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HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6507 Issued Date : 1992.12.16 Revised Date : 2002.03.26 Page No. : 1/4
HSA733
PNP EPITAXIAL PLANAR TRANSISTOR
Description
The HSA733 is designed for use in driver stage of AF amplifier applications.
Absolute Maximum Ratings
TO-92
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 250 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ........................................................................................ -60 V VCEO Collector to Emitter Voltage ..................................................................................... -50 V VEBO Emitter to Base Voltage ............................................................................................. -5 V IC Collector Current ...................................................................................................... -100 mA IB Base Current .............................................................................................................. -20 mA
Characteristics (Ta=25C)
Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat) VBE(on) *hFE fT Cob Min. -60 -50 -5 -0.55 90 100 Typ. -0.18 -0.62 200 180 4.5 Max. -0.1 -0.1 -0.3 -0.7 600 6 Unit V V V uA uA V V MHz pF Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-60V, IE=0 VEB=-5V, IC=0 IC=-100mA, IB=-10mA VCE=-6V, IC=-1mA VCE=-6V, IC=-1mA VCE=-6V, IC=-10mA VCB=-10V, f=1MHz, IE=0
*Pulse Test: Pulse Width 380us, Duty Cycle2%
Classification Of hFE1
Rank Range R 90-180 Q 135-270 P 200-400 K 300-600
HSA733
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
1000 1000
Spec. No. : HE6507 Issued Date : 1992.12.16 Revised Date : 2002.03.26 Page No. : 2/4
Saturation Voltage & Collector Current
125 C
o
25 C
o
Saturation Voltage (mV)
75 C 100
o
125 C
o
hFE
100
75 C
o
25 C VCE(sat) @ IC=10IB
o
hFE @ VCE=6V
10 0.1 1 10 100 1000
10 0.1 1 10 100 1000
Collector Current-IC (mA)
Collector Current-IC (mA)
ON Voltage & Collector Current
1000 25 C
o
Cutoff Frequancy & Collector Current
1000
Cutoff Frequance (MHz).. .
VCE=6V 100
ON Voltage (mV)
75 C
o
o
125 C
VBE(ON) @ VCE=6V
10
100 0.1 1 10 100 1000
1 1 10 100
Collector Current-IC (mA)
Collector Current (mA)
Capacitance & Reverse-Biased Voltage
10 10000 PT=1ms 1000
Safe Operating Area
Cob
Collector Current-IC (mA)
PT=100ms
Capacitance (pF)
PT=1s 100
10
1 0.1 1 10 100
1 1 10 100
Reverse-Biased Voltage (V)
Forward Voltage-VCE (V)
HSA733
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6507 Issued Date : 1992.12.16 Revised Date : 2002.03.26 Page No. : 3/4
PD-Ta
300
250
Power Dissipation-PD (mW)
200
150
100
50
0
0
50
100
o
150
200
Ambient Temperature-Ta ( C)
HSA733
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
1 2 3
Date Code
Spec. No. : HE6507 Issued Date : 1992.12.16 Revised Date : 2002.03.26 Page No. : 4/4
2
Marking:
H SA 733 Rank Control Code
3
C
Style: Pin 1.Emitter 2.Collector 3.Base
D
H I E F
G
1
3-Lead TO-92 Plastic Package HSMC Package Code: A
*: Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes: 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material:
* Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory:
* Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931
HSA733
HSMC Product Specification

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