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| MOTOROLA SEMICONDUCTOR TECHNICAL DATA Order this document by MBRB2535CTL/D Designer'sTM Data Sheet SWITCHMODETM Power Rectifier D2PAK Surface Mount Power Package The D2PAK Power Rectifier employs the Schottky Barrier principle in a large metal-to-silicon power diode. State-of-the-art geometry features epitaxial construction with oxide passivation and metal overlay contact. Ideally suited for use in low voltage, high frequency switching power supplies, free wheeling diodes, and polarity protection diodes. These state-of-the-art devices have the following features: MBRB2535CTL Motorola Preferred Device * Center-Tap Configuration * Guardring for Stress Protection * Low Forward Voltage * 125C Operating Junction Temperature 4 * Epoxy Meets UL94, VO at 1/8 1 * Guaranteed Reverse Avalanche 4 1 * Short Heat Sink Tab Manufactured -- Not Sheared! 3 3 * Similar in Size to the Industry Standard TO-220 Package CASE 418B-02 Mechanical Characteristics D2PAK * Case: Epoxy, Molded * Weight: 1.7 grams (approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable * Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds * Shipped 50 units per plastic tube * Available in 24 mm Tape and Reel, 800 units per 13 reel by adding a "T4" suffix to the part number * Marking: B2535L MAXIMUM RATINGS (PER LEG) Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current (Rated VR) TC = 110C Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz), TC = 90C Nonrepetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Peak Repetitive Reverse Surge Current (2.0 s, 1.0 kHz) Storage Temperature Operating Junction Temperature Voltage Rate of Change (Rated VR) Symbol VRRM VRWM VR IF(AV) IFRM IFSM IRRM Tstg TJ dv/dt Value 35 SCHOTTKY BARRIER RECTIFIER 25 AMPERES 35 VOLTS Unit Volts 12.5 25 150 1.0 - 65 to +150 - 65 to +125 10,000 Amps Amps Amps Amp C C V/s THERMAL CHARACTERISTICS (PER LEG) Thermal Resistance -- Junction to Case -- Junction to Ambient (1) (1) When mounted using minimum recommended pad size on FR-4 board. Designer's Data for "Worst Case" Conditions -- The Designer's Data Sheet permits the design of most circuits entirely from the information presented. SOA Limit curves -- representing boundaries on device characteristics -- are given to facilitate "worst case" design. RJC RJA 2.0 50 C/W Designer's and SWITCHMODE are trademarks of Motorola, Inc. Thermal Clad is a trademark of the Bergquist Company Preferred devices are Motorola recommended choices for future use and best overall value. Rev 1 (c)RectifierInc. 1996 Data Motorola, Device 1 MBRB2535CTL ELECTRICAL CHARACTERISTICS (PER LEG) Rating Maximum Instantaneous Forward Voltage (2) (iF = 25 Amps, TJ = 25C) (iF = 12.5 Amps, TJ = 125C) (iF = 12.5 Amps, TJ = 25C) (Rated dc Voltage, TJ = 125C) (Rated dc Voltage, TJ = 25C) Symbol vF Value 0.55 0.41 0.47 500 10 Unit Volts Maximum Instantaneous Reverse Current (2) iR mA (2) Pulse Test: Pulse Width = 300 s, Duty Cycle 2.0%. I F, INSTANTANEOUS FORWARD CURRENT (AMP) 1000 I R , REVERSE LEAKAGE CURRENT (mA) 50 20 10 5 2 1 0.5 0.2 0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 10 0 5 10 15 20 25 30 35 vF, INSTANTANEOUS VOLTAGE (VOLTS) VR, REVERSE VOLTAGE (VOLTS) TJ = 25C TJ = 125C TJ = 125C 100 TJ = 100C 10 1 TJ = 25C 0.1 Figure 1. Typical Forward Voltage, Per Leg PF(AV), AVERAGE FORWARD POWER DISSIPATION (WATTS) Figure 2. Typical Reverse Current, Per Leg TJ = 125C 35 30 25 20 15 10 5 0 0 5 10 15 20 25 30 35 IF(AV), AVERAGE FORWARD CURRENT (AMPS) 40 SINE WAVE (RESISTIVE LOAD) DC SQUARE WAVE IF(AV), AVERAGE FORWARD CURRENT (AMPS) 40 32 28 24 20 16 SQUARE 12 8 4 0 85 95 105 115 TC, CASE TEMPERATURE (C) 125 DC (RATED Vr APPLIED) RJC = 2C/W Figure 3. Typical Forward Power Dissipation Figure 4. Current Derating, Case 2 Rectifier Device Data MBRB2535CTL INFORMATION FOR USING THE D2PAK SURFACE MOUNT PACKAGE MINIMUM RECOMMENDED FOOTPRINTS FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection interface 0.70 17.78 between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.0625 1.587 0.450 11.43 0.08 2.032 0.15 3.81 inches mm 0.350 8.89 D2PAK POWER DISSIPATION The power dissipation of the D2PAK is a function of the drain pad size. This can vary from the minimum pad size for soldering to a pad size given for maximum power dissipation. Power dissipation for a surface mount device is determined by TJ(max), the maximum rated junction temperature of the die, RJA, the thermal resistance from the device junction to ambient; and the operating temperature, TA. Using the values provided on the data sheet for the D2PAK package, PD can be calculated as follows: PD = TJ(max) - TA RJA the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device which in this case is 2.5 watts. PD = 150C - 25C = 2.5 watts 50C/W The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into The 50C/W for the D2PAK package assumes the recommended drain pad area of 158K mil2 on FR-4 glass epoxy printed circuit board to achieve a power dissipation of 2.5 watts using the footprint shown. Another alternative is to use a ceramic substrate or an aluminum core board such as Thermal CladTM. By using an aluminum core board material such as Thermal Clad, the power dissipation can be doubled using the same footprint. GENERAL SOLDERING PRECAUTIONS The melting temperature of solder is higher than the rated temperature of the device. When the entire device is heated to a high temperature, failure to complete soldering within a short time could result in device failure. Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected. * Always preheat the device. * The delta temperature between the preheat and soldering should be 100C or less.* * When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference shall be a maximum of 10C. * The soldering temperature and time shall not exceed 260C for more than 5 seconds. * When shifting from preheating to soldering, the maximum * After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient and result in latent failure due to mechanical stress. * Mechanical stress or shock should not be applied during cooling * Soldering a device without preheating can cause excessive thermal shock and stress which can result in damage to the device. * Due to shadowing and the inability to set the wave height to incorporate other surface mount components, the D2PAK is not recommended for wave soldering. temperature gradient shall be 5C or less. Rectifier Device Data 3 MBRB2535CTL RECOMMENDED PROFILE FOR REFLOW SOLDERING For any given circuit board, there will be a group of control settings that will give the desired heat pattern. The operator must set temperatures for several heating zones, and a figure for belt speed. Taken together, these control settings make up a heating "profile" for that particular circuit board. On machines controlled by a computer, the computer remembers these profiles from one operating session to the next. Figure 5 shows a typical heating profile for use when soldering the D2PAK to a printed circuit board. This profile will vary among soldering systems but it is a good starting point. Factors that can affect the profile include the type of soldering system in use, density and types of components on the board, type of solder used, and the type of board or substrate material being used. This profile shows temperature versus time. The line on the graph shows the actual temperature that might be experienced on the surface of a test board at or near a central solder joint. The two profiles are based on a high density and a low density board. The Vitronics SMD310 convection/infrared reflow soldering system was used to generate this profile. The type of solder used was 62/36/2 Tin Lead Silver with a melting point between 177 -189C. When this type of furnace is used for solder reflow work, the circuit boards and solder joints tend to heat first. The components on the board are then heated by conduction. The circuit board, because it has a large surface area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. STEP 1 PREHEAT ZONE 1 "RAMP" STEP 2 STEP 3 VENT HEATING "SOAK" ZONES 2 & 5 "RAMP" STEP 4 HEATING ZONES 3 & 6 "SOAK" STEP 5 HEATING ZONES 4 & 7 "SPIKE" STEP 6 VENT STEP 7 COOLING 200C DESIRED CURVE FOR HIGH MASS ASSEMBLIES 150C 150C 160C 170C 205 TO 219C PEAK AT SOLDER JOINT 100C 100C 140C SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS ASSEMBLIES 50C TIME (3 TO 7 MINUTES TOTAL) TMAX Figure 5. Typical Solder Heating Profile for D2PAK 4 Rectifier Device Data MBRB2535CTL PACKAGE DIMENSIONS C E B 4 V NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. INCHES MIN MAX 0.340 0.380 0.380 0.405 0.160 0.190 0.020 0.035 0.045 0.055 0.100 BSC 0.080 0.110 0.018 0.025 0.090 0.110 0.575 0.625 0.045 0.055 MILLIMETERS MIN MAX 8.64 9.65 9.65 10.29 4.06 4.83 0.51 0.89 1.14 1.40 2.54 BSC 2.03 2.79 0.46 0.64 2.29 2.79 14.60 15.88 1.14 1.40 A 1 2 3 S -T- SEATING PLANE K G D 3 PL 0.13 (0.005) H M J DIM A B C D E G H J K S V T CASE 418B-02 ISSUE B STYLE 3: PIN 1. 2. 3. 4. ANODE CATHODE ANODE CATHODE Rectifier Device Data 5 MBRB2535CTL Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola and are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. Mfax is a trademark of Motorola, Inc. How to reach us: USA / EUROPE / Locations Not Listed: Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 303-675-2140 or 1-800-441-2447 MfaxTM: RMFAX0@email.sps.mot.com - TOUCHTONE 602-244-6609 INTERNET: http://Design-NET.com JAPAN: Nippon Motorola Ltd.; Tatsumi-SPD-JLDC, 6F Seibu-Butsuryu-Center, 3-14-2 Tatsumi Koto-Ku, Tokyo 135, Japan. 81-3-3521-8315 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852-26629298 6 CODELINE TO BE PLACED HERE Rectifier Device Data MBRB2535CTL/D |
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