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E2B0051-19-22 Semiconductor
Semiconductor ML9060
1/2 DUTY, 160-OUTPUT STATIC LCD DRIVER
im i This version: Feb. 1999 ML9060 nar y
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GENERAL DESCRIPTION
The ML9060 consists of a 320-bit shift register, a 320-bit data latch, 160 sets of LCD drivers, and a common signal generator circuit. The LCD display data is input serially to the shift register from the DATA IN pin in synchronization with the CLOCK IN signal, and is stored in the data latch by the LOAD IN signal. The LCD display data stored in the data latch is output via the LCD drivers. A maximum of 160 segments of LCD can be driven in static display mode and a maximum of 320 segments can be driven directly in the 1/2 duty display mode. It is possible to select the mode of using the internal oscillator circuit or the mode of using an external clock for the common signal generator circuit. The ML9060 also outputs the sync signal during the 1/2 duty display mode.
FEATURES
* Logic power supply : 2.7 to 5.5V * LCD Driving voltage : 4.5 to 16V * Maximum number of segments that can be driven: Static display mode : 160 segments 1/2 Duty display mode : 320 segments * Serial transfer clock : 1 MHz max. * The microcontroller interface consists of the three signals DATA IN, CLOCK IN, and LOAD IN. * An RC oscillator circuit is built in which can use either an external resistor or the internal resistor. * Cascade connection of several ICs is possible. * Built-in common signal generator circuit. * Built-in common output mid-level voltage generator circuit. * Input for turning all segments ON is available (SEG-TEST IN). * Input for turning all segments OFF is available (BLANK IN). * Gold bump chip Product name: ML9060DVWA
1/17
Semiconductor
ML9060
BLOCK DIAGRAM
SEG1 SEG2 VLCD
SEG160
COM A
COM B
Segment Drivers
1/2VLCD Generator & Common Drivers SEG-TEST OUT BLANK OUT
SEG-TEST IN BLANK IN VDD
DS01 DS02 DS0160 DSI1b DSI160b
Data Selector
DSI1a DSI160a
L01a
L0160a
L01b
L0160b
Data Latch A
LI1a LI160a
Data Latch B
LI1b LI160b
LOAD IN DATA IN
P01a SIa P0160a SOa P01b SIb P0160b SOb
LOAD OUT
Shift Register A CLOCK IN
Shift Register B
DATA OUT
CLOCK OUT Timing Generator COM OUT
OSC I/E D/S OSC1 OSCR OSC2 M/S SYNC GND SYNC OSC 1/64 or 1/128 1/2
2/17
Semiconductor
ML9060
ABSOLUTE MAXIMUM RATINGS
Parameter Logic power supply voltage LCD Driving voltage Input voltage Storage temperature Symbol V DD V LCD VI T STG Condition Ta = 25C Ta = 25C Ta = 25C -- Rating -0.3 to +6.5 0 to 18 GND-0.3 to V DD +0.3 -55 to +150 Unit V V V C
RECOMMENDED OPERATING CONDITIONS
Parameter Logic power supply voltage LCD Driving voltage Operating temperature Symbol V DD * V LCD * T op Condition -- -- -- Range 2.7 to 5.5 4.5 to 16 -40 to +85 Unit V V C
*: Use with VDD VLCD Note: Never place a short between an output pin and another output pin or between an output pin and other pins (input pins, I/O pins, or power supply pins).
3/17
Semiconductor
ML9060
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD = 2.7 to 5.5V, VLCD = 4.5 to 16V, Ta = -40 to +85C) Parameter "H" Input voltage Symbol VIH1 *1 VIH2 *2 VIL1 *1 VIL2 *2 IL1 -- Condition Min. 0.7VDD 0.8VDD GND GND -- Typ. -- -- -- -- -- Max. VDD VDD 0.3VDD 0.2VDD 1.0 V Unit Applicable pin DATA IN CLOCK IN LOAD IN V mA SEG-TEST IN BLANK IN M/S, D/S OSC1, OSC I/E SYNC SEG1 to SEG160 COM A, COM B DATA OUT CLOCK OUT "H" Output voltage Logic LOAD OUT VOHL1 IO = -100mA 0.9VDD -- -- V SEG-TEST OUT BLANK OUT COM OUT SYNC VOHL2 "M" Output voltage Common Segment Common IO = -200mA 0.9VDD 1/2VLCD -0.15 -- -- -- 1/2VLCD -- -- -- 1/2VLCD +0.15 0.2 0.2 V V V V OSC2 COM A, COM B SEG1 to SEG160 COM A, COM B DATA OUT CLOCK OUT "L" Output voltage Logic LOAD OUT VOLL1 IO = 100mA -- -- 0.1VDD V SEG-TEST OUT BLANK OUT COM OUT SYNC VOLL2 Output resistance Segment Common RSEG RCOM IO = 200mA -- -- -- -- -- -- 0.1VDD 10 1.5 V kW kW OSC2 SEG1 to SEG160 COM A, COM B
"L" Input voltage Input leakage current 1
-- VI = VDD or 0V VI = VDD or 0V
Input leakage current 2 Segment Common
IL2 VOHS VOHC *3
D/S = "H" M/S = "L" IO = -30mA IO = -150mA
-- VLCD-0.2 VLCD-0.2
-- -- --
10 -- --
mA V V
VOMC *3 IO = 150mA VOLS VOLC *3 IO = 30mA IO = 150mA
"M": Middle level
4/17
Semiconductor
ML9060
Parameter
Symbol
Condition D/S = "L" (Static) Fix other input levels at either "H" or "L" Oscillator stopped No load D/S = "H" (1/2duty) Fix other input levels at either "H" or "L" Oscillator stopped No load D/S = "L" (Static) Fix other input levels at either "H" or "L" Oscillator stopped No load D/S = "H" (1/2duty) Fix other input levels at either "H" or "L" Oscillator stopped No load VDD = 5.5V D/S = "L" (Static) OSC1 is Open OSC2 is connected to OSCR Other inputs are "H" or "L" No load VDD = 5.5V D/S = "H" (1/2duty) OSC1 is Open OSC2 is connected to OSCR Other inputs are "H" or "L" No load VDD = 5.5V D/S = "L" (Static) OSC1 is Open OSC2 is connected to OSCR Other inputs are "H" or "L" No load VDD = 5.5V D/S = "H" (1/2duty) OSC1 is Open OSC2 is connected to OSCR Other inputs are "H" or "L" No load
Min.
Typ.
Max.
Unit
Applicable pin
IDDS1
--
--
TBD
mA
VDD
IDDS2 Static supply current *4
--
--
TBD
mA
VDD
ILCDS1
--
--
TBD
mA
VLCD
ILCDS2
--
--
TBD
mA
VLCD
IDD1
--
--
TBD
mA VDD
IDD2
--
--
TBD
mA VDD
Dynamic supply current *4
ILCD1
--
--
TBD
mA
VLCD
ILCD2
--
--
TBD
mA
VLCD
*1: Applicable to the DATA IN, LOAD IN, SEG-TEST IN, M/S, D/S, and OSC I/E pins. *2: Applicable to the CLOCK IN, OSC1, and BLANK IN pins. *3: Applicable to the voltage drop when the current flows into or out of one COM pin. *4: The power supply current consumption will be determined finally at the end of sample evaluations. The LCD display data of "0" and "1" are input alternately. 5/17
Semiconductor Switching Characteristics
ML9060
(VDD = 2.7 to 5.5V, VLCD = 4.5 to 16V, Ta = -40 to +85C) Parameter OSC IN Clock frequency (external input) Clock pulse width (external input) External Rf clock frequency (internal oscillations) Internal Rf clock frequency (with the built-in oscillator) Data clock frequency Data clock pulse width Data setup time Data hold time CLOCK to LOAD Period LOAD to CLOCK Period LOAD Pulse width CLOCK IN to DATA OUT delay time fOSC1 Symbol fCP1 tWCP1 Condition The clock is input to the OSC1 pin. The pins OSC2 and OSCR are left open. OSC I/E = "L" An Rf of 120k W 2% is connected between OSC1 and OSC2. OSCR is left open. OSC I/E = 'H" OSC1 open. OSC2 and fOSC2 OSCR shorted. OSC I/E tied to VDD or any "H" level. fCP2 tWCP2 tSU tHD tCL tLC tWLD tPLH tPHL CL=15pF -- 100 50 50 100 100 100 -- -- -- -- -- -- -- -- -- 1 -- -- -- -- -- -- 50 7.7 12.8 20.5 kHz OSC1, OSCR, OSC2 7.7 12.8 20.5 kHz OSC1, OSC2 Min. Typ. Max. Unit -- 50 -- -- Applicable pin
25.6 kHz OSC1 -- s OSC1
MHz CLOCK IN ns ns ns ns ns ns ns CLOCK IN DATA IN CLOCK IN CLOCK IN LOAD IN LOAD IN CLOCK IN DATA OUT CLOCK IN/OUT LOAD IN/OUT SEG-TEST IN/OUT BLANK IN/OUT COM OUT SYNC All inputs other than the OSCR input
IN to OUT delay time
tDIO
No load
--
--
20
ns
COM OUT to SYNC delay time Input signal rise time Input signal fall time
tDCS tR tF
CL=15pF
-- -- --
-- -- --
40 50 50
ns ns ns
* : The specifications of the internal Rf clock frequency and the external Rf clock frequency will be determined finally at the end of sample evaluations.
6/17
Semiconductor
ML9060
TIMING DIAGRAM
1/fCP1 tWCP1 OSC1 (External clock) VIH VIH VIL tWCP1 VIH VIL
DATA IN
VIH VIL tSU tWCP2 tHD
VIH VIL
tWCP2 VIH VIH VIL tCL tWLD VIH VIH tLC VIL
CLOCK IN
VIL
VIL 1/fCP2
LOAD IN
VIL tPLH tPHL
VIL
DATA OUT
VOH VOL
CLOCK IN LOAD IN SEG-TEST IN BLANK IN CLOCK OUT LOAD OUT SEG-TEST OUT BLANK OUT tR All input signals
VIH tDIO VOH VOL tF VIH VIL VIH VIL VIL tDIO
COM OUT
1/2VDD tDCS
1/2VDD tDCS 1/2VDD 1/2VDD
SYNC
7/17
Semiconductor
ML9060
FUNCTIONAL DESCRIPTION
The ML9060 is an LCD driver LSI with an internal shift register and a set of internal data latches and is capable of driving LCD displays of up to 320 segments either in the static mode or in the 1/2 duty mode. The display data is read into the shift register serially from the DATA IN pin at the rising edge of the CLOCK IN input signal. The display data is transferred internally to the data latches at the High level of the LOAD IN input signal and is output to the segments via the segment drivers in this IC. The display data in the shift register is output via the DATA OUT pin in synchronization with the falling edge of the CLOCK IN input signal. The display data should be input in the sequence of SEG160, SEG159, ... , SEG2, SEG1 for proper display of data. Description of Pin Functions * M/S This is the input pin for selecting either the Master mode or the Slave mode. This LSI goes into the master mode when this pin is High and enters the Slave mode when this pin is Low. * D/S This input pin is for selecting either the dynamic display mode at 1/2 duty (D mode - "H" input) or the static display mode (S mode - "L" input). Note that the internal bias resistor is made ON in the dynamic (D) mode and is turned OFF in the static mode (S). * OSC I/E This is the input pin for selecting whether to use the external clock input mode, or the internal Rf oscillation mode or the external Rf oscillation mode. When this pin is tied to the "H" level, the internal Rf oscillation mode or the external Rf oscillation is used. When this pin is tied to the "L" level, the external clock input is used for the operation of the LSI. In the slave mode of operation of this LSI, any input to this pin will be ignored. Hence, tie this pin to VDD or GND in the slave mode. * OSC1, OSCR, OSC2 These are the pins for the oscillator for generating the common signal. In the Master mode (M/S pin = "H"): It is possible to select from among the three modes - internal Rf oscillation mode, external Rf oscillation mode, and the external clock input mode. During the static display operation mode, a common signal with 1/128th the frequency of the clock oscillator is output via the COM OUT pin. During the 1/2 duty dynamic display operation mode, a common signal with 1/64th the frequency of the clock oscillator is output via the COM OUT pin. * Internal Rf oscillation mode: Tie the OSC I/E pin to "H", short the pins OSCR and OSC2, and leave the pin OSC1 open. * External Rf oscillation mode: Tie the OSC I/E pin to "L", connect an external resistor Rf between the pins OSC1 and OSC2, and leave the pin OSCR open. * External clock input mode: Tie the OSC I/E pin to "L", leave open the pins OSCR and OSC2, and input the external clock signal to the pin OSC1.
8/17
Semiconductor
ML9060
In the Slave mode (M/S pin = "L"): Leave open the pins OSCR and OSC2 and connect the pin OSC1 to the COM OUT pin of the ML9060 which has been set in the master mode. The common signal that is input to the pin OSC1 will be used as the internal common signal and is also output via a buffer from the COM OUT pin. * COM OUT This is the common signal output pin. Connect this pin to the OSC1 pin of the ML9060 that is set in the slave mode. During operation in the master mode (M/S pin = "H") for static display, a common signal with 1/128th the frequency of the oscillator is output. During operation in the master mode (M/S pin = "H") for 1/2 duty dynamic display, a common signal with 1/64th the frequency of the oscillator is output. During operation in the slave mode (M/S pin = "L"), the common signal that is input at the pin OSC1 is output from this pin via a buffer. * SYNC This is the I/O pin for common signal synchronization. This pin becomes the synchronization signal output pin during operation in the master mode (M/S pin = "H") for 1/2 duty dynamic display. This pin becomes the synchronization signal input pin during operation in the slave mode (M/ S pin = "H") for 1/2 duty dynamic display. For cascade operation in the 1/2 duty display mode, connect the SYNC pins of all ML9060 ICs used together. During operation in the static display mode, this pin is tied to the "L" level inside the IC. Connect this pin either to GND or leave it open. * DATA IN This is the display data input pin. Input the display data in the sequence of SEG160, SEG159, ... , SEG2, SEG1. The segment is turned ON when the display data is "H" and OFF when "L". * DATA OUT This is the display data output pin. During the static display mode of operation, the data of the 160th stage of the shift register is output from this pin. During the 1/2 duty dynamic display mode, the data of the 320th stage of the shift register is output from this pin. * CLOCK IN This is the input pin for the shift clock of the display data. The display data that is input at the DATA IN pin is input serially to the shift register at the rising edge of the CLOCK IN signal. Also, the display data in the shift register is output from the DATA OUT pin at the falling edge of the CLOCK IN signal. * CLOCK OUT This is the output pin for the shift clock of the display data. The shift clock signal that is input to the CLOCK IN pin is output via a buffer from this pin. * LOAD IN This is the input pin for the display data load signal. The display data in the shift register is output as such to the segment driver when this signal is at the "H" level. When this signal is made "L", the shift register is isolated from the segment drivers, and the display data of the shift register just before this pin goes "L" is retained in the data latches and transfered to the segment drivers. 9/17
Semiconductor
ML9060
* LOAD OUT This is the output pin for the display data load signal. The load signal that is input to the LOAD IN pin is output from this pin via a buffer. * SEG-TEST IN This is the input pin for making all segments ON. When this pin is "H", all segment outputs (SEG1 to SEG160) become ON irrespective of the display data and the Blank signal. When this pin is made "L", each of the segment outputs (SEG1 to SEG160) become ON or OFF according to the display data. * SEG-TEST OUT This is the output pin for making all segments ON. The segment ON signal that is input to at the SEG-TEST IN pin is output via a buffer. * BLANK IN This is the input pin for making all segments OFF. When this pin is "H", all segment outputs (SEG1 to SEG160) become OFF irrespective of the display data. When this pin is made "L", each of the segment outputs (SEG1 to SEG160) becomes ON or OFF according to the display data. The BLANK IN is valid when the segment ON signal is "L". * BLANK OUT This is the output pin for making all segments OFF. The segment OFF signal that is input to the BLANK IN pin is output via a buffer. * SEG1 to SEG160 These are the signal outputs for driving the LCD segments and are connected to the corresponding segment pins of the LCD panel. During the Static mode of operation: The SEGn output corresponds to bit n of the display data in the data latch A. The display data in the data latch B becomes invalid. In the segment ON condition, a signal with a phase opposite to that of the COM OUT signal is output from these pins. In the segment OFF condition, a signal with a phase identical to that of the COM OUT signal is output from these pins. During the 1/2 duty dynamic display mode of operation: The SEGn output corresponds to bit n of the display data in the data latch A when COM A has been selected and to bin n of the display data in the data latch B when COM B has been selected. In the segment display ON condition, a signal opposite in phase to that of the selected COM output is output from these pins. In the segment display OFF condition, a signal identical in phase to that of the selected COM output is output from these pins. * COM A, COM B These are the outputs for LCD display and are connected to the common pins of the LCD panel. During the Static mode of operation: COM A and COM B both output a signal with the same phase as that of the COM OUT signal.
10/17
Semiconductor
ML9060
During the 1/2 duty dynamic display mode of operation: COM A and COM B change their states at every cycle of the COM OUT signal and repeat the selected and non-selected modes always opposing each other in phase. A signal with the same phase as that of the COM OUT signal is output in the selected mode. A voltage equal to 1/2VLCD is output in the non-selected mode. When COM A is in the selected mode (that is, COM B is in the non-selected mode), the segment outputs (SEG1 to SEG160) output signals corresponding to the display data in the data latch A. When COM B is in the selected mode (that is, COM A is in the non-selected mode), the segment outputs (SEG1 to SEG160) output signals corresponding to the display data in the data latch B. * VDD This is the power supply input pin for the logic circuits. * VLCD This is the power supply input pin for the LCD drivers. * GND This is the ground pin for all circuits.
11/17
Semiconductor Segment Output and Common Output Waveforms During the 1/2 duty display operation mode:
ML9060
COM OUT SYNC COM A Selected COM A COM B Selected COM A Selected COM B Selected
VDD GND VDD GND VLCD 1/2VLCD GND VLCD
COM B
1/2VLCD GND VLCD GND VLCD GND VLCD GND VLCD GND
OFF
OFF
OFF
OFF
SEGn
OFF
ON
OFF
ON
ON
OFF
ON
OFF
ON Data latch A
ON Data latch B
ON Data latch A
ON Data latch B
During the static display operation mode:
COM OUT
VDD GND VLCD
COM A GND VLCD COM B GND VLCD GND VLCD GND
SEGn
OFF
OFF
OFF
OFF
ON
ON
ON
ON
12/17
Semiconductor
ML9060
APPLICATION CIRCUIT EXAMPLES
When a single ML9060 is used - Static display mode (internal Rf oscillation mode)
LCD Panel 160 segments, static display
COM
SEG1 SEG-TEST IN BLANK IN From the controller LOAD IN DATA IN CLOCK IN D/S M/S OSC1 open OSC2
SEG160 COM A COM B open GND or open
ML9060
SYNC
OSCR
OSC I/E VDD
When a single ML9060 is used - 1/2 duty dynamic display mode (external Rf oscillation mode)
COM A COM B
LCD Panel 320 segments, 1/2 Duty dynamic display
SEG1 SEG-TEST IN BLANK IN From the controller LOAD IN DATA IN CLOCK IN D/S M/S OSC1 Rf OSC2
SEG160 COM A COM B
ML9060
SYNC
open
OSCR open
OSC I/E VDD
13/17
Semiconductor Cascade Connection - Static display mode (external clock input mode)
ML9060
LCD Panel (160 x n segments)
COM 160 COM A COM B SEG-TEST OUT BLANK OUT LOAD OUT DATA OUT CLOCK OUT COM OUT SYNC Static 160 COM A COM B SEG-TEST OUT BLANK OUT LOAD OUT DATA OUT CLOCK OUT COM OUT SYNC open open
open SEG-TEST IN BLANK IN LOAD IN DATA IN CLOCK IN
From the controller
SEG-TEST IN BLANK IN LOAD IN DATA IN CLOCK IN
ML9060
ML9060
open
D/S VDD
M/S
OSC1 OSC2 OSCR OSC I/E open open
D/S
M/S
OSC1 OSC2 OSCR OSC I/E open open VDD or GND
External clock
Note: Take care about the resistance and capacitance of wiring for cascade connection.
Cascade Connection - 1/2 duty dynamic display mode (internal Rf oscillation mode)
LCD Panel (320 x n segments)
COM A 160 COM A SEG-TEST IN BLANK IN LOAD IN DATA IN CLOCK IN COM B SEG-TEST OUT BLANK OUT LOAD OUT DATA OUT CLOCK OUT COM OUT SYNC SEG-TEST IN BLANK IN LOAD IN DATA IN CLOCK IN COM B 1/2 duty dynamic display 160 COM A COM B SEG-TEST OUT BLANK OUT LOAD OUT DATA OUT CLOCK OUT COM OUT SYNC open open
From the controller
ML9060
ML9060
open
VDD
D/S
M/S
OSC1 OSC2 OSCR OSC I/E open
D/S
M/S
OSC1 OSC2 OSCR OSC I/E open open VDD or GND
Note: Take care about the resistance and capacitance of wiring for cascade connection.
14/17
Semiconductor
ML9060
PAD CONFIGURATION
Pad layout (Pattern side) Chip size : Chip thickness : Minimum bump pitch : Bump size : Bump height : Bump height inside the chip : Bump hardness :
204 205
14.50 1.48mm 625mm 30mm 80mm 50 80m 15mm 5m max. - min. 4m max. 100 (HV: 25 g LOAD)
Y 37 36 X
214 1 26
27
* : The substrate of the chip should either be connected to the GND level or be left open. Pad Coordinates
Pad No. 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 Pad name NC NC SYNC NC COMOUT NC VLCD VLCD VLCD NC GND GND GND D/S OSC I/E M/S VDD VDD VDD NC
X-coordinate Y-coordinate
(mm) -6680 -6146 -5611 -5077 -4542 -4008 -3474 -2939 -2405 -1870 -1336 -802 -267 267 802 1336 1870 2405 2939 3474
(mm) -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561 -561
Pad No. 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
Pad name OSC2 OSCR OSC1 NC NC NC NC NC DATA IN NC CLOCK IN LOAD IN SEG-TEST IN BLANK IN NC NC NC NC NC COMA
X-coordinate Y-coordinate
(mm) 4008 4542 5077 5611 6146 6680 7121 7121 7121 7121 7121 7121 7121 7121 7121 7121 6680 6600 6520 6440
(mm) -561 -561 -561 -561 -561 -561 -360 -280 -200 -120 -40 40 120 200 280 360 561 561 561 561
NC: No Connection 15/17
Semiconductor
ML9060
Pad No. 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85
Pad name COM B SEG1 SEG2 SEG3 SEG4 SEG5 SEG6 SEG7 SEG8 SEG9 SEG10 SEG11 SEG12 SEG13 SEG14 SEG15 SEG16 SEG17 SEG18 SEG19 SEG20 SEG21 SEG22 SEG23 SEG24 SEG25 SEG26 SEG27 SEG28 SEG29 SEG30 SEG31 SEG32 SEG33 SEG34 SEG35 SEG36 SEG37 SEG38 SEG39 SEG40 SEG41 SEG42 SEG43 SEG44
X-coordinate Y-coordinate
(mm) 6360 6280 6200 6120 6040 5960 5880 5800 5720 5640 5560 5480 5400 5320 5240 5160 5080 5000 4920 4840 4760 4680 4600 4520 4440 4360 4280 4200 4120 4040 3960 3880 3800 3720 3640 3560 3480 3400 3320 3240 3160 3080 3000 2920 2840
(mm) 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561
Pad No. 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 129 130
Pad name SEG45 SEG46 SEG47 SEG48 SEG49 SEG50 SEG51 SEG52 SEG53 SEG54 SEG55 SEG56 SEG57 SEG58 SEG59 SEG60 SEG61 SEG62 SEG63 SEG64 SEG65 SEG66 SEG67 SEG68 SEG69 SEG70 SEG71 SEG72 SEG73 SEG74 SEG75 SEG76 SEG77 SEG78 SEG79 SEG80 SEG81 SEG82 SEG83 SEG84 SEG85 SEG86 SEG87 SEG88 SEG89
X-coordinate Y-coordinate
(mm) 2760 2680 2600 2520 2440 2360 2280 2200 2120 2040 1960 1880 1800 1720 1640 1560 1480 1400 1320 1240 1160 1080 1000 920 840 760 680 600 520 440 360 280 200 120 40 -40 -120 -200 -280 -360 -440 -520 -600 -680 -760
(mm) 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561
16/17
Semiconductor
ML9060
Pad No. 131 132 133 134 135 136 137 138 139 140 141 142 143 144 145 146 147 148 149 150 151 152 153 154 155 156 157 158 159 160 161 162 163 164 165 166 167 168 169 170 171 172 173 174 175
Pad name SEG90 SEG91 SEG92 SEG93 SEG94 SEG95 SEG96 SEG97 SEG98 SEG99 SEG100 SEG101 SEG102 SEG103 SEG104 SEG105 SEG106 SEG107 SEG108 SEG109 SEG110 SEG111 SEG112 SEG113 SEG114 SEG115 SEG116 SEG117 SEG118 SEG119 SEG120 SEG121 SEG122 SEG123 SEG124 SEG125 SEG126 SEG127 SEG128 SEG129 SEG130 SEG131 SEG132 SEG133 SEG134
X-coordinate Y-coordinate
(mm) -840 -920 -1000 -1080 -1160 -1240 -1320 -1400 -1480 -1560 -1640 -1720 -1800 -1880 -1960 -2040 -2120 -2200 -2280 -2360 -2440 -2520 -2600 -2680 -2760 -2840 -2920 -3000 -3080 -3160 -3240 -3320 -3400 -3480 -3560 -3640 -3720 -3800 -3880 -3960 -4040 -4120 -4200 -4280 -4360
(mm) 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561
Pad No. 176 177 178 179 180 181 182 183 184 185 186 187 188 189 190 191 192 193 194 195 196 197 198 199 200 201 202 203 204 205 206 207 208 209 210 211 212 213 214
Pad name SEG135 SEG136 SEG137 SEG138 SEG139 SEG140 SEG141 SEG142 SEG143 SEG144 SEG145 SEG146 SEG147 SEG148 SEG149 SEG150 SEG151 SEG152 SEG153 SEG154 SEG155 SEG156 SEG157 SEG158 SEG159 SEG160 NC NC NC NC NC BLANKOUT SEG-TESTOUT LOADOUT CLOCKOUT NC DATAOUT NC NC
X-coordinate Y-coordinate
(mm) -4440 -4520 -4600 -4680 -4760 -4840 -4920 -5000 -5080 -5160 -5240 -5320 -5400 -5480 -5560 -5640 -5720 -5800 -5880 -5960 -6040 -6120 -6200 -6280 -6360 -6440 -6520 -6600 -6680 -7121 -7121 -7121 -7121 -7121 -7121 -7121 -7121 -7121 -7121
(mm) 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 561 360 280 200 120 40 -40 -120 -200 -280 -360
17/17
E2Y0002-29-11
NOTICE
1. The information contained herein can change without notice owing to product and/or technical improvements. Before using the product, please make sure that the information being referred to is up-to-date. The outline of action and examples for application circuits described herein have been chosen as an explanation for the standard action and performance of the product. When planning to use the product, please ensure that the external conditions are reflected in the actual circuit, assembly, and program designs. When designing your product, please use our product below the specified maximum ratings and within the specified operating ranges including, but not limited to, operating voltage, power dissipation, and operating temperature. Oki assumes no responsibility or liability whatsoever for any failure or unusual or unexpected operation resulting from misuse, neglect, improper installation, repair, alteration or accident, improper handling, or unusual physical or electrical stress including, but not limited to, exposure to parameters beyond the specified maximum ratings or operation outside the specified operating range. Neither indemnity against nor license of a third party's industrial and intellectual property right, etc. is granted by us in connection with the use of the product and/or the information and drawings contained herein. No responsibility is assumed by us for any infringement of a third party's right which may result from the use thereof. The products listed in this document are intended for use in general electronics equipment for commercial applications (e.g., office automation, communication equipment, measurement equipment, consumer electronics, etc.). These products are not authorized for use in any system or application that requires special or enhanced quality and reliability characteristics nor in any system or application where the failure of such system or application may result in the loss or damage of property, or death or injury to humans. Such applications include, but are not limited to, traffic and automotive equipment, safety devices, aerospace equipment, nuclear power control, medical equipment, and life-support systems. Certain products in this document may need government approval before they can be exported to particular countries. The purchaser assumes the responsibility of determining the legality of export of these products and will take appropriate and necessary steps at their own expense for these. No part of the contents cotained herein may be reprinted or reproduced without our prior permission. MS-DOS is a registered trademark of Microsoft Corporation.
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Copyright 1999 Oki Electric Industry Co., Ltd.
Printed in Japan

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