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| CXG1090TN High Power 2 x 4 Antenna Switch MMIC with Integrated Control Logic Description The CXG1090TN is a high power antenna switch MMIC. The CXG1090TN is suited to connect Tx/Rx to one of 4 antennas in cellular handset such as PDC. The CXG1090TN has the integrated control logic and can be operated with CMOS input. This IC is designed using the Sony's GaAs J-FET process which enable the CXG1090TN to be operated with low voltage. Features * Low insertion loss: 0.30dB (Typ.)@900MHz, 0.40dB (Typ.)@1.5GHz * Small package: TSSOP-16pin * High power handling: PldB: 37dBm * CMOS compatible input control * Low bias voltage: VDD = 3.0V Applications 2 x 4 antenna switch for digital cellular telephones such as PDC handsets. Structure GaAs J-FET MMIC Absolute Maximum Ratings * Bias voltage VDD * Control voltage Vctl * Operating temperature Topr * Storage temperature Tstg 16 pin TSSOP (Plastic) 7 5 -35 to +85 -65 to +150 V @Ta = 25C V @Ta = 25C C C GaAs MMICs are ESD sensitive devices. Special handling precautions are required. Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. -1- E99747A9Z-PS CXG1090TN Block Diagram RF4 (Ant/Ext.1) F1 9 F2 F4 6 4 F5 F7 F6 F8 8 RF3 (Tx) RF5 11 (Rx) RF6 13 (Diversity 1) F3 RF2 (Ant/Ext.2) RF1 (Diversity 2) 14 RF-GND6 3 RF-GND1 Package Outline/Pin Configuration RF4 9 8 7 6 5 4 3 2 1 RF3 GND RF2 GND RF1 RF-GND1 CTLC CTLB GND 10 RF5 11 GND 12 RF6 13 RF-GND6 14 VDD 15 CTLA 16 Recommended Circuit RF4 L1 GND RF5 L1 GND 100pF 100pF 9 8 100pF L1 RF3 10 7 GND RF2 100pF L1 GND 11 6 12 5 RF6 L1 RF-GND6 100pF Z6 13 4 100pF L1 RF1 Z1 14 3 RF-GND1 CTLC 1k CTLB VDD 100pF CTLA 1k 100pF 15 2 100pF 16 1 100pF 1k -2- CXG1090TN Truth Table Control CTLA H H L L L L CTLB L L L L H H CTLC L H L H L H ON RF3 RF2 RF3 RF4 RF5 RF2 RF5 RF4 RF5 RF6 RF5 RF1 F1 OFF ON ON OFF OFF OFF F2 ON OFF OFF ON OFF OFF F3 OFF ON ON OFF OFF OFF F4 ON OFF OFF ON OFF OFF F5 OFF OFF OFF OFF ON OFF F6 OFF OFF OFF OFF OFF ON F7 ON ON ON ON OFF ON F8 ON ON ON ON ON OFF DC Bias Condition Parameter Vctl (H) A to C Vctl (L) A to C VDD Min. 2.4 0 2.8 Typ. (Ta = 25C) Max. 3.6 0.8 3.2 Unit V V V -3- CXG1090TN Electrical Characteristics Parameter Frequency Condition (Vctl (L) = 0V, Vctl (H) = 3V, Ta = 25C) Min. Typ. 0.32 0.30 0.55 0.55 0.5 0.5 17 17 17 17 27 20 19 21 21 19 34 25 1.4 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 Pin = 29.5dBm, VDD = 3.0V1 Pin = 29.5dBm, VDD = 2.8V1 -67 -67 -75 -75 -67 -67 -67 -67 85 VDD = 3.0V VDD = 2.8V 0.45 0.4 1.0 -57 -55 -65 -62 -60 -57 -60 -57 150 1 0.9 5.0 dBc dBc dBc dBc dBc dBc dBc dBc A mA mA s Max. 0.55 0.55 0.85 0.85 0.8 0.8 Unit dB dB dB dB dB dB dB dB dB dB dB dB RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V Insertion loss RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF3-RF2 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V RF3-RF4 889 to 960MHz Pin = 29.5dBm, VDD = 2.8 to 3.0V Isolation RF5-RF2 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF4 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF1 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V RF5-RF6 810 to 885MHz Pin = 7dBm, VDD = 2.8 to 3.0V VSWR ACP (50kHz) Each ON 810 to 960MHz Port RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 RF3-RF2 RF3-RF4 889 to 960MHz ACP (100kHz) 889 to 960MHz 2nd harmonics 889 to 960MHz 3nd harmonics Control current Bias current Switching speed 889 to 960MHz 1 Input Signal: ACP (50kHz) < -65dBc, APC (100kHz) < -75dBc, 2nd harmonics < -65dBc, 3rd harmonics < -65dBc -4- CXG1090TN Package Outline Unit: mm 16PIN TSSOP(PLASTIC) 1.2MAX 4.1 2.05 A 16 X S B 9 X2 0.2 SAB 0.08 S 0.1 (3.0) 0.1 0.05 0.25 2.9 0.1 X 0.5 0.1 SA B 0 to 8 0.08 M S A B 0.2 0.02 + 0.036 0.22 - 0.03 DETAIL B PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE TSSOP-16P-L01 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.03g -5- 0.1 0.01 + 0.026 0.12 - 0.02 0.45 0.1 1 8 X4 3.9 |
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