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| MN103S33N Type Command ROM (x 64-bit) x Data RAM (x 32-bit) x Package Minimum Instruction Execution Time Interrupts Timer Counter MN103S33N (under development) 512 K-byte 24 K-byte MLGA344-C-1313 *Lead-free 24.3 ns (at 2.3 V to 2.7 V, 41 MHz) * RESET * IRQ x 15 * NMI * Key input * Timer x 44 * Input capture x 16 * PWM x 8 * SIF x 25 * DMA x 12 * WDT * A/D * System error 8-bit timer x 12 Reload-down count Cascade connection possible (usable as a 16-bit to 32-bit timer) 8-bit timer with PWM x 8 Reload-down count Cascade connection possible (usable as a 16-bit to 32-bit timer) PWM generating function 16-bit timer x 6 Up-down count Input capture function PWM generating function Compare/capture register 2-ch. 16-bit timer x 6 Reload-down count Watchdog timer x 1 DMA Controller Number of channels: 4 Unit of transfer: 8/16/32 bits Max. Transfer cycles: 65535 Staring factor: external interrupt, timer factor, PWM factor, serial transmission/reception factor, A/D conversion finish, software factor Transfer method: 2-bus cycle transfer Adressing modes: fixed, increment, decrement Transfer modes: word transfer, burst transfer, intermittent transfer Serial 0, 1, 3 to 8, A, B: start-stop synchronization/synchronization/I2C commonly used, 10 lines Serial 2, 9: 2 lines for start-stop synchronization only, serial 2: 10 bytes containing receive FIFO Serial Interface I/O Pins A/D Inputs PWM ICR OCR Timer Synchronous Output I/O Input 169 25 * Common use * Common use 10-bit x 25-ch. 12-, 14-bit resolution x 5-ch. output waveform value load control function provided 16-bit resolution x 2-ch. 28-bit x 13-ch. + 16-bit x 6-ch. (common with timer) 16-bit x 12-ch. (common with timer) 4-bit (synchronous output) x 2-ch. 1 MAF00005DEM MN103S33N Electrical Characteristics Pin Assignment T.B.D. Perspective PF3, PF1, PD5, VDD2 PD2, TDI TM25IOB TM24IOB PF2, PE0, TM15IO TM12IO PE5, PE3, PC6, PC4, SY1OT2, SY1OT0, SBT8 SBI8 PC2, VDD2 SY0OT2 PC1, PB5, BG PC0, PB2, VSS IRQ14 PB4, BR PB1, IRQ13 PB0, IRQ12 PA4, SBO7 PA5, SBT7 P93, ICR11 PA2, SBT6 PA0, SBI6 PA3, SBI7 P94, ICR12 PA1, SBO6 N.D. P91, ICR9 VSS P87, ICR7 P85, ICR5 P83, ICR3 P60, IRQ8 VSS P84, ICR4 P56, IRQ6 P52, P81, ICR1 P80, ICR0 P62, IRQ10 P54, IRQ4 P34, D28, SBI3 P43, PWM4 P41, PWM2, TM1IO P37, D31, PWM0 P31, D25, SBI2 P23, D19, SBI0 N.C.*1 (VSS) P17, N.D. P63, IRQ11 P33, D27, SBT2 P25, D21, SBT0 P53, IRQ3 VSS P61, IRQ9 N.C.*2 (VDDF) P57, IRQ7 P51, IRQ1 P40, PWM1, TM0IO P35, D29, SBO3 P30, D24, SBT1 P26, D22, SBI1 VSS N.C.*2 (VDDF) P11, D9 P05, D5 P01, D1 electrode (pin) none VSS W V U T R P N M L K J H G F E D C B N.D. PD3, N.D. TDO PV0, SBIA PV3, ADTRG PG3, AN3 PG7, AN7 PH5, AN13 PI5, AN21 AVSS AVDD VSS PV2, SBTA PG6, TCK TM25IOA TM20IOA TM22IOB TM21IOB TM13IO PV1, SBOA VREFL PE6, PE2, PD4, TM14IO PE4, PD1, PC7, P92, ICR10 VDD2 P86, ICR6 P82, ICR2 TM23IOA TM21IOA PF0, TM11IO SY1OT3 SY0OT1 PE7, PE1, PD0, TMS TM24IOA TM22IOA TM23IOB TM20IOB TM10IO SY0OT0 AN6 PG2, VDD AN2 PG4, VREFH AN4 PG5, AN5 PH3, AN11 PI3, AN19 PI7, AN23 PH2, AN10 PH4, AN12 PH7, AN15 PH6, AN14 PI2, VDDB CS1 AN18 PM0, CS0 PM5, RWSEL VDD PM2, CS2 PM4, CS4 PN4, DK PN5, AS PN0, WE0, SDQM0 VSS PG1, AN1 PH1, AN9 PI1, AN17 PI4, AN20 TRST N.D. VDD N.C.*1 (VSS) VSS PC5, PC3, PB3, SY1OT1, SBO8 SY0OT3 WDOVF N.D. N.D. N.D. N.C.*1 (VSS) N.D. P90, ICR8 N.D. N.D. PG0, N.D. N.D. N.D. N.D. IRQ2 P50, P55, IRQ5 P42, PWM3, TM2IO VSS P24, D20, SBO0 P16, D14 VDDH D8 P02, N.D. IRQ0 N.D. P36, D30, SBT3 P27, D23, SBO1 P21, D17, SBOB P12, N.D. AN0 PH0, N.D. AN8 PI0, N.D. AN16 PI6, N.D. AN22 P70, N.D. AN24 VSS N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. VDDH P32, D26, SBO2 P22, D18, SBTB P20, D16, SBIB P13, D11 P07, D7 P03, D3 P14, D12 VOUT N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. VSS PM3, CS3 PN2, SYSCLK PO0, ADM0, A0 VDDB PO3, ADM3, A3 PO6, ADM6, A6 PM1, N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. D10 P10, N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. D15 P15, VSS D13 P00, P06, D6 P04, VOUT D4 PS3, VDDH VDD N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. N.D. D2 N.D. N.D. N.D. N.D. N.D. N.D. PK3, N.D. PL2, N.D. PR1, A20, KI1 PR2, A21, KI2, SWE PQ0, A16 PR0, A19, KI0 PQ1, N.D. PR7, KI7, PWM5 PS0, N.D. VSS D0 PT1, PO5, PO1, PN1, ADM5, WE1, ADM1, A5 A1 SDQM1 PO2, ADM2, A2 PN3, RE PO7, ADM7, A7 VSS N.D. PVSS MMOD1 VSS TM33IO TM5IO PK4, PL3, N.D. SBO9 PS5, VSS VSS RST VDDH CKSEL VDD TM34IO TM6IO PL4, TM7IO PL5, SBI4 PQ2, A18 PR5, A24, KI5, SDCLKI PR3, A22, KI3, SCKE PO4, PP2, VDDB ADM10, ADM4, A4 A10 PK1, PK5, PK7, PK0, PL1, PP4, ADM12, TM31IO TM35IO TM37IO TM30IO TM4IO A12 PK2, FRQS PK6, PP7, PJ1, PP3, PP6, PJ0, ADM14, EXMOD0 ADM11, ADM15, A15 EXMOD1 A11 A14 PP0, ADM8, A8 PP5, PP1, ADM9, ADM13, A13 A9 PVDD MMOD0 SBT5 SBI5 PR4, PU0, A23, VDDH WE2, KI4, SDCLKO SCAS PS2, PT0, PS1, SBT4 PR6, A25, KI6 SBI9 PS4, SBO5 SBO4 PT2, SBT9 NMIRQ VDDH TM32IO TM36IO PWM6 PL0, OSCO OSCI TM3IO VSS LON PU1, WE3, SRAS N.D. A17 A 1 19 18 17 16 15 14 13 12 11 10 MLGA344-C-1313 9 8 7 6 5 4 3 2 *Lead-free * N.D.has an electrode (pin) but N.C.is not guaranteed. Please design so as not to cause short circuit with other wiring on the user board. * Each of VDDH, VDD, VDDB, VDDF, VDD2, and VSS has multiple electrodes (pins). Connect the same electrode names to the same power supply. *1: Connect the J3, R6, and R12 pins to the VSS for the MN103SF33N. *2: Connect the H1 and T1 pins to the VDDF power for the MN103SF33N. MAF00005DEM 2 SupportTool In-circuit Emulator On-board Development Tools Flash Memory Built-in Type PX-ICE103S33 PX-ODB103S-O Type Command ROM (x 64-bit) Data RAM (x 32-bit) Minimum instruction execution time Package MN103SF33N (under development) 512 K-byte 24 K-byte 24.3 ns (at 2.3 V to 2.7 V, 41 MHz) MLGA344-C-1313 *Lead-free Not applicable to MLGA344-C-1313. 304 MAF00005DEM MN103S33N MAF00005DEM 4 Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technologies described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the product or technologies as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: * Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. * Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd. 2002 JUL |
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