.68
V mV
0.4
0.5 30
0.6
V mV
0.8 2/3 x Vcc
2.4
V V
0.4 150 200 15 15 8 250
V k kV kV kV
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15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP MAX3355E
TIMING CHARACTERISTICS
(VCC = +2.6V to +5.5V, VL = +1.65V to VCC, C1 = 0.1F, VCC decoupled with 1F capacitor to GND, VL decoupled with 0.1F capacitor to GND, CLOAD = 1F (min), ESRLOAD = 1 (max), TA = TMIN to TMAX. Typical values are at VCC = +3.0V, VL = 1.8V, TA = +25C, unless otherwise noted.) (Notes 1, 2)
PARAMETER VBUS Rise Time OFFVBUS Propagation Delay Comparator Propagation Delay Time to Exit Shutdown Time to Shutdown ID_OUT Rise Time ID_OUT Fall Time CID_OUT = 50pF CID_OUT = 50pF SYMBOL CONDITIONS 0 to 4.4V, CLOAD = 1F, ILOAD = 8mA 6 3 50 1 10 10 MIN TYP MAX 100 UNITS ms s s s s ns ns
Note 1: Limits are 100% production tested at +25C. Limits over temperature are guaranteed by design. Note 2: All currents out of the device are positive; all currents into the device are negative. All voltages are referenced to device ground unless otherwise specified. Note 3: The ripple voltage is strongly correlated to the bus capacitance and its ESR. Note 4: The VBUS current source and current gate time vary together with process and temperature such that the resulting VBUS pulse is guaranteed to drive a <13F load to a voltage >2.0V, and to drive a >96F load to a voltage <2.2V.
Typical Operating Characteristics
(VCC, VL = +3.3V, C1 = 0.1F, VCC decoupled with 1F capacitor to GND, VL decoupled with 0.1F capacitor to GND, CLOAD = 1F min, ESRLOAD = 1 max, TA = +25C, unless otherwise noted.)
VCC INPUT CURRENT vs. VBUS OUTPUT CURRENT
MAX3355E toc01
VBUS OUTPUT VOLTAGE vs. VBUS OUTPUT CURRENT
MAX3355E toc02
VBUS OUTPUT RIPPLE VOLTAGE vs. VCC INPUT VOLTAGE
IVBUS = 8mA VBUS OUTPUT RIPPLE VOLTAGE (mV) 125 100 75 50 25 0
MAX3355E toc03
120 100 VCC INPUT CURRENT (mA) 80 60 40 20 0 0 10 20 30 40 VCC = 2.6V VCC = 4.0V VCC = 5.5V
5.25 5.00
150
VBUS OUTPUT VOLTAGE (V)
VCC = 4.0V
4.75 VCC = 5.5V VCC = 2.6V 4.25
4.50
50
4.00 0 10 20 30 40 50 VBUS OUTPUT CURRENT (mA)
2.5
3.0
3.5
4.0
4.5
5.0
5.5
VBUS OUTPUT CURRENT (mA)
VCC INPUT VOLTAGE (V)
4
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15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP
Typical Operating Characteristics (continued)
(VCC, VL = +3.3V, C1 = 0.1F, VCC decoupled with 1F capacitor to GND, VL decoupled with 0.1F capacitor to GND, CLOAD = 1F min, ESRLOAD = 1 max, TA = +25C, unless otherwise noted.)
VBUS OUTPUT VOLTAGE vs. VCC INPUT VOLTAGE
5.2 VBUS OUTPUT VOLTAGE (V) 5.0 4.8 4.6 IVBUS = 8mA 4.4 4.2 4.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 VCC INPUT VOLTAGE (V) 65 -40 -15 10 35 60 85 TEMPERATURE (C) IVBUS = 0mA
MAX3355E toc04
MAX3355E
VBUS INPUT IMPEDANCE vs. TEMPERATURE
MAX3355E toc05
5.4
70 69
VBUS INPUT IMPEDANCE (k)
68
67
66
SUPPLY CURRENT vs. TEMPERATURE
IVBUS = 8mA 19 VCC = 2.6V 18 VCC = 4.0V 0 17 VCC = 5.5V 16 -40 -15 10 35 60 85 0
MAX3355E toc06
VBUS vs. CAPACITANCE LOAD DURING LOAD DETECTION
MAX3355E toc07
20
SUPPLY CURRENT (mA)
CVBUS = 10F 1V/div
CVBUS = 96F 1V/div
40ms/div
TEMPERATURE (C)
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15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP MAX3355E
Pin Description
PIN UCSP A1 A2 A3 A4 TSSOP 2 3 5 6 NAME VCC ID_OUT STATUS1 STATUS2 FUNCTION Power Supply. +2.6V to +5.5V input supply. Bypass VCC to GND with a 1F capacitor. Device ID Output. Output of ID_IN level translated to VL. Status Output 1. Provides output voltage detection for use during HNP handshaking (Tables 1 and 2). Status Output 2. Provides output voltage detection for use during HNP handshaking (Tables 1 and 2). USB Supply. VBUS provides a nominal +5.0V output when ID_IN is low and OFFVBUS is high. VBUS is lower than +2.1V when ID_IN is open or a load greater than 96.5F is sensed. VBUS can be backdriven to +6.0V without any consequence. Bypass VBUS to GND with a 1F capacitor. VBUS Off. Turns the internal charge pump providing VBUS on and off. Shutdown. Connect SHDN to GND to enter shutdown and reduce supply current to less than 1A. Connect SHDN to VL for normal operation. Logic Supply. VL sets the logic output high voltage and logic input high threshold. VL must be between +1.65V and VCC. Charge-Pump Positive Connection Charge-Pump Negative Connection Ground Device ID. ID_IN is internally pulled up to VCC. Leave ID_IN open for device B and connect ID_IN to GND for device A. No Connection
B1 B2 B3 B4 C1 C2 C3 C4 --
1 4 11 9 14 13 12 10 7, 8
VBUS OFFVBUS SHDN VL C+ CGND ID_IN N.C.
Typical Application Circuit
VCC 1F VCC C+ C1 0.1F VL 0.1F C-
VL
MAX3355E
OFFVBUS ID_OUT STATUS1 P STATUS2 SHDN ID_IN GND USB OTG CONNECTOR VBUS CLOAD 1F
OTG SIE
D+ D-
6
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15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP
Detailed Description
USB OTG is an emerging USB standard that enables devices to talk in a peer-to-peer manner on a USB bus. OTG allows peripherals and mobile devices such as PDAs, cellular phones, and digital cameras to be attached directly to one another without requiring a PC host. The MAX3355E integrates a charge pump and comparators to enable a system with an integrated USB OTG dual-role transceiver to function as a USB OTG dual-role device. The MAX3355E's internal charge pump supplies V BUS power and signaling as defined in On-the-Go Supplement: USB 2.0, Revision 1.0. The MAX3355E's internal level-detection comparators monitor important VBUS voltages needed to support SRP and HNP.
Charge Pump
The MAX3355E provides power for the VBUS line using an internal charge pump. The charge pump provides an OTG-compliant output on VBUS while sourcing 8mA load current. The charge pump can be powered from voltages between +2.6V and +5.5V. A 0.1F flying capacitor, connected between C+ and C-, and a 1F (min) decoupling reservoir capacitor on V BUS are required for proper operation. The charge pump is active if OFFVBUS is connected to VL and the MAX3355E is configured as device A (ID_IN connected to GND). To minimize VBUS ripple, select a reservoir capacitor value between 1F and 6.8F. The charge-pump output is protected from short-circuit conditions on VBUS by an internal current clamp that limits the VBUS current to 200mA.
MAX3355E
Current Generator
Table 1. Status Bit Significance
STATUS1 0 1 0 1 STATUS2 0 0 1 1 SIGNIFICANCE VBUS < VTHSESEND VTHSESEND < VBUS < VTHSESVLD VTHSESVLD < VBUS < VTHVBUSVLD VBUS > VTHVBUSVLD
An internal current generator injects up to 600A of current onto the VBUS line. The current generator is stable over the supply voltage variation. The current generator is connected to VBUS when OFFVBUS and SHDN are 1 and ID_IN is open. It remains connected for tVBUSCHRG or until the VBUS line voltage exceeds the lower of VCC and 4.82V.
Comparators
The MAX3355E contains internal comparators for monitoring the VBUS voltage. The status of VBUS is summarized in two status outputs: STATUS1 and STATUS2. The status outputs can be used to negotiate for the USB OTG bus. The VBUS status is conveyed according to Table 1. While in shutdown mode, the STATUS2 output can be used to indicate VBUS voltage (Table 2).
Table 2. Status Bit Shutdown Functionality (SHDN = GND)
STATUS1 0 0 STATUS2 1 0 SIGNIFICANCE VBUS < VTH,SHDN VBUS > VTH,SHDN
Device ID
Configure the MAX3355E as device A by connecting ID_IN to GND and as device B by leaving ID_IN open (Table 3). ID_IN is level translated to VL and provided as an output at ID_OUT. VL sets the logic output high level. ID_IN is internally pulled up to VCC.
Table 3. Device ID
ID_IN 0 Open ID_OUT 0 VL CONFIGURATION Device A Device B
Table 4. Function Select
SHDN 0 1 1 1 OFFVBUS X 0 1 1 ID_IN X X 0 1 VBUS RINVBUS RINVBUS 5V RINVBUS (Note 5) CHARGE PUMP Inactive Inactive Active Inactive COMPARATORS Inactive Active Active Active
Note: The 600A current source is supplied for tVBUSCHRG (see the Current Generator section). _______________________________________________________________________________________ 7
15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP MAX3355E
RC 1M CHARGE-CURRENTLIMIT RESISTOR HIGHVOLTAGE DC SOURCE RD 1.5k DISCHARGE RESISTANCE DEVICE UNDER TEST
HIGHVOLTAGE DC SOURCE RC 50 to 100 CHARGE-CURRENTLIMIT RESISTOR RD 330 DISCHARGE RESISTANCE DEVICE UNDER TEST
Cs 100pF
STORAGE CAPACITOR
Cs 150pF
STORAGE CAPACITOR
Figure 1. Human Body ESD Test Model
Figure 3. IEC 1000-4-2 ESD Test Model
IP 100% 90% AMPERES 36.8% 10% 0 0 tRL
Ir
PEAK-TO-PEAK RINGING (NOT DRAWN TO SCALE)
have extra protection against static electricity to protect the device up to 15kV. For 15kV protection on VBUS, a 1F capacitor must be connected from VBUS to GND as close to the device as possible. The ESD structures withstand high ESD in all states--normal operation, shutdown, and powered down. ESD protection can be tested in various ways. The ID_IN input and VBUS are characterized for protection to the following limits: 1) 15kV using the Human Body Model 2) 8kV using the IEC 1000-4-2 Contact Discharge method 3) 15kV using the IEC 1000-4-2 Air-Gap Discharge method ESD performance depends on a variety of conditions. Contact Maxim for a reliability report that documents test setup, test methodology, and test results. Human Body Model Figure 1 shows the Human Body Model and Figure 2 shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5k resistor. IEC 1000-4-2 The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment. It does not specifically refer to integrated circuits. The MAX3355E helps the user design equipment that meets Level 4 of IEC 1000-4-2, without the need for additional ESD-protection components. The major difference between tests done using the Human Body Model and IEC 1000-4-2 is a higher peak current in IEC 1000-4-2. This occurs because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD withstand voltage measured to
TIME tDL CURRENT WAVEFORM
Figure 2. Human Body Current Waveform
OFFVBUS
Connect OFFVBUS to GND to disable VBUS and the charge pump (Table 4). For normal VBUS operation, connect OFFVBUS to VL. When OFFVBUS = GND, VBUS impedance is between 40k to 100k as defined in Onthe-Go Supplement: USB 2.0, Revision 1.0.
SHDN
The MAX3355E shutdown mode reduces supply current to less than 1A. To enter shutdown mode, connect SHDN to GND. Shutdown mode disables the charge pump and comparators (Table 4). While in shutdown mode, the STATUS1 output defaults to logic 0 and STATUS2 indicates VBUS. During shutdown, if VBUS is externally driven above VTH,SHDN (defined in the Comparators section), the MAX3355E sinks current from VCC.
Applications Information
15kV ESD Protection
To protect the MAX3355E against ESD, ID_IN and VBUS
8
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15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP
IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 3 shows the IEC 1000-4-2 model. The Air-Gap Discharge test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized. Machine Model The Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. All pins require this protection during manufacturing. After PC board assembly, the Machine Model is less relevant to I/O ports.
Layout Considerations
The MAX3355E charge-pump switching frequency makes proper layout important to ensure stability and maintain the output voltage under all loads. For best performance, minimize the distance between the capacitors and the MAX3355E.
MAX3355E
UCSP Applications Information
For the latest application details on UCSP construction, dimensions, tape-carrier information, printed circuit board techniques, bump-pad layout, and recommended reflow temperature profile, as well as the latest information on reliability testing results, refer to Maxim Application Note: UCSP-A Wafer-Level Chip-Scale Package available on Maxim's web site at www.maxim-ic.com/ucsp.
Pin Configurations
TOP VIEW
TOP VIEW
1
2
3
4
VBUS 1 VCC ID_OUT 2 3
14 C+ 13 C12 GND A VBUS B C+ C VCC
MAX3355E
ID_OUT STATUS1 STATUS2
OFFVBUS 4 STATUS1 5 STATUS2 6 N.C. 7
MAX3355E
11 SHDN 10 ID_IN 9 8 VL N.C.
OFFVBUS
SHDN
VL
C-
GND
ID_IN
TSSOP
UCSP
Chip Information
TRANSISTOR COUNT: 1601 PROCESS: BiCMOS
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15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP MAX3355E
Package Information
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
12L, UCSP 4x3.EPS
10
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15kV ESD-Protected USB On-the-Go Charge Pump and Comparators in UCSP
Package Information (continued)
(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to www.maxim-ic.com/packages.)
TSSOP4.40mm.EPS
MAX3355E
Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.
Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________ 11 (c) 2003 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products.

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