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3.3V, 2GHz ANY-DIFFERENTIAL INPUT-TO-LVDS 1:4 FANOUT BUFFER/ Precision EdgeTM SY89833L TRANSLATOR W/ INTERNAL TERMINATION
FEATURES
s Accepts any differential input signal and provides four LVDS output copies s Guaranteed AC performance over temperature and voltage: * > 2.0GHz fMAX * < 20ps within-device skew * < 190ps rise/fall times s Low jitter design * < 1ps(rms) cycle-to-cycle jitter * < 10ps(pk-pk) total jitter s 3.3V power supply operation s TTL/CMOS input for enable s Unique input termination and VT pin accepts DCcoupled and AC-coupled inputs (CML, PECL, LVDS, and HSTL) s High-speed LVDS outputs s Wide operating temperature range: -40C to +85C s Available in 16-pin (3mm x 3mm) MLFTM package Precision EdgeTM
DESCRIPTION
The SY89833L is a 3.3V, high-speed 2GHz differential Low Voltage Differential Swing (LVDS) 1:4 fanout buffer optimized for ultra-low skew applications. Within device skew is guaranteed to be less than 20ps over supply voltage and temperature. The differential input buffer has a unique internal termination design that allows access to the termination network through a VT pin. This feature allows the device to easily interface to different logic standards. A VREF_AC reference is included for AC-coupled applications. The SY89833L is part of Micrel's high-speed clock synchronization family. For 2.5V applications, the SY89832U provides similar functionality while operating from a 2.5V 5% supply. For applications that require a different I/O combination, consult the Micrel website at www.micrel.com, and choose from a comprehensive product line of highspeed, low-skew fanout buffers, translators and clock generators.
APPLICATIONS
s s s s Processor clock distribution SONET clock distribution Fibre Channel clock distribution Gigabit Ethernet clock distribution
FUNCTIONAL BLOCK DIAGRAM
Q0 /Q0
TYPICAL PERFORMANCE
622MHz Output
Q1
IN VT /IN 50 50
/Q1
Q2 /Q2
EN VREF--AC
D
Q
Q3 /Q3
-15mV Offset (50mV/div.)
TIME (321.9ps/div.)
Precision Edge is a trademark of Micrel, Inc. MicroLeadFrame and MLF are trademarks of Amkor Technology, Inc.
Rev.: D Amendment: /0
1
Issue Date: February 2003
Micrel
Precision EdgeTM SY89833L
PACKAGE/ORDERING INFORMATION
/Q0 Q0 VCC GND
Ordering Information
Part Number Package Type MLF-16 MLF-16 Operating Range Industrial Industrial Package Marking 833L 833L
16 15 14 13 Q1 /Q1 Q2 /Q2 1 2 3 4 5678
Q3 /Q3 VCC EN
12 11 10 9
IN VT VREF--AC /IN
SY89833LMI SY89833LMITR*
*Tape and Reel
16-Pin MLFTM
PIN DESCRIPTION
Pin Number 15, 16, 1, 2, 3, 4, 5, 6 8 Pin Name (Q0, /Q0) to (Q3, /Q3) EN Pin Function LVDS Differential (Outputs): Normally terminated with 100 across the pair (Q, /Q). See
"LVDS Outputs" section, Figure 2a. Unused outputs should be terminated with a 100
resistor across each pair. TTL/CMOS Compatible Synchronous Enable: When EN goes LOW, Q outputs will go LOW and /Q outputs will go HIGH on the next LOW transition at IN inputs. Input threshold is VCC/2V. A 25k pull-up resistor is included. The default state is HIGH when left floating. The internal latch is clocked on the falling edge of the input signal (IN, /IN). Differential Clock (Inputs): Internal 50 termination resistors to the VT pin. See "Input Interface Applications" section. Reference Voltages: Equals to VCC-1.4V, and is used for AC-coupled applications. The maximum sink/source current is 0.5mA. See "Input Interface Applications." When using VREF-AC, bypass with a 0.01F capacitor to VCC. Termination Center-Tap. For CML or LVDS inputs, leave this pin floating. See Figures 3a to 3f. See "LVDS Outputs" Figures 2a and 2b for LVDS differential and common mode measurements. Ground. Exposed pad internally connected to GND and must be connected to a ground plane for proper thermal operation. Positive Power Supply: Bypass with 0.1F//0.01F low ESR capacitors.
9, 12 10
/IN, IN VREF-AC
11
VT
13, Exposed Pad 7, 14
GND VCC
TRUTH TABLE
IN 0 1 X
Note 1.
/IN 1 0 X
EN 1 1 0
Q 0 1 0(1)
/Q 1 0 1(1)
On next negative transition of the input signal (IN).
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Micrel
Precision EdgeTM SY89833L
Absolute Maximum Ratings(Note 1)
Supply Voltage (VCC) .................................. -0.5V to +4.0V Input Voltage (VIN) ............................... -0.5V to VCC +0.3V Output Current (IOUT) ............................................... 10mA Input Current (IN, /IN) ............................................... 50mA VT Current (IVT) ...................................................... 100mA Input Sink/Source Current (VREF-AC), Note 3 ............ 2mA Lead Temperature (Soldering, 10 sec.) .................... 220C Storage Temperature (TS) ....................... -65C to +150C
Note 1.
Operating Ratings(Note 2)
Supply Voltage Range ............................ +2.97V to +3.63V Ambient Temperature (TA) ......................... -40C to +85C Package Thermal Resistance MLFTM (JA) Still-Air ............................................................. 60C/W 500lfpm ............................................................ 54C/W MLFTM (JB), Note 4 ........................................... 32C/W
Note 2. Note 3. Note 4.
Permanent device damage may occur if ABSOLUTE MAXIMUM RATINGS are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to ABSOLUTE MAXIMUM RATlNG conditions for extended periods may affect device reliability. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. Due to the limited drive capability use for input of the same package only. Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the device's most negative potential on the PCB.
DC ELECTRICAL CHARACTERISTICS(Note 1, 2)
TA = -40C to +85C Symbol VCC ICC RIN VIH VIL VIN VDIFF_IN |IIN| VREF-AC
Note 1. Note 2. Note 3.
Parameter Power Supply Voltage Range Power Supply Current Differential Input Resistance (IN, /IN) Input HIGH Voltage (IN, /IN) Input LOW Voltage (IN, /IN) Input Voltage Swing Differential Input Voltage Input Current (IN, /IN) Reference Voltage
Condition
Min 2.97
Typ 3.3 75
Max 3.63 100 120 VCC+0.3 VCC+0.2 3.6
Units V mA V V V V
No Load 80 Note 3 Note 3 Note 3, see Figure 2c VIN (max), VT = floating. Note 3, see Figure 2d Note 3 Note 3 0.1 -0.3 0.1 0.2
100
45 VCC-1.525 VCC-1.425 VCC-1.325
mA V
The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Specification for packaged product only. Due to the internal termination (see "Differential Input") the input current depends on the applied voltages at IN, /IN and VT inputs. Do not apply a combination of voltages that causes the input current to exceed the maximum limit.
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Micrel
Precision EdgeTM SY89833L
LVDS OUTPUTS DC ELECTRICAL CHARACTERISTICS(Note 1, 2)
VCC = 3.3V 10%, TA = -40C to +85C Symbol VOH VOL VOCM VOCM VOUT VDIFF_OUT
Note 1. Note 2. Note 3.
Parameter Output HIGH Voltage Output LOW Voltage Output Common Mode Voltage Change in Common Mode Voltage Single-Ended Output Differential Output
Condition Note 3 Note 3
Min
Typ
Max 1.475
Units V V
0.925 1.125 -50 1.275 50 350 700 450 900
V mV mV mV
see Figures 2c-2d see Figures 2c-2d
250 500
The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Specification for packaged product only. Measured as per Figure 2a, 100 across Q and /Q outputs.
LVTTL/CMOS INPUTS DC ELECTRICAL CHARACTERISTICS(Note 1, 2)
VCC = 3.3V 10%, TA = -40C to +85C Symbol VIH VIL IIH IIL
Note 1. Note 2.
Parameter Input HIGH Voltage Input LOW Voltage Input HIGH Current Input LOW Current
Condition
Min 2.0 0 -125
Typ
Max VCC 0.8 20 -300
Units V V A A
The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. Specification for packaged product only.
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Micrel
Precision EdgeTM SY89833L
AC ELECTRICAL CHARACTERISTICS(Note 1, 2)
VCC = 3.3V 10%, TA = -40C to +85C Symbol fMAX tPLH tPHL tSKEW tS tH tJITTER t r, t f
Note 1. Note 2. Note 3. Note 4. Note 5. Note 6. Note 7.
Parameter Maximum Frequency Differential Propagation (Delay) (IN-to-Q) Within-Device Skew (Differential) Part-to-Part Skew (Differential) Set-Up Time (EN to IN, /IN) Hold Time (EN to IN, /IN) Cycle-to-Cycle Jitter (rms) Total Jitter Output Rise/Fall Times (20% to 80%)
Condition 200mVpp Output Swing Input Swing: <400mV Input Swing: 400V Note 3
Min 2.0 400 330
Typ
Max
Units GHz
500 440 5
600 530 20 200
ps ps ps ps ps ps
Note 4 and Note 5 Note 4 and Note 5 Note 6 Note 7
300 500 1 10 60 110 190
ps(rms) ps(pk-pk) ps
Measured with 400mV input signal, 50% duty cycle, all outputs are loaded with 100 between Q and /Q. Output swing is 200mV. Specification for packaged product only. Skew is measured between outputs under identical transitions. Set-up and hold times apply to synchronous applications that intend to enable/disable before the next clock cycle. For asynchronous applications set-up and hold times do not apply. See "Timing Diagram." Cycle-to-cycle jitter definition: The variation period between adjacent cycles over a random sample of adjacent cycle pairs. TJITTER_CC = Tn -Tn+1 where T is the time between rising edges of the output signal. Total jitter definition: with an ideal clock input frequency of fMAX (device), no more than one output edge in 1012 output edges will deviate by more than the specified peak-to-peak jitter value.
TIMING DIAGRAM
EN VCC/2 tS /IN IN VIN tPLH, tPHL /Q Q VOUT Swing tPLH,tPHL tH VCC/2
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Micrel
Precision EdgeTM SY89833L
TYPICAL OPERATING CHARACTERISTICS
VCC = 3.3V, VIN = 400mV, TA = 25C, unless otherwise stated.
Output Swing vs. Frequency
350 300 AMPLITUDE (mV) 250 200 150 100 50 0 0 0.5 1 1.5 2 FREQUENCY (GHz) 2.5 TSKEW (ps) 14 12 10 8 6 4 2
TSKEW vs. Temperature
0 -40 -20 0 20 40 60 80 100 TEMPERATURE (C)
Propagation Delay vs. Input Voltage Swing
600 PROPAGATION DELAY (ps) 500 400 300 200 100 0 0 200 400 600 800 INPUT VOLTAGE SWING (mV)
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Micrel
Precision EdgeTM SY89833L
FUNCTIONAL CHARACTERISTICS
VCC = 3.3V, VIN = 400mV, TA = 25C, unless otherwise stated.
155MHz Output
622MHz Output
--15mV Offset
--15mV Offset
(150mV/div.)
(150mV/div.)
TIME (1.29ns/div.)
TIME (321.9ps/div.)
1GHz Output
--10mV Offset
(150mV/div.)
TIME (200ps/div.)
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Micrel
Precision EdgeTM SY89833L
INPUT STAGE
VCC
VCC
VCC
1.86k9
1.86k9
25k
R
EN
1.86k9 1.86k9
IN 509 VT 509 /IN GND
R
GND
Figure 1a. Simplified Differential Input Buffer
Figure 1b. Simplified TTL/CMOS Input Buffer
LVDS OUTPUTS
LVDS specifies a small swing of 350mV typical, on a nominal 1.25V common mode above ground. The common mode voltage has tight limits to permit large variations in ground noise between an LVDS driver and receiver.
50
vOUT vOH, vOL vOH, vOL 100
50
vOCM, vOCM
GND
GND
Figure 2a. LVDS Differential Measurement
Figure 2b. LVDS Common Mode Measurement
QOUT VOUT, VIN 350mV (typical) /QOUT
QOUT 700mV QOUT - /QOUT VDIFF_IN, VDIFF_OUT /QOUT
Figure 2c. Single-Ended Swing
Figure 2d. Differential Swing
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Micrel
Precision EdgeTM SY89833L
INPUT INTERFACE APPLICATIONS
VCC VCC = 3.3V
VCC = 3.3V
VCC = 3.3V
VCC = 3.3V
VCC = 3.3V
IN CML /IN SY89833L NC NC VT VREF_AC 0.01F VCC CML
IN
LVPECL
IN /IN
SY89833L
/IN
VCC-2V*
VT
SY89833L VT
0.01F
VREF_AC
50
NC
VREF_AC
(*Bypass with 0.01F to GND)
Figure 3a. DC-Coupled CML Input Interface
Figure 3b. AC-Coupled CML Input Interface
Figure 3c. DC-Coupled PECL Input Interface
VCC = 3.3V
VCC = 3.3V
VCC
VCC = 3.3V
VCC = 1.8V to 3.3V
VCC = 3.3V
IN
LVPECL
IN LVDS /IN
SY89833L
HSTL
IN /IN
/IN Rpd 100 Rpd 100
SY89833L NC NC VT VREF_AC
NC VT
SY89833L
VT VREF_AC
0.01F VCC
VREF_AC
Figure 3d. AC-Coupled PECL Input Interface
Figure 3e. LVDS Input Interface
Figure 3f. HSTL Input Interface
RELATED PRODUCT AND SUPPORT DOCUMENTS
Part Number SY89830U SY89831U SY89832U SY89833U Function 2.5V/3.3V/5V 2.5GHz 1:4 PECL/ECL Clock Driver with 2:1 Differential Input Mux 2GHz Ultra Low-Jitter and Skew 1:4 LVPECL Fanout Buffer/Translator w/ Internal Termination 2GHz Ultra Low-Jitter and Skew 1:4 LVPECL Fanout Buffer/Translator w/ Internal Termination 2GHz ANY DIFFERENTIAL INPUT-to-LVDS Out 1:4 Fanout Buffer Translator w/ Internal Termination 16-MLFTM Manufacturing Guidelines Exposed Pad Application Note HBW Solutions New Products and Termination App. Note Data Sheet Link http://www.micrel.com/product-info/products/sy89830u.shtml http://www.micrel.com/product-info/products/sy89831u.shtml http://www.micrel.com/product-info/products/sy89832u.shtml http://www.micrel.com/product-info/products/sy89833u.shtml http://www.amkor.com/products/notes_papers/MLF_appnote_0301.pdf http://www.micrel.com/product-info/as/solutions.shtml
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Micrel
Precision EdgeTM SY89833L
16 LEAD EPAD MicroLeadFrameTM (MLF-16)
0.42 +0.18 -0.18 0.23 +0.07 -0.05 0.01 +0.04 -0.01 0.65 +0.15 -0.65 0.20 REF. 0.42
+0.18 -0.18
0.85 +0.15 -0.65 3.00BSC 2.75BSC
16 1
1.60 +0.10 -0.10 PIN 1 ID
N 1
0.50 DIA
2 3 4
2.75BSC 3.00BSC
2 3 4
1.60 +0.10 -0.10
12 max SEATING PLANE TOP VIEW CC C L 4 0.23 +0.07 -0.05 0.01 +0.04 -0.01 1. 2. 3. 4.
0.42 +0.18 -0.18
0.5 BSC 1.5 REF BOTTOM VIEW
0.40 +0.05 -0.05
0.5BSC FOR EVEN TERMINAL/SIDE
SECTION "C-C" SCALE: NONE
DIMENSIONS ARE IN mm. DIE THICKNESS ALLOWABLE IS 0.305mm MAX. PACKAGE WARPAGE MAX 0.05mm. THIS DIMENSION APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.20mm AND 0.25mm FROM TIP. 5. APPLIES ONLY FOR TERMINALS
Package EP- Exposed Pad
Rev. 02
Die
CompSide Island
Heat Dissipation Heat Dissipation VEE Heavy Copper Plane VEE Heavy Copper Plane
PCB Thermal Consideration for 16-Pin MLFTM Package (Always solder, or equivalent, the exposed pad to the PCB) Package Notes: Note 1. Note 2. Package meets Level 2 moisture sensitivity classification, and are shipped in dry-pack form. Exposed pads must be soldered to a ground for proper thermal management.
MICREL, INC.
TEL
1849 FORTUNE DRIVE SAN JOSE, CA 95131
FAX
USA
+ 1 (408) 944-0800
+ 1 (408) 944-0970
WEB
http://www.micrel.com
The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer. Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser's use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser's own risk and Purchaser agrees to fully indemnify Micrel for any damages resulting from such use or sale. (c) 2003 Micrel, Incorporated.
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