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TFA9842J
2-channel audio amplifier; SE: 1 W to 7.5 W; BTL: 2 W to 15 W
Rev. 01 -- 26 April 2004 Preliminary data
1. General description
The TFA9842J contains two identical audio power amplifiers. The TFA9842J can be used as two Single-Ended (SE) channels with a fixed gain of 26 dB or one Bridge-Tied Load (BTL) channel with a fixed gain of 32 dB. The TFA9842J comes in a 9-pin DIL-bent-SIL (DBS9P) power package. The TFA9842J is pin compatible with the TFA9841J and TFA9843J. The TFA9842J contains a unique protection circuit that is solely based on multiple temperature measurements inside the chip. This gives maximum output power for all supply voltages and load conditions with no unnecessary audio holes. Almost any supply voltage and load impedance combination can be made as long as thermal boundary conditions (number of channels used, external heatsink and ambient temperature) allow it.
2. Features
s s s s s s s s s SE: 1 W to 7.5 W; BTL: 2 W to 15 W operation possibility Soft clipping Standby and mute mode No on/off switching plops Low standby current High supply voltage ripple rejection Outputs short-circuit protected to ground, supply and across the load Thermally protected Pin compatible with the TFA9841J and TFA9843J.
3. Applications
s s s s Television PC speakers Boom box Mini and micro audio receivers.
Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
4. Quick reference data
Table 1: VCC Iq Istb Po Quick reference data Conditions operating no signal quiescent supply current standby supply current output power VCC = 17 V; THD = 10 % SE; RL = 4 BTL; RL = 8 THD Gv SVRR total harmonic distortion voltage gain supply voltage ripple rejection SE; Po = 1 W BTL; Po = 1 W SE BTL f = 1 kHz SE BTL 60 65 dB dB 7 14 25 31 7.5 15 0.1 0.05 26 32 0.5 0.5 27 33 W W % % dB dB VCC = 18 V; RL = Min 9 Typ 17 60 Max 26 28 100 10 Unit V V mA A supply voltage Symbol Parameter
5. Ordering information
Table 2: Type number TFA9842J Ordering information Package Name DBS9P Description plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad Version SOT523 -1
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Preliminary data
Rev. 01 -- 26 April 2004
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
6. Block diagram
VCC 9 IN1+ 4 60 k 1 60 k 3 VREF SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC MODE 7 STANDBY MUTE ON 2 8 OUT1+
IN2+
OUT2-
CIV
TFA9842J
6 0.5VCC
SVR
5
MDB801
GND
Fig 1. Block diagram.
7. Pinning information
7.1 Pinning
IN2+ OUT2- CIV IN1+ GND SVR MODE OUT1+ VCC
1 2 3 4 5 6 7 8 9
MDB802
TFA9842J
Fig 2. Pin configuration.
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Preliminary data
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
7.2 Pin description
Table 3: Symbol IN2+ OUT2- CIV IN1+ GND SVR MODE OUT1+ VCC TAB Pin description Pin 1 2 3 4 5 6 7 8 9 Description input 2 inverted loudspeaker terminal 2 common input voltage decoupling input 1 ground half supply voltage decoupling (ripple rejection) mode selection input (standby, mute and operating) non inverted loudspeaker terminal 1 supply voltage back side tab or heats spreader has to be connected to ground
8. Functional description
8.1 Input configuration
The input cut-off frequency is: 1 f i ( cut - off ) = ---------------------------2 ( R i x C i ) SE application: Ri = 60 k and Ci = 220 nF: 1 f i ( cut - off ) = ---------------------------------------------------------------- = 12 Hz 3 -9 2 ( 60 x 10 x 220 x 10 ) BTL application: Ri = 30 k and Ci = 470 nF: 1 f i ( cut - off ) = ---------------------------------------------------------------- = 11 Hz 3 -9 2 ( 30 x 10 x 470 x 10 )
(1)
(2)
(3)
As shown in Equation 2 and Equation 3, large capacitor values for the inputs are not necessary, so the switch-on delay during charging of the input capacitors can be minimized. This results in a good low frequency response and good switch-on behavior.
8.2 Power amplifier
The power amplifier is a Single-Ended (SE) and/or Bridge-Tied Load (BTL) amplifier with an all-NPN output stage, capable of delivering a peak output current of 3 A. Using the TFA9842J as a BTL amplifier offers the following advantages:
* Lower peak value of the supply current
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Preliminary data
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
* Ripple frequency on the supply voltage is twice the signal frequency * No expensive DC-blocking capacitor * Good low frequency performance.
8.2.1 Output power measurement The output power as a function of the supply voltage is measured on the output pins at THD = 10 %; see Figure 6. The maximum output power is limited by the supply voltage of 26 V and the maximum available output current is 3 A (repetitive peak current). A minimum load for SE of 4 and for BTL of 16 is required for VCC > 22 V; see Figure 5. 8.2.2 Headroom Typical CD music requires at least 12 dB (factor 15.85) dynamic headroom, compared to the average power output, for transferring the loudest parts without distortion. At VCC = 18 V and Po = 5 W (SE with RL = 4 ) or Po = 10 W (BTL with RL = 8 ) at THD = 0.2 % (see Figure 7), the Average Listening Level (ALL) music power without any distortion yields: 5 10 P o ( ALL, SE ) = --------------- = 315 mW 15.85 10 10 P o ( ALL, BTL ) = ------------------ = 630 mW 15.85
3 3
(4)
(5)
The power dissipation can be derived from Figure 9 (SE and BTL) for a headroom of 0 dB and 12 dB, respectively (see Table 4).
Table 4: Headroom 0 dB 12 dB Power rating as function of headroom Power output SE Po = 5 W Po(ALL) = 315 mW BTL Po = 10 W Po(ALL) = 630 mW Power dissipation (both channels driven) PD = 8.4 W PD = 4.2 W
For the average listening level a power dissipation of 4.2 W can be used for a heatsink calculation.
8.3 Mode selection
The TFA9842J has three functional modes, which can be selected by applying the proper DC voltage to pin MODE (see Table 5 and Figure 3).
Table 5: VMODE 0 to 0.8 V 4.5 V to (VCC - 3.5 V) (VCC - 2.0 V) to VCC Mode selection Amplifiers 1 and 2 standby mute on
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Preliminary data
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
Standby -- The current consumption is very low and the outputs are floating. The device is in standby mode when VMODE < 0.8 V, or when pin MODE is grounded. Mute -- The amplifier is DC-biased but not operational (no audio output). This allows the input coupling capacitors to be charged to avoid pop-noise. The device is in mute mode when 4.5 V < VMODE < (VCC - 3.5 V). On -- The amplifier is operating normally. The operating mode is activated at VMODE > (VCC - 2.0 V).
standby
all mute
1/2 on
0.8
4.5
VCC-3.5 VCC-2.0 VCC VMODE (V)
MCE502
Fig 3. Mode selection.
8.4 Supply voltage ripple rejection
The supply voltage ripple rejection (SVRR) is measured with an electrolytic capacitor of 150 F on pin SVR using a bandwidth of 20 Hz to 22 kHz. Figure 11 illustrates the SVRR as function of the frequency. A larger capacitor value on pin SVR improves the ripple rejection behavior at the lower frequencies.
8.5 Built-in protection circuits
The TFA9842J contains two types of temperature sensors; one measures local temperatures of the power stages and one measures the global chip temperature. At a local temperature of the power stage of approximately 185 oC or a global temperature of approximately 150 oC this detection circuit switches off the power stages for 2 ms. High impedance of the outputs is the result. After this time period the power stages switch on automatically and the detection will take place again; still a too high temperature switches off the power stages immediately. This protects the TFA9842J against shorts to ground, to the supply voltage, across the load and too high chip temperatures. The protection will only be activated when necessary, so even during a short-circuit condition, a certain amount of (pulsed) current will still be flowing through the short, just as much as the power stage can handle without exceeding the critical temperature level.
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Preliminary data
Rev. 01 -- 26 April 2004
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
9. Limiting values
Table 6: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC VI IORM Tstg Tamb Ptot VCC(sc) Parameter supply voltage input voltage repetitive peak output current storage temperature ambient temperature total power dissipation supply voltage to guarantee short-circuit protection non-operating operating Conditions operating no signal Min -0.3 -0.3 -0.3 -55 -40 Max +26 +28 VCC + 0.3 3 +150 +85 35 24 Unit V V V A C C W V
10. Thermal characteristics
Table 7: Symbol Rth(j-a) Rth(j-c) Thermal characteristics Parameter thermal resistance from junction to ambient thermal resistance from junction to case Conditions in free air both channels driven Value 40 2.0 Unit K/W K/W
11. Static characteristics
Table 8: Static characteristics VCC = 17 V; Tamb = 25 C; RL = 8 ; VMODE = VCC; Vi = 0 V; measured in test circuit Figure 13; unless otherwise specified. Symbol VCC Iq Istb VO VOUT VMODE Parameter supply voltage quiescent supply current standby supply current DC output voltage differential output voltage offset BTL mode mode selection input voltage on mode mute mode standby mode IMODE
[1] [2] [3] [4]
Conditions operating RL = VMODE = 0
[3] [4] [1] [2]
Min 9 VCC - 2.0 4.5 0 -
Typ 17 60 9 -
Max 26 100 10 200 VCC VCC - 3.5 0.8 20
Unit V mA A V mV V V V A
input current on pin MODE
0 < VMODE < VCC - 3.5
A minimum load for BTL of 16 is required at VCC > 22 V. With a load connected at the outputs the quiescent supply current will increase. The DC output voltage with respect to ground is approximately 0.5VCC. VOUT = VOUT1+ - VOUT2-
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Preliminary data
Rev. 01 -- 26 April 2004
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
12. Dynamic characteristics
Table 9: Dynamic characteristics SE VCC = 17 V; Tamb = 25 C; RL = 4 ; f = 1 kHz; VMODE = VCC; measured in test circuit Figure 12; unless otherwise specified. Symbol Po THD Gv Zi Vn(o) SVRR Vo(mute) cs |Gv|
[1] [2]
Parameter output power total harmonic distortion SE voltage gain input impedance noise output voltage supply voltage ripple rejection output voltage in mute mode channel separation channel unbalance
Conditions THD = 10 %; RL = 4 THD = 0.5 % RL = 4 Po = 1 W
Min 7 25 40
[1]
Typ 7.5 6.1 0.1 26 60 150 60 60 60 -
Max 0.5 27 150 1
Unit W W % dB k V dB dB V dB dB
50 -
fripple = 1 kHz fripple = 100 Hz to 20 kHz Rsource = 0
[2] [2] [3]
[3]
The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance Rsource = 0 at the input. Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. Output voltage in mute mode (VMODE = 7 V) is measured with an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise.
Table 10: Dynamic characteristics BTL VCC = 17 V; Tamb = 25 C; RL = 8 ; f = 1 kHz; VMODE = VCC; measured in test circuit Figure 13; unless otherwise specified. Symbol Po THD Gv Zi Vn(o) SVRR Vo(mute) cs |Gv|
[1] [2]
Parameter output power total harmonic distortion BTL voltage gain input impedance noise output voltage supply voltage ripple rejection output voltage in mute mode channel separation channel unbalance
Conditions THD = 10 %; RL = 8 THD = 0.5 %; RL = 8 Po = 1 W
Min 14 31 20
[1]
Typ 15 14 0.05 32 30 200 65 65 65 -
Max 0.5 33 250 1
Unit W W % dB k V dB dB V dB dB
50 -
fripple = 1 kHz fripple = 100 Hz to 20 kHz Rsource = 0
[2] [2] [3]
[3]
The noise output voltage is measured at the output in a frequency range from 20 Hz to 22 kHz (unweighted), with a source impedance Rsource = 0 at the input. Supply voltage ripple rejection is measured at the output, with a source impedance Rsource = 0 at the input and with a frequency range from 20 Hz to 22 kHz (unweighted). The ripple voltage is a sine wave with a frequency fripple and an amplitude of 300 mV (RMS), which is applied to the positive supply rail. Output voltage in mute mode (VMODE = 7 V) is measured with an input voltage of 1 V (RMS) in a bandwidth from 20 Hz to 22 kHz, including noise.
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Preliminary data
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
107 Vo (V) 106 105 104 103 102 10 1
mce486
0
4
8
12
16 20 VMODE (V)
BTL; Vi = 50 mV; VCC = 18 V.
Fig 4. AC output voltage as function of mode selection voltage.
40 Po (W) 30
mdb806
40 Po (W) 30 4 6 8
mdb805
20
2
3
4
20
RL = 2
16
10
RL = 1
8
10
0 8 12 16 20 24 28 VCC (V)
0
8 12 16 20 24 28 VCC (V)
THD = 10 %.
THD = 10 %.
a.
SE.
b.
BTL.
Fig 5. Output power (one channel) as function of supply voltage for various loads.
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Preliminary data
Rev. 01 -- 26 April 2004
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
15 Po (W) 12
MDB809
15 Po (W) 12
MDB810
9
9
6
6
3
3
0 8 10 12 14 16 18 VCC (V)
0 8 10 12 14 16 18 VCC (V)
THD = 10 %; RL = 4 ; f = 1 kHz.
THD = 10 %; RL = 8 ; f = 1 kHz.
a.
SE.
b.
BTL.
Fig 6. Output power as function of supply voltage.
102 THD+N (%) 10
MCE488
102 THD+N (%) 10
MCE487
1
1
10-1
10-1
10-2 10-1
1
10
Po (W)
102
10-2 10-1
1
10
Po (W)
102
VCC = 18 V; f = 1 kHz; RL = 4 .
VCC = 18 V; f = 1 kHz; RL = 8 .
a.
SE.
b.
BTL.
Fig 7. Total harmonic distortion-plus-noise as function of output power.
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Preliminary data
Rev. 01 -- 26 April 2004
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
10 THD+N (%)
MCE489
10 THD+N (%)
MCE490
1
1
10-1
10-1
10-2 10
102
103
104
f (Hz)
105
10-2 10
102
103
104
f (Hz)
105
VCC = 17 V; Po = 1 W; RL = 4 .
VCC = 17 V; Po = 1 W; RL = 8 .
a.
SE.
b.
BTL.
Fig 8. Total harmonic distortion-plus-noise as function of frequency.
10 PD (W) 8
MCE507
10 PD (W) 8
MCE508
6
6
4
4
2
2
0 0 4 8 12 16 Po (W) 20
0 0 4 8 12 16 Po (W) 20
VCC = 18 V; RL = 4 .
VCC = 18 V; RL = 8 .
a.
SE.
b.
BTL.
Fig 9. Total power dissipation as function of channel output power per channel (worst case, both channels driven).
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Preliminary data
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
cs (dB)
0
MCE495
cs (dB)
0
MCE496
-20
-20
-40
-40
-60
-60
-80
-80
-100 10
102
103
104 f (Hz)
105
-100 10
102
103
104 f (Hz)
105
VCC = 17 V; RL = 4 .
VCC = 17 V; RL = 8 .
a.
SE.
b.
BTL.
Fig 10. Channel separation as function of frequency (no bandpass filter applied).
0 SVRR (dB) -20
MCE497
0 SVRR (dB) -20
MCE498
-40
-40
-60
-60
-80 10
102
103
104
f (Hz)
105
-80 10
102
103
104
f (Hz)
105
VCC = 17 V; Rsource = 0 ; Vripple = 300 mV (RMS); a bandpass filter of 20 Hz to 22 kHz has been applied; inputs short-circuited.
VCC = 17 V; Rsource = 0 ; Vripple = 300 mV (RMS); a bandpass filter of 20 Hz to 22 kHz has been applied; inputs short-circuited.
a.
SE.
b.
BTL.
Fig 11. Supply voltage ripple rejection as function of frequency.
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Preliminary data
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
13. Application information
VCC VCC 9 220 nF Vi IN1+ 4 60 k 220 nF Vi CIV 3 VREF 8 OUT1+ 470 F + - 2 OUT2- 60 k SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC VCC 10 k 50 k 100 k 22 F 270 SVR 6 MODE 7 STANDBY MUTE ON 470 F - + RL 4 RL 4 100 nF 1000 F
IN2+ 1
0.5VCC
7.5 V microcontroller 1.5 k BC547
BC547
2.2 F
47 F
TFA9842J
5 GND
mdb803
Fig 12. Typical SE application diagram.
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Preliminary data
Rev. 01 -- 26 April 2004
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
VCC VCC 9 IN1+ 4 470 nF Vi 60 k IN2+ 1 60 k CIV 3 VREF SHORT-CIRCUIT AND TEMPERATURE PROTECTION VCC MODE 7 STANDBY MUTE ON 2 OUT2- 8 OUT1+ + - RL 100 nF 1000 F
8
MICROCONTROLLER
TFA9842J
0.5VCC
6 SVR
22 F 5 GND
MDB804
150 F
Fig 13. BTL application diagram.
Remark: Because of switching inductive loads, the output voltage can rise beyond the maximum supply voltage of 28 V. At high supply voltages, it is recommended to use (Schottky) diodes to the supply voltage and ground.
13.1 Printed-circuit board
13.1.1 Layout and grounding To obtain a high-level system performance, certain grounding techniques are essential. The input reference grounds have to be tied with their respective source grounds and must have separate tracks from the power ground tracks; this will prevent the large (output) signal currents from interfering with the small AC input signals. The small-signal ground tracks should be physically located as far as possible from the power ground tracks. Supply and output tracks should be as wide as possible for delivering maximum output power.
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Preliminary data
Rev. 01 -- 26 April 2004
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
AUDIO POWER CS NIJMEGEN
PF / 3002 .naJ 72
TVA
TFA9843J
CIV
22 F MODE
Fig 14. Printed-circuit board layout (single-sided); components view.
BTL1/2
1000 F 220 nF
1 100 nF
1000 F 220 nF
1000 F
-SE1+
SVR
-SE2+ CIV
150 F
SVR
SGND +VP IN2+ IN1+
10 k 10 k SB ON MUTE
MCE506
13.1.2
Power supply decoupling Proper supply bypassing is critical for low-noise performance and high supply voltage ripple rejection. The respective capacitor location should be as close as possible to the device and grounded to the power ground. Proper power supply decoupling also prevents oscillations. For suppressing higher frequency transients (spikes) on the supply line a capacitor with low ESR, typical 100 nF, has to be placed as close as possible to the device. For suppressing lower frequency noise and ripple signals, a large electrolytic capacitor, e.g. 1000 F or greater, must be placed close to the device. The bypass capacitor on pin SVR reduces the noise and ripple on the mid rail voltage. For good THD and noise performance a low ESR capacitor is recommended.
13.2 Thermal behavior and heatsink calculation
The measured maximum thermal resistance of the IC package, Rth(j-mb), is 2.0 K/W. A calculation for the heatsink can be made, with the following parameters: Tamb(max) = 60 C (example) VCC = 18 V and RL = 4 (SE) Tj(max) = 150 C (specification) Rth(tot) is the total thermal resistance between the junction and the ambient including the heatsink. This can be calculated using the maximum temperature increase divided by the power dissipation: Rth(tot) = (Tj(max) - Tamb(max))/PD
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Preliminary data
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
At VCC = 18 V and RL = 4 (2 x SE) the measured worst-case sine-wave dissipation is 8.4 W; see Figure 9. For Tj(max) = 150 C the temperature raise, caused by the power dissipation, is: 150 - 60 = 90 C: P x Rth(tot) = 90 C Rth(tot) = 90/8.4 = 10.7 K/W Rth(h-a) = Rth(tot) - Rth(j-mb) = 10.7 - 2.0 = 8.7 K/W. This calculation is for an application at worst-case (stereo) sine-wave output signals. In practice music signals will be applied, which decreases the maximum power dissipation to approximately half of the sine-wave power dissipation (see Section 8.2.2). This allows for the use of a smaller heatsink: P x Rth(tot) = 90 C Rth(tot) = 90/4.2 = 21.4 K/W Rth(h-a) = Rth(tot) - Rth(j-mb) = 21.4 - 2.0 = 19.4 K/W.
MDB808 MDB807
150 Tj (C) RL = 2 4 6
150 Tj (C) RL = 1 2 3
8 16
4 8
100
100
50
50
0 8 12 16 20 24 28 VCC (V)
0 8 12 16 20 24 28 VCC (V)
External heatsink of 8 K/W; with music signals; Tamb = 25 C.
External heatsink of 8 K/W; with music signals; Tamb = 25 C.
a.
SE.
b.
BTL.
Fig 15. Junction temperature as function of supply voltage for various loads.
14. Test information
14.1 Quality information
The General Quality Specification for Integrated Circuits, SNW-FQ-611 is applicable.
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
15. Package outline
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad SOT523-1
non-concave x Eh
q1
Dh D D1 P k view B: mounting base side A2 q2
E
B
q
L2 L
L3
L1
1 Z e DIMENSIONS (mm are the original dimensions) UNIT A2(2) bp mm c D(1) D1(2) Dh E(1) Eh e e1
9 wM 0 5 scale e1 e2 k 3 2 L L1 L2 L3 4.5 3.7 m 2.8 P Q q q1 q2 v w x Z(1) 1.65 1.10 10 mm Q m e2 c vM
bp
2.7 0.80 0.58 13.2 2.3 0.65 0.48 12.8
6.2 14.7 3.5 2.54 1.27 5.08 3.5 5.8 14.3
12.4 11.4 6.7 11.0 10.0 5.5
3.4 1.15 17.5 4.85 3.8 3.1 0.85 16.3 3.6
0.8 0.3 0.02
Notes 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. 2. Plastic surface within circle area D1 may protrude 0.04 mm maximum. OUTLINE VERSION SOT523-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 00-07-03 03-03-12
Fig 16. DBS9P package outline.
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
16. Soldering
16.1 Introduction to soldering through-hole mount packages
This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board.
16.2 Soldering by dipping or by solder wave
Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.
16.3 Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.
16.4 Package related soldering information
Table 11: Package DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP[2]
[1] [2]
Suitability of through-hole mount IC packages for dipping and wave soldering methods Soldering method Dipping suitable - Wave suitable[1] not suitable
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. For PMFP packages hot bar soldering or manual soldering is suitable.
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Rev. 01 -- 26 April 2004
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Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
17. Revision history
Table 12: Rev Date 01 20040426 Revision history CPCN Description Preliminary data (9397 750 12013)
9397 750 12013
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data
Rev. 01 -- 26 April 2004
19 of 21
Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
18. Data sheet status
Level I II Data sheet status[1] Objective data Preliminary data Product status[2][3] Development Qualification Definition This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN).
III
Product data
Production
[1] [2] [3]
Please consult the most recently issued data sheet before initiating or completing a design. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
19. Definitions
Short-form specification -- The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition -- Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information -- Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.
20. Disclaimers
Life support -- These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes -- Philips Semiconductors reserves the right to make changes in the products - including circuits, standard cells, and/or software - described or contained herein in order to improve design and/or performance. When the product is in full production (status `Production'), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Contact information
For additional information, please visit http://www.semiconductors.philips.com. For sales office addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.
9397 750 12013
Fax: +31 40 27 24825
(c) Koninklijke Philips Electronics N.V. 2004. All rights reserved.
Preliminary data
Rev. 01 -- 26 April 2004
20 of 21
Philips Semiconductors
TFA9842J
2-channel audio amplifier (2 x SE or 1 x BTL)
Contents
1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.2 8.2.1 8.2.2 8.3 8.4 8.5 9 10 11 12 13 13.1 13.1.1 13.1.2 13.2 14 14.1 15 16 16.1 16.2 16.3 16.4 17 18 19 20 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 4 Input configuration . . . . . . . . . . . . . . . . . . . . . . 4 Power amplifier . . . . . . . . . . . . . . . . . . . . . . . . . 4 Output power measurement . . . . . . . . . . . . . . . 5 Headroom . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Mode selection . . . . . . . . . . . . . . . . . . . . . . . . . 5 Supply voltage ripple rejection . . . . . . . . . . . . . 6 Built-in protection circuits . . . . . . . . . . . . . . . . . 6 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal characteristics. . . . . . . . . . . . . . . . . . . 7 Static characteristics. . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Application information. . . . . . . . . . . . . . . . . . 13 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 14 Layout and grounding . . . . . . . . . . . . . . . . . . . 14 Power supply decoupling . . . . . . . . . . . . . . . . 15 Thermal behavior and heatsink calculation . . 15 Test information . . . . . . . . . . . . . . . . . . . . . . . . 16 Quality information . . . . . . . . . . . . . . . . . . . . . 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Introduction to soldering through-hole mount packages . . . . . . . . . . . . . . . . . . . . . . 18 Soldering by dipping or by solder wave . . . . . 18 Manual soldering . . . . . . . . . . . . . . . . . . . . . . 18 Package related soldering information . . . . . . 18 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 20 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
(c) Koninklijke Philips Electronics N.V. 2004. Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Date of release: 26 April 2004 Document order number: 9397 750 12013

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