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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 1999.06.01 Page No. : 1/6
H34063AP
DC-TO-DC CONVERTER INTEGRATE CIRCUIT DEVICES
Description
The H34063AP Series is a monolithic control circuit containing the primary functions required for DC-to-DC converters. These devices consist of an internal temperature compensated reference, comparator, controlled duty cycle oscillator with an active current limit circuit, driver and high current output switch. This series was specifically by Hi-Sincerity Microelectronics Corp.
Features
* 3V to 40V Input Voltage Operation * Internal 1.6A Peak Current Switch * Internal 1.8% Reference * Low Quiescent Current at 1.6mA * Frequency Operation from 100Hz~100KHz * Current Limiting
Applications
* Saver for Cellular Phone * DC-DC Converter Module
Typical Application Circuit
Fig1.Saver Circuit for Cellular Phone L1 H34063AP RSC Vin
8 7 6 5 1 2 3 4
Vout
200H D1 H1N5819 CT 470F Cout 220F
C1 100F
RB 33k RA 5.6k
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Pin Connections
8 7 6 5
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 1999.06.01 Page No. : 2/6
1
2
3
4
Pin1:Switch Collector Pin2:Switch Emitter Pin3:Timing Capacitor Pin4:Gnd
Pin5:Comparator Inverting Input Pin6:Vcc Pin7:Ipk Sense Pin8:Driver Collector
Absolute Maxium Rating
Supply Voltage ..................................................................................................................... 40 V Comparator Input Voltage Range ............................................................................. -0.3V ~ 40 V Switch Collector Voltage ...................................................................................................... 40 V Switch Emitter Voltage ......................................................................................................... 40 V Switch Collector to Emitter Voltage ...................................................................................... 40 V Driver Collector Voltage ....................................................................................................... 40 V Switch Current ..................................................................................................................... 1.6 A Power Dissipation DIP Package Ta=25C .......................................................................... 1.0 W Thermal Resistance Junction To Air............................................................................ 125 C / W Operating Junction Temperature........................................................................................ 125 C Operating Ambient Temperature Range ........................................................................ 0 ~ 70 C Storage Temperature Range................................................................................ -40 C ~ 125 C
Electrical Characteristics (Vcc=5V,Ta=25C, unless otherwise specified)
Parameter Oscillator Charging Current Discharge Current Voltage Amplitude Discharge to Charge Current Ratio Current Limit Sense Voltage Output Switch Saturation Voltage, Darlington Connection Saturation Voltage Test Condition 5.0VVCC40V 5.0VVCC40V Pin3 VIPK(Sense) =VCC IChg=Idischg ISW=1.0A, VC(Driver)=VC(Switch) ISW=1.0A, IC(Driver)=50mA (Forced 20) ISW=1.0A, VCE=5.0V VCE=30V Symbol Ichg Idischg VOSC IDischg/Ichg VIPK(Sence) Min. 24 140 5.2 250 Typ. Max. 35 220 0.6 6.5 300 42 260 7.5 350 Unit uA uA V mV
VCE(Sat) VCE(Sat) hFE ICC(Off)
50 -
1.0 0.4 75 0.01
1.3 0.7 100
V V V UA
DC Current Gain Collector Off-State Current Comparator Threshold Voltage 0CTa70C Threshold Voltage Threshold Voltage Line Regulation 3.0VVCC40V Input Bias Current VIN=0V VIPK(Sence)=VCC VPin5>VFB, Supply Current 5.0VVCC40V CT=0.0001uF,Pin2=Gnd Remaining pins open
VFB Regline IIB
1.227 1.250 1.273 1.210 1.29 1.5 6 -20 -400
V mV nA
ICC
-
1.6
3
mA
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Block Diagram
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 1999.06.01 Page No. : 3/6
SC Pin1:1.6A Switch Collector Q1
Q2
QS R 80
DRI Pin8:Driver Collector
SE Pin2:Darlington Switch Emitter TC Pin3:Oscilletor Timing Capacitor
CT
IPK Oscillator Comparator + -
IPK Pin7:Highside Current Sense Input, VCC-VIPK=300mV VCC Pin6:Power Supply Input
1.25V Reference Voltage
GND Pin4:Power GND
FB Pin5:Feedback Comparator Inverting Input
Application Information
Design Formula Table
Calculation ton / toff (ton + toff) max CT IC(switch) RS L(min) CO Step-Down Vout+VF / Vin(min) -Vsat-VOut 1/Fmin 4*10 ton 2*Iout(max) 0.3 / IC(switch)
-5
Step-Up Vout+VF-Vin(min) / Vin(min)-Vsat 1/Fmin 4*10 ton 2*Iout(max)(ton+toff/toff) 0.3 / IC(switch)
-5
Voltage-Inverting |Vout| + VF / Vin-Vsat 1/Fmin 4*10-5ton 2*Iout(max)(ton+toff/toff) 0.3 / IC(switch)
(Vin(min)-Vsat-Vout / IC(switch))
*ton(max) IC(switch)*(ton+toff) / 8VRipple(P-P)
(Vin(min)-Vsat / IC(switch))
*ton(max)
(Vin(min)-Vsat/ IC(switch))
*ton(max)
Iout*ton / VRipple(P-P)
Iout*ton / VRipple(P-P)
Vsat : Saturation voltage of the output switch. VF : Forward voltage drop of the ringback rectifier. The following power supply characteristics must be chosen : Vin : Nominal input voltage. Vout : Desired output voltage. |Vout|=1.25*(1+RB/RA) Iout- Desired output current Fmin : Minimum desired output switching frequency at the selected values for Vin and Iout. VRipple(P-P) : Desired peak to peak output ripple voltage in practice, the calculated value will need to be increased due to the capacitor equivalent series resistance and board layout. The ripple voltage should be kept to a low value since it will directly effect the line and load regulation.
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Application Information (Continuos)
Fig.2 Step-Up Converter
L1 R1 150 RSC 0.22 Vin C1 100F 200H H34063AP
8 7 6 5 1 2 3 4
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 1999.06.01 Page No. : 4/6
D1 Vout 28V / 200mA H1N5819 Cout 220F
CT 680F
RB RA 2.2k 47k
Line Regulation : 100mV (Vin=8V~16V, @Io=200mA) Load Regulation : 5mV (Vin=12V, @Io=80mA~200mA)
Fig.3 Step-Up Converter With External NPN Switch
L1 R1 H34063AP
8 1 2 3 4
Vout D1
RSC Vin C1
7 6 5
Q1 CT R2
Cout
RB RA
Fig.4 Step-Down Converter
L1 H34063AP RSC 0.25 Vin C1 100F
8 7 6 5 1 2 3 4
200H
Vout 5V / 500mA Cout 470F
D1 H1N5819 CT 470F
RB 3.6k RA 1.2k
Line Regulation : 40mV (Vin=10V~20V, @Io=500mA) Load Regulation : 5mV (Vin=15V, @Io=10mA~500mA) Short Circuit Current : 1.3A (Vin=15V, @RL=0.1
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 1999.06.01 Page No. : 5/6
Fig.5 Step-Down Converter With External PNP Saturation Switch
H34063AP R2
8 1 2 3 4
R1 Q1 L1 CT D1 Vout Cout
RSC Vin
7 6 5
C1 RA
RB
Fig.6 Voltage Inverting Converter
H34063AP RSC 0.25 Vin 4.5V-6V
8 7 6 5 1 2 3 4
D1 H1N5819
Vout -12V / 100mA
L1 100H CT 680F
Cout 470F
C1 100F RB 8.2k
RA 953
Line Regulation : 20mV (Vin=4.5V~6V, @Io=100mA) Load Regulation : 100mV (Vin=5V, @Io=10mA~100mA)
Fig.7 Voltage Inverting Converter With External PNP Saturation Switch
H34063AP R1
8 1 2 3 4
R2 Q1
RSC Vin
7 6 5
L1 CT
D1
RA C1 RB Cout
Vout
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
DIP-8P Dimension
Marking :
87 6 5 A 1 2 B 3 4 J F
HSMC Logo Part Number Date Code
Spec. No. : Preliminary Data Issued Date : 1998.08.01 Revised Date : 1999.06.01 Page No. : 6/6
Package Code
Ink Mark
DIP-8P Plastic Package HSMC Package Code : P
C
E DH
G M
1 K
I
L
*:Typical
DIM A B C D E F G
Inches Min. Max. 0.2480 0.2520 0.3630 0.3670 *0.0600 *0.0500 *0.0390 0.1280 0.1320 0.1250 0.1400
Millimeters Min. Max. 6.29 6.40 9.22 9.32 *1.52 *1.27 *0.99 3.25 3.35 3.17 3.55
DIM H I J K L M 1
Inches Min. Max. 0.0150 0.0210 0.0898 0.1098 0.2950 0.3050 *0.1181 0.3370 0.7470 0.0090 0.0150 94 97
Millimeters Min. Max. 0.38 0.53 2.28 2.79 7.49 7.74 *3.00 8.56 8.81 0.229 0.381 94 97
Notes : 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice :
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification


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