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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HT200210 Issued Date : 2001.01.01 Revised Date : 2002.05.08 Page No. : 1/3
HMJE13003
NPN EPITAXIAL PLANAR TRANSISTOR
Description
* High Voltage, High Speed Power Switch * Switch Regulators * PWM Inverters and Motor Controls * Solenoid and Relay Drivers * Deflection Circuits
TO-126
Absolute Maximum Ratings (Ta=25C)
* Maximum Temperatures Storage Temperature ............................................................................................ -50 ~ +150 C Junction Temperature ...................................................................................... 150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Tc=25C) ..................................................................................... 40 W * Maximum Voltages and Currents (Ta=25C) VCEX Collector to Emitter Voltage .................................................................................... 700 V VCEO Collector to Emitter Voltage .................................................................................... 400 V VEBO Emitter to Base Voltage .............................................................................................. 9 V IC Collector Current ........................................................................................ Continuous 1.5 A IB Base Current ............................................................................................. Continuous 0.75 A
Characteristics (Ta=25C)
Symbol BVCEX BVCEO IEBO ICEX *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *VBE(sat) *hFE1 *hFE2 Min. 700 400 8 5 Typ. Max. 1 1 500 1 3 1 1.2 40 25 Unit V V mA mA mV V V V V Test Conditions IC=1mA, VBE(off)=1.5V IC=10mA VEB=9V VCE=700V, VBE(off)=1.5V IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=1.5A, IB=0.5A IC=0.5A, IB=0.1A IC=1A, IB=0.25A IC=0.5A, VCE=2V IC=1A, VCE=2V
*Pulse Test: Pulse Width 380us, Duty Cycle2%
HMJE13003
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100
Spec. No. : HT200210 Issued Date : 2001.01.01 Revised Date : 2002.05.08 Page No. : 2/3
Saturation Voltage & Collector Current
1000 VCE(sat) @ IC=3IB
125 C
o
75 C
o
Saturation Voltage (mV)
75 C
o
25 C
o
hFE
10
100 125 C
o
hFE @ VCE=2V
25 C
o
1 0.1 1 10 100 1000 10000
10 1 10 100 1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
10000 VCE(sat) @ IC=4IB
10000
Saturation Voltage & Collector Current
VCE(sat) @ IC=5IB
Saturation Voltage (mV)
1000 75 C 125 C 100
o o
Saturation Vpltage (mV)
1000 75 C 125 C 100 25 C
o o o
25 C
o
10 1 10 100 1000 10000
10 1 10 100 1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
Saturation Voltage & Collector Current
10000 VBE(sat) @ IC=4IB
Saturation Voltage & Collector Current
10000 VBE(sat) @ IC=5IB
Saturation Voltage (mV)
Saturation Voltage (mV)
75 C 1000 25 C
o
o
75 C 1000 25 C
o
o
125 C
o
125 C
o
100 1 10 100 1000 10000
100 1 10 100 1000 10000
Collector Current-IC (mA)
Collector Current-IC (mA)
HMJE13003
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-126 Dimension
D A B 123 G C I E J K M
Spec. No. : HT200210 Issued Date : 2001.01.01 Revised Date : 2002.05.08 Page No. : 3/3
Marking:
3
Date Code
H MJ E 13003 Control Code
4
Style: Pin 1.Base 2.Collector 3.Emitter
F H
L
1 2
3-Lead TO-126 Plastic Package HSMC Package Code: T
*: Typical
DIM 1 2 3 4 A B C D E
Inches Min. Max. *3 *3 *3 *3 0.1500 0.1539 0.2752 0.2791 0.5315 0.6102 0.2854 0.3039 0.0374 0.0413
Millimeters Min. Max. *3 *3 *3 *3 3.81 3.91 6.99 7.09 13.50 15.50 7.52 7.72 0.95 1.05
DIM F G H I J K L M
Inches Min. Max. 0.0280 0.0319 0.0480 0.0520 0.1709 0.1890 0.0950 0.1050 0.0450 0.0550 0.0450 0.0550 *0.0217 0.1378 0.1520
Millimeters Min. Max. 0.71 0.81 1.22 1.32 4.34 4.80 2.41 2.66 1.14 1.39 1.14 1.39 *0.55 3.50 3.86
Notes: 1.Dimension and tolerance based on our Spec. dated Mar. 6,1995.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HMJE13003
HSMC Product Specification

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