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| Previous Datasheet Index Next Data Sheet Provisional Data Sheet PD 9.679C REPETITIVE AVALANCHE AND dv/dt RATED IRHN7250 IRHN8250 N-CHANNEL HEXFET(R) TRANSISTOR 200 Volt, 0.10, MEGA RAD HARD HEXFET International Rectifier's MEGA RAD HARD technology HEXFET power MOSFETs demonstrate excellent threshold voltage stability and breakdown voltage stability at total radiation doses as high as 1 x 106 Rads (Si). Under identical pre- and post-radiation test conditions, International Rectifier's RAD HARD HEXFETs retain identical electrical specifications up to 1 x 105 Rads (Si) total dose. At 1 x 106 Rads (Si) total dose, under the same pre-dose conditions, only minor shifts in the electrical specifications are observed and are so specified in table 1. No compensation in gate drive circuitry is required. In addition, these devices are capable of surviving transient ionization pulses as high as 1 x 1012 Rads (Si)/Sec, and return to normal operation within a few microseconds. Single Event Effect (SEE) testing of International Rectifier RAD HARD HEXFETs has demonstrated virtual immunity to SEE failure. Since the MEGA RAD HARD process utilizes International Rectifier's patented HEXFET technology, the user can expect the highest quality and reliability in the industry. RAD HARD HEXFET transistors also feature all of the well-established advantages of MOSFETs, such as voltage control, very fast switching, ease of paralleling and temperature stability of the electrical parameters. They are well-suited for applications such as switching power supplies, motor controls, inverters, choppers, audio amplifiers and high-energy pulse circuits in space and weapons environments. MEGA RAD HARD Product Summary Part Number IRHN7250 IRHN8250 BVDSS 200V 200V RDS(on) 0.10 0.10 ID 26A 26A Features: s s s s s s s s s s s s s Radiation Hardened up to 1 x 10 6 Rads (Si) Single Event Burnout (SEB) Hardened Single Event Gate Rupture (SEGR) Hardened Gamma Dot (Flash X-Ray) Hardened Neutron Tolerant Identical Pre- and Post-Electrical Test Conditions Repetitive Avalanche Rating Dynamic dv/dt Rating Simple Drive Requirements Ease of Paralleling Hermetically Sealed Surface Mount Light-weight Absolute Maximum Ratings Parameter I D @ VGS = 12V, TC = 25C Continuous Drain Current ID @ VGS = 12V, TC = 100C Continuous Drain Current IDM Pulsed Drain Current PD @ TC = 25C Max. Power Dissipation Linear Derating Factor VGS Gate-to-Source Voltage EAS Single Pulse Avalanche Energy I AR Avalanche Current EAR Repetitive Avalanche Energy dv/dt Peak Diode Recovery dv/dt TJ Operating Junction TSTG Storage Temperature Range Package Mounting Surface Temperature Weight 26 16 104 150 1.2 20 500 26 15 5.0 -55 to 150 Pre-Radiation IRHN7250, IRHN8250 Units A W W/K V mJ A mJ V/ns oC 300 (for 5 sec.) 2.6 (typical) g To Order F-347 Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Pre-Radiation Electrical Characteristics @ Tj = 25C (Unless Otherwise Specified) Parameter BVDSS Drain-to-Source Breakdown Voltage BVDSS/TJ Temperature Coefficient of Breakdown Voltage RDS(on) Static Drain-to-Source On-State Resistance VGS(th) Gate Threshold Voltage gfs Forward Transconductance IDSS Zero Gate Voltage Drain Current Min. 200 -- -- -- 2.0 8.0 -- -- -- -- -- -- -- -- -- -- -- -- Typ. Max. Units -- 0.28 -- -- -- -- -- -- -- -- -- -- -- -- -- -- -- 2.0 -- -- 0.10 0.11 4.0 -- 25 250 100 -100 170 30 60 33 140 140 140 -- V V/C V S( ) A nA nC Test Conditions VGS = 0V, ID = 1.0 mA Reference to 25C, ID = 1.0 mA VGS = 12V, ID = 16A VGS = 12V, ID = 26A VDS = VGS, ID = 1.0 mA VDS > 15V, I DS = 16A VDS = 0.8 x Max Rating,VGS = 0V VDS = 0.8 x Max Rating VGS = 0V, TJ = 125C VGS = 20V VGS = -20V VGS =12V, I D = 26A VDS = Max. Rating x 0.5 (see figures 23 and 31) VDD = 100V, ID = 26A, RG = 2.35 (see figure 22) Measured from the Modified MOSFET drain lead, 6mm (0.25 symbol showing the in.) from package to internal inductances. center of die. Measured from the source lead, 6mm (0.25 in.) from package to source bonding pad. IGSS IGSS Qg Qgs Qgd t d(on) tr td(off) tf LD Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Total Gate Charge Gate-to-Source Charge Gate-to-Drain (`Miller') Charge Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Internal Drain Inductance ns LS Internal Source Inductance -- 4.1 -- nH Ciss Coss Crss Input Capacitance Output Capacitance Reverse Transfer Capacitance -- -- -- 4700 850 210 -- -- -- pF VGS = 0V, VDS = 25V f = 1.0 MHz (see figure 22) Source-Drain Diode Ratings and Characteristics Parameter IS I SM Continuous Source Current (Body Diode) Pulse Source Current (Body Diode) Min. Typ. Max. Units -- -- -- -- 26 104 Test Conditions Modified MOSFET symbol showing the integral reverse p-n junction rectifier. A VSD t rr Q RR t on Diode Forward Voltage Reverse Recovery Time Reverse Recovery Charge Forward Turn-On Time -- -- -- -- 1.9 820 12 V ns C Tj = 25C, IS = 26A, VGS = 0V Tj = 25C, IF = 26A, di/dt 100A/s VDD 50V Intrinsic turn-on time is negligible. Turn-on speed is substantially controlled by LS + LD. Thermal Resistance Parameter RthJC RthJPCB Junction-to-Case Junction-to-PC board Min. Typ. Max. Units -- -- -- TBD 0.83 K/W -- Test Conditions soldered to a copper-clad PC board F-348 To Order Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Radiation Performance of Mega Rad Hard HEXFETs International Rectifier Radiation Hardened HEX-FETs are tested to verify their hardness capability. The hardness assurance program at International Rectifier uses two radiation environments. Every manufacturing lot is tested in a low dose rate (total dose) environment per MlL-STD-750, test method 1019. International Rectifier has imposed a standard gate voltage of 12 volts per note 6 and figure 8a and a VDSS bias condition equal to 80% of the device rated voltage per note 7 and figure 8b. Pre- and post-radiation limits of the devices irradiated to 1 x 105 Rads (Si) are identical and are presented in Table 1, column 1, IRHN7250. Device performance limits at a post radiation level of 1 x 106 Rads (Si) are presented in Table 1, column 2, IRHN8250. The values in Table 1 will be met for either of the two low dose rate test circuits that are used. Typical delta curves showing radiation response appear in figures 1 through 5. Typical postradiation curves appear in figures 10 through 17. Post-Radiation Characteristics Both pre- and post-radiation performance are tested and specified using the same drive circuitry and test conditions in order to provide a direct comparison. It should be noted that at a radiation level of 1 x 105 Rads (Si), no change in limits are specified in DC parameters. At a radiation level of 1 x106 Rads (Si), leakage remains low and the device is usable with no change in drive circuitry required. High dose rate testing may be done on a special request basis, using a dose rate up to 1 x 1012 Rads (Si)/Sec. Photocurrent and transient voltage waveforms are shown in figure 7, and the recommended test circuit to be used is shown in figure 9. International Rectifier radiation hardened HEXFETs have been characterized in neutron and heavy ion Single Event Effects (SEE) environments. The effects on bulk silicon of the type used by International Rectifier on RAD HARD HEXFETs are shown in figure 6. Single Event Effects characterization is shown in Table 3. IRHN8250 Test Conditions VGS = 0V, ID = 1.0 mA VGS = VDS, I D = 1.0 mA VGS = +20V VGS = -20V VDS = 0.8 x Max Rating, VGS = 0 VGS = 12V, ID = 16A TC = 25C, IS = 26A,VGS = 0V min. 200 1.25 -- -- -- -- -- max. -- 4.5 100 -100 50 0.150 1.9 V nA A V Table 1. Low Dose Rate Parameter BVDSS VGS(th) IGSS IGSS IDSS RDS(on)1 VSD Drain-to-Source Breakdown Voltage Gate Threshold Voltage Gate-to-Source Leakage Forward Gate-to-Source Leakage Reverse Zero Gate Voltage Drain Current Static Drain-to-Source On-State Resistance One Diode Forward Voltage IRHN7250 min. 200 2.0 -- -- -- -- -- max. -- 4.0 100 -100 25 0.10 1.9 100K Rads (Si) 1000K Rads (Si) Units Table 2. High Dose Rate 1011 Rads (Si)/sec 1012 Rads (Si)/sec Parameter VDSS IPP di/dt L1 Drain-to-Source Voltage Min. Typ Max. Min. Typ. Max. Units Test Conditions -- -- 160 -- -- 160 V Applied drain-to-source voltage during gamma-dot -- 15 -- -- 15 -- A Peak radiation induced photo-current -- -- 160 -- -- 8.0 A/sec Rate of rise of photo-current 1.0 -- -- 20 -- -- H Circuit inductance required to limit di/dt Table 3. Single Event Effects Parameter BVDSS Typ. 200 Units V Ion Ni LET (Si) (MeV/mg/cm2) 28 Fluence (ions/cm2) 1 x 105 Range (m) ~41 VDS Bias (V) 160 VGS Bias (V) -5 To Order F-349 Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Post-Radiation VGS = 12V ID = 16A Figure 1. - Typical Response of Gate Threshold Voltage Vs. Total Dose Exposure Figure 2. - Typical Response of On-State Resistance Vs. Total Dose Exposure VDS 15V ID = 16A Figure 3. - Typical Response of Transconductance Vs. Total Dose Exposure Figure 4. - Typical Response of Drain-to-Source Breakdown Vs. Total Dose Exposure F-350 To Order Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Post-Radiation Figure 5. - Typical Zero Gate Voltage Drain Current Vs. Total Dose Exposure Figure 6. - Typical On-State Resistance Vs. Neutron Fluence Level Figure 8a. - During Radiation Gate Stress of VGSS = 12V Figure 8b. - During Radiation VDSS Stress = 80% of B VDSS Figure 7. - Typical Transient Response of Rad Hard HEXFET During 1 x1012 Rad (Si)/Sec Exposure Figure 9. - High Dose Rate (Gamma Dot) Test Circuit To Order F-351 Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Radiation Characteristics Note: Bias Conditions during radiation; VGS = 12 V dc, VDS = 0 Vdc Figure 10. - Typical Output Characteristics Pre-Radiation Figure 11. - Typical Output Characteristics Post-Radiation 100K Rads (Si) Figure 12. - Typical Output Characteristics Post-Radiation 300K Rads (Si) Figure 13. - Typical Output Characteristics Post-Radiation 1 Mega Rads (Si) F-352 To Order Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Radiation Characteristics Note: Bias Conditions during radiation; VGS = 0 V dc, VDS = 160 Vdc Figure 14. - Typical Output Characteristics Pre-Radiation Figure 15. - Typical Output Characteristics Post-Radiation 100K Rads (Si) Figure 16. - Typical Output Characteristics Post-Radiation 300K Rads (Si) Figure 17. - Typical Output Characteristics Post-Radiation 1 Mega Rads (Si) To Order F-353 Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Pre-Radiation Figure 18. - Typical Output Characteristics, TC = 25C Figure 19. - Typical Output Characteristics, T C = 150C ID = 26A Figure 20. - Typical Transfer Characteristics Figure 21. - Normalized On-Resistance Vs. Temperature F-354 To Order Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Pre-Radiation ID = 26A Figure 22. - Typical Capacitance Vs. Drain-to-Source Voltage Figure 23. - Typical Gate Charge Vs. Gate-to-Source Voltage 1000 OPERATION IN THIS AREA LIMITED BY RDS(on) I D , Drain Current (A) 100 10us 100us 10 1ms 1 10ms TC = 25 o C TJ = 150 o C Single Pulse Figure 25. - Maximum Safe Operating Area 1 10 100 1000 V DS, Drain-to-Source Voltage (V) Figure 24. - Typical Source-Drain Diode Forward Voltage Figure 25. - Maximum Safe Operating Area To Order F-355 Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Pre-Radiation 1 0.50 Thermal Response (Z thJC ) 0.20 0.1 0.10 0.05 0.02 0.01 SINGLE PULSE (THERMAL RESPONSE) PDM t1 t2 Notes: 1. Duty factor D = t 1 / t 2 2. Peak TJ = PDM x Z thJC + TC 0.0001 0.001 0.01 0.1 1 10 0.01 0.001 0.00001 t1, Rectangular Pulse Duration (sec) Figure 26. - Maximum Effective Transient Thermal Impedance, Junction-to-Case Vs. Pulse Duration 30 25 I D , Drain Current (A) 20 15 10 5 0 25 50 75 100 125 150 T C , Case Temperature ( C) Figure 27. - Maximum Drain Current Vs. Case Temperature F-356 To Order Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Pre-Radiation VDS VGS RG RD VDS 90% + D.U.T. -VDD 10V Pulse Width 1 Duty Factor 0.1 10% VGS td(on) tr t d(off) tf Figure 28a. - Switching Time Test Circuit Figure 28b. - Switching Time Waveforms 15 V V (B R )D S S tp VD S L D R IV ER RG 20V D .U.T IA S tp 0 .0 1 + V - DD A IAS Figure 29a. - Unclamped Inductive Test Curcuit Figure 29b. - Unclamped Inductive Waveforms To Order F-357 Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Pre-Radiation ID = 26A 26.7A Figure 29c. - Maximum Avalanche Energy Vs. Starting Junction Temperature Figure 30. - Peak Diode Recovery dv/dt Test Circuit F-358 To Order Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Pre-Radiation Current Regulator Same Type as D.U.T. 50K QG 12V .2F .3F 10 V QGS VG QGD VGS 3mA D.U.T. + V - DS Charge IG ID Current Sampling Resistors Figure 31a. - Basic Gate Charge Waveform Figure 31b. - Gate Charge Test Circuit Figure 32 - Typical Time to Accumulated 1% Failure To Order F-359 Previous Datasheet Index Next Data Sheet IRHN7250/IRHN8250 Devices Repetitive Rating; Pulse width limited by maximum junction temperature. (figure 26) Refer to current HEXFET reliability report. @ VDD = 50V, Starting TJ = 25C, EAS = [0.5 * L * (IL2) * [BVDSS/(BVDSS-VDD)] Peak IL = 26A, 25 RG 200 I SD 26A, di/dt 190 A/s, VDD BVDSS, TJ 150C Suggested RG = 2.35 Pulse width 300 s; Duty Cycle 2% K/W = C/W W/K = W/C Total Dose Irradiation with VGS Bias. +12 volt VGS applied and VDS = 0 during irradiation per MIL-STD-750, method 1019. (figure 8a) Total Dose Irradiation with VDS Bias. VDS = 0.8 x rated BV DSS (pre-radiation) applied and VGS = 0 during irradiation per MlL-STD-750, method 1019. (figure 8b) This test is performed using a flash x-ray source operated in the e-beam mode (energy ~2.5 MeV), 30 nsec pulse. (figure 9) Study sponsored by NASA. Evaluation performed at Brookhaven National Labs. All Pre-Radiation and Post-Radiation test conditions are identical to facilitate direct comparison for circuit applications. Case Outline and Dimensions - SMD-1 Notes: 1. Dimensioning and Tolerancing per ANSI Y14.5M-1982 2. Controlling Dimension: Inch 3. Dimensions are shown in millimeters (Inches) 4 Dimension includes metallization flash 5 Dimension does not include metallization flash F-360 WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel: ++ 44 1883 732020 IR CANADA: 7321 Victoria Park Ave., Suite 201, Markham, Ontario L3R 2Z8, Tel: (905) 475 1897 IR GERMANY: Saalburgstrasse 157, 61350 Bad Homburg Tel: ++ 49 6172 96590 IR ITALY: Via Liguria 49, 10071 Borgaro, Torino Tel: ++ 39 11 451 0111 IR FAR EAST: 171 (K&H Bldg.) 30-4 Nishi-ikebukuro 3-Chome, Toshima-ku, Tokyo Japan Tel: 81 3 3983 0086 IR SOUTHEAST ASIA: 315 Outram Road, #10-02 Tan Boon Liat Building, Singapore 0316 Tel: 65 221 8371 http://www.irf.com/ Data and specifications subject to change without notice. 1/97 To Order |
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