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| (R) Thermal Data PLCC 20 20 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity 2.61 W/cmC 0.01 W/cmC leadframe die attach copper epoxy glue ( silver filler ) epoxy resin 0.25 mm 10-40 m molding compound 3.6 mm 0.0063W/cmC Charts enclosed : 1) Rth(j-a) vs power dissipation 2) Rth(j-a) vs on board trace area 3) Zth(j-a) vs time width and die size February 1998 1/2 Thermal Data Rth(j-a) (C/W) 180 die pad = 140 x 140 sq.mils die size = 80 x 120 sq.mils PLCC 20 160 140 floating in air 1) 120 100 mounted on SM PCB5A board 80 mounted on SM PCB5 board 0 0.2 0.4 0.6 0.8 1 1.2 dissipated power ( Watt ) 1.4 1.6 1.8 2 Rth(j-a) (C/W) 105 die size = 80 x 120 sq.mils die pad = 140 x 140 sq.mils Pd =1 W 100 2) 95 90 85 80 75 70 0 50 100 150 200 250 on board trace area ( x 1000 sq. mils ) 300 350 Transient Thermal Resistance (C/W) 100 SINGLE PULSE 3) 50 mounted on SM PCB5 board Pd = 2 Watt 20 10 5 die pad = 140 x 140 sq.mils die size = 80 x 120 sq.mils on die dissipating area = 2000 sq.mils 2 1 0.001 0.01 0.1 1 Time or pulse width ( s ) 10 100 1,000 2/2 |
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