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| CXG1014N 1.5 GHz Low Noise Amplifier/Down Conversion Mixer Description The CXG1014N is a low noise amplifier/down conversion mixer MMIC, designed using the Sony's GaAs J-FET process. Features * Low noise NF=1.85 dB (Typ.) at 1.49 GHz (low noise amplifier) * Low distortion Input IP3=+2 dBm (Typ.) at 1.49 GHz (mixer) * Low LO input power operation -15 dBm * Single 3.0 V power supply operation * 16-pin SSOP package Applications 1.5 GHz Japan digital cellular telephones Structure GaAs J-FET MMIC 16 pin SSOP (Plastic) Absolute Maximum Ratings (Ta=25 C) * Supply voltage VDD 6 V * Operating temperature Topr -35 to +85 C * Storage temperature Tstg -65 to +150 C * Power dissipation PD 150 mW * Current consumption IDD (low noise amplifier) 20 mA IDD (LO amplifier) 10 mA IDD (mixer, IF amplifier) 20 mA * Input power PIN +5 dBm Operating Condition Supply voltage 3.0 V Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. --1-- E97408-TE CXG1014N Electrical Characteristics VDD=3.0 V, fRF=1.49 GHz, fLO=1.62 GHz, PLO=-15 dBm, when 50 I/O matching; unless otherwise specified (Ta=25 C) Item Current consumption Power gain Noise figure Input IP3 Isolation Current consumption Conversion gain Noise figure Input IP3 LO to RF leak level Symbol IDD GP NF IIP3 ISO IDD GC NF IIP3 PLK Min. -- 14 -- -7.5 30 -- 6 -- -2 -- Typ. 2.2 16 1.85 -3.5 35 3.8 8 8.5 2 -17 Max. 3.0 18 2.6 -- -- 5.5 10 10.5 -- -12 Unit mA dB dB dBm dB mA dB dB dBm dBm Measurement condition When no signal Low noise amplifier When no signal Mixer Block Diagram LNA LNA RFIN MIX LOIN LO AMP IF AMP IFOUT MIX RFIN LNA RFOUT Pin Configuration 1 LNA RFIN NC CAP GND GND LOIN CAP VDD (LO AMP) 16pin SSOP (PLASTIC) 16 LNA RFOUT/VDD (LNA) NC NC GND GND MIX RFIN CAP IF OUT/VDD (MIX, IF AMP) --2-- CXG1014N Recommended Circuit L1 LNA RFIN L2 C1 1 16 L3 C2 LNA RFOUT R1 C13 C12 C6 L4 VDD (LNA) C7 C14 L7 LOIN L8 C15 C4 L5 C3 MIX RFIN L6 C16 L9 VDD (LO AMP) C9 C8 L10 C10 IFOUT C5 VDD (MIX, IF AMP) C11 L1 L2 L3 L4 L5 L6 L7 L8 L9 6.8 nH 4.7 nH 4.7 nH 3.3 nH 10 nH 4.7 nH 5.6 nH 3.3 nH 10 nH L10 C1 C2 C3 C4 C5 C6 C7 C8 150 nH 100 pF 100 pF 2 pF 100 pF 10 pF 1000 pF 1 F 1000 pF C9 C10 C11 C12 C13 C14 C15 C16 R1 10 nF 1000 pF 1 F 100 pF 1000 pF 1 F 1000 pF 1 F 1 k --3-- CXG1014N Recommended Evaluation Board Front 50mm SONY CXG1014N LNA RFOUT LNA RFIN L2 C2 C7 C6 L1 C1 L8 L7 C4 L9 C8 C10 C9 C11 LOIN IFOUT GND R1 L3 L5 C3 L6 L10 C5 MIX RFIN L4 VDD (LNA) VDD (LO AMP) VDD (MIX, IF AMP) Back C14 C13 C12 C16 C15 GND VDD (MIX, IF AMP) VDD (LO AMP) VDD (LNA) Glass fabric-base epoxy 4-layer board (2 x 0.3 mm thickness) GND for the 2nd and 3rd layers. --4-- CXG1014N Example of Representative Characteristics (Ta=25 C) LNA block POUT, IM3 vs. PIN 20 20 MIX block POUT, IM3 vs. PIN POUT 0 0 POUT POUT-RF output Power (dBm) -20 POUT-IF output Power (dBm) -20 IM3 -40 VDD=3.0V fRF1=1.49GHz fRF2=1.4901GHz -60 IM3 -40 VDD=3.0V fRF1=1.49GHz fRF2=1.4901GHz fLO=1.62GHz PLO=-15dBm -60 -80 -40 -30 -20 -10 PIN-RF input power (dBm) 0 -80 -35 -25 -15 -5 PIN-RF input power (dBm) 5 MIX block GC, NF vs. PLO 10 GC 8 13 2 15 4 MIX block IIP3, PLK vs. PLO -5 IIP3 6 VDD=3.0V fRF=1.49GHz fLO=1.62GHz 4 NF 2 11 0 PLK -2 VDD=3.0V fRF=1.49GHz fLO=1.62GHz -4 -15 9 -20 7 -25 0 -25 5 -20 -15 -10 -5 PLO-LO input power (dBm) 0 5 -6 -25 -30 -20 -15 -10 -5 PLO-LO input power (dBm) 0 5 --5-- PLK-LO to RF leak level (dBm) -10 GC-Conversion gain (dB) NF-Noise figure (dB) IIP3-Input IP3 (dBm) CXG1014N Package Outline Unit : mm 16PIN SSOP (PLASTIC) 5.0 0.1 + 0.2 1.25 - 0.1 0.1 16 9 A 4.4 0.1 1 + 0.1 0.22 - 0.05 8 0.65 0.12 + 0.05 0.15 - 0.02 0.1 0.1 0 to 10 DETAIL A NOTE: Dimension "" does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SSOP-16P-L01 SSOP016-P-0044 LEAD TREATMENT LEAD MATERIAL PACKAGE WEIGHT EPOXY RESIN SOLDER / PALLADIUM PLATING COPPER / 42 ALLOY 0.1g NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). --6-- 0.5 0.2 6.4 0.2 |
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