 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| INTEGRATED CIRCUITS DATA SHEET HTRC12002B HITAG co-processor Product specification Supersedes data of 2000 Sep 01 File under Integrated Circuits, IC11 2001 Nov 15 Philips Semiconductors Product specification HITAG co-processor FEATURES General security concept * Data encryption * Encryption mutual authentication * Password verification. Additional features * On-chip EEPROM to store secret data * Uncomplicated host interface * Sleep mode for reduced current consumption. All secret keys are stored within the HTRC12002B. GENERAL DESCRIPTION The HITAG(1) co-processor is designed to perform all computations of the read/write device in a system where HITAG1 and HITAG2 transponders are used. The device performs all encryption computations needed to access transponders and cards based on the HITAG1 respectively HITAG2 ICs in secure mode. Usually the HTRC12002B is used in combination with the HTRC11001T, which comprises the complete analog part of a read/write device. (1) HITAG - is a trademark of Philips Semiconductors Gratkorn GmbH. HTRC12002B Access to related extended data sheet This short data sheet will inform about the basic features of the product and about the mechanical dimensions only. Due to our marketing strategy to supply reader manufacturers with an IC based toolset for HITAG readers the HITAG12002B is available without any license fees. However, because of the security aspect of this product Philips tracks the delivery of the extended data sheet HTRC12002B, which includes all additional necessary information to run the HTRC12002B. In order to gain access to the extended data sheet, please contact your local sales office in order to sign a non-disclosure agreement. ORDERING INFORMATION PACKAGE TYPE NUMBER NAME HTRC12002B LQFP32 DESCRIPTION plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm VERSION SOT358-1 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134) SYMBOL Tstg Tj VDD VI PARAMETER storage temperature junction temperature supply voltage input voltage at any pin with respect to ground (VSS) -65 - -0.5 -0.5 MIN. 90 +7.0 VDD + 0.5 MAX. +150 C C V V UNIT 2001 Nov 15 2 Philips Semiconductors Product specification HITAG co-processor DC CHARACTERISTICS SYMBOL VDD IDD VIL VIH IIL IOL IOH PARAMETER supply voltage supply current LOW-level input voltage HIGH-level input voltage input leakage current LOW-level port sink current HIGH-level port pull-up source and push-pull current VSS VI VDD VDD = 3 V; VO = 0.4 V pull-up VDD = 3 V; VO = 2.7 V VDD = 3 V; VO = 0.0 V push-pull VDD = 3 V; VO = 2.6 V -0.7 - -10 - operating mode; VDD = 5 V; fclk = 16.0 MHz VDD = 5 V; fclk = 16.0 MHz CONDITION - 0 -1.0 0.7 MIN. 2.5 - 2.4 - - 3.5 HTRC12002B TYP. MAX. 6.0 - UNIT V mA 0.3VDD V VDD +1.0 - - -300 -3.5 V A mA A A mA 0.7VDD - -30 -140 2001 Nov 15 3 Philips Semiconductors Product specification HITAG co-processor PACKAGE OUTLINE LQFP32: plastic low profile quad flat package; 32 leads; body 7 x 7 x 1.4 mm HTRC12002B SOT358-1 c y X 24 25 17 16 ZE A e E HE wM bp pin 1 index 32 1 e bp D HD wM B vM B 8 ZD vM A 9 detail X L Lp A A2 A 1 (A 3) 0 2.5 scale 5 mm DIMENSIONS (mm are the original dimensions) UNIT mm A max. 1.60 A1 0.20 0.05 A2 1.45 1.35 A3 0.25 bp 0.4 0.3 c 0.18 0.12 D (1) 7.1 6.9 E (1) 7.1 6.9 e 0.8 HD 9.15 8.85 HE 9.15 8.85 L 1.0 Lp 0.75 0.45 v 0.2 w 0.25 y 0.1 Z D (1) Z E (1) 0.9 0.5 0.9 0.5 7 0o o Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT358 -1 REFERENCES IEC 136E03 JEDEC MS-026 EIAJ EUROPEAN PROJECTION ISSUE DATE 99-12-27 00-01-19 2001 Nov 15 4 Philips Semiconductors Product specification HITAG co-processor SOLDERING Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering can still be used for certain surface mount ICs, but it is not suitable for fine pitch SMDs. In these situations reflow soldering is recommended. Reflow soldering Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, convection or convection/infrared heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250 C. The top-surface temperature of the packages should preferable be kept below 220 C for thick/large packages, and below 235 C for small/thin packages. Wave soldering Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. HTRC12002B If wave soldering is used the following conditions must be observed for optimal results: * Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. * For packages with leads on two sides and a pitch (e): - larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed-circuit board; - smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. * For packages with leads on four sides, the footprint must be placed at a 45 angle to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. Manual soldering Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24 V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C. 2001 Nov 15 5 Philips Semiconductors Product specification HITAG co-processor Suitability of surface mount IC packages for wave and reflow soldering methods HTRC12002B SOLDERING METHOD PACKAGE WAVE BGA, HBGA, LFBGA, SQFP, TFBGA HBCC, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, SMS PLCC(3), SO, SOJ LQFP, QFP, TQFP SSOP, TSSOP, VSO Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the Drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods". 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. not suitable not not not suitable(2) recommended(3)(4) recommended(5) suitable REFLOW(1) suitable suitable suitable suitable suitable 2001 Nov 15 6 Philips Semiconductors Product specification HITAG co-processor DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS HTRC12002B This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A. Preliminary data Qualification Product data Production Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. 2001 Nov 15 7 Philips Semiconductors - a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. (c) Koninklijke Philips Electronics N.V. 2001 SCA73 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 613502/02/pp8 Date of release: 2001 Nov 15 Document order number: 9397 750 08388 |
Price & Availability of HTRC12002B
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |