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CXA1511L/M
Preamplifier for Remote Control Signal Reception
Description The CXA1511L/M is a bipolar IC used for preamplifiers that receive signals in infrared remote control systems. These ICs consist of a first-stage amplifier, limiter amplifier, band-pass filter, band elimination filter, signal waveform detection circuit and waveform shaping circuit. Features * Low power consumption (VCC = 5V, 9mW typ.) * Low supply voltage (VCC = 5V) * Filters (center frequency can be varied through external resistor: fo = 30kHz to 60kHz, 40kHz typ.) * Elimination of inductors prevents magnetic field inductance interference. * Optical reception diode can be coupled directly. * Collector output (pull-up resistor, TTL and CMOS can be connected directly) Applications TVs, VCRs, audio equipment Structure Bipolar silicon monolithic IC Block Diagram and Pin Configuration 8 pin SIP (Plastic) 8 pin SOP (Plastic)
Absolute Maximum Ratings 7 V * Supply voltage VCC * Operating temperature Topr -20 to +75 C * Storage temperature Tstg -65 to +150 C * Allowable power dissipation PD 600 mW (SIP) * Allowable power dissipation PD 300 mW (SOP) Operating Conditions * Supply voltage
4.7 to 5.3
V
Head Amp IN 1 ABLC Photo Diode
Limiter Amp
BPF Delector & Hysteresis BEF Comparator Integralor Comparator
2 C1 470, 680 0.01
3456 C2 GND fo N.C.
78 OUT VCC
0.01 200k (fo = 40kHz) VCC = 5V
Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits.
-1-
E94301A8X
CXA1511L/M
Pin Description Pin No. 1 Symbol Pin voltage 2.8V
Pin voltage depends on the DC Characteristics Measurement Circuit. Equivalent circuit Description Input pin. Connect optical reception diode to GND. Connect a resistor and capacitor in series to GND, and set the frequency response and gain of "Head Amp". When the resistor is large and the capacitor small, the gain is small. When the capacitor is large, sensitivity decreases in relation to the transient response. Connect a detection capacitor to GND. When the capacitor is large, sensitivity decreases in relation to the mean value detection and transient response. When the capacitor is small, fluctuation of the peak detection and output pulse width increases. The capacitor in usage is 0.01F (typ.). Set output pulse width fluctuation and noise elimination characteristics to be optimum. GND pin. Adopt a pattern design that will allow external parts to be located as closely as possible to this pin. Ground them all at the same point. The transport distance and noise elimination characteristics are greatly influenced by the pattern design surrounding the GND.
5 VCC
IN
47k
160k
VCC
1
2
C1
2.8V
40A
8k VCC
40A
2
8k
VCC 330k
3
C2
1.9V
30nA 30A
3
8k
4
GND
5
fo
1.4V
4p 8k
VCC
Connect a resistor to the power supply. Set the center frequency of the built-in BPF. See "External resistor at Pin 5 vs. Center frequency response" on Page 6.
-2-
CXA1511L/M
Pin No. 6
Symbol N.C.
Pin voltage
Equivalent circuit
Description No connected pin. Connect to GND.
VCC
5.0V (High) 7 OUT 0.6V (Low)
24k 30k 7 14k 30k
Output pin.
8
VCC
5.0V
Supply voltage pin.
DC Characteristics Measurement Circuit (CXA1511L)
(CXA1511M)
CXA1511L 1 2 3 4 5 6 7 8
5V
200k
8 470 0.01 0.01 5V 1 470 200k
7
6
5
CXA1511M 2 3 4
0.01 0.01
-3-
Electrical Characteristics Measurement condition Signal S1, 3, 7 S1, 2, 3, 4, 7 S3, 7, 8 40kHz CW 30kHz, 37kHz CW 40kHz, 48kHz CW 40kHz CW 200mVp-p S1, 2, 6, 7 A 31 40 64 k 40Vp-p S2, 5, 6, 9 B 5 19 -- dB 40Vp-p S2, 5, 6, 9 B 5 10 -- dB Note 1) Note 2) Note 3) Input level is taken Vi and measuring value is taken Vx. s 2.8 mA measuring value (f = 37kHz) measuring value (f = 30kHz) Burst wave signal with a 1.2ms, 40kHz cycle is input. 1.8 30Vp-p S2, 5, 6, 9 B 75 81 85 dB C -- 0.6 1.3 V A 0.6 1.2 1.8 V A 2.3 2.8 3.3 V 100A is flown out from Pin 1. Level ON-SW Measurement point Min. Typ. Max. Unit Remarks
(VCC = 5V, Ta = 25C)
No.
Item
Symbol
1
Input pin voltage (1)
VIN1
2
Input pin voltage (2)
VIN2
3
L level output voltage
VOL
4
Voltage gain
AV
5
BPF characteristics (1)
AVQ1
6
BPF characteristics (2)
AVQ2
7
Input impedance
rin
burst wave S3, 7 A1=20log D 1.0 60Vp-p S2, 5, 6, 7 C 440 550 770
8
Detecting ability
Det
-4- A2=20log
9
Current consumption
Icc
Note 1) The level ratio between AC level at 37kHz and that at 30kHz is taken A1 [dB].
Note 2) The level ratio between AC level at 40kHz and that at 48kHz is taken A2 [dB].
measuring value (f = 40kHz) measuring value (f = 48kHz)
Note 3) rin=
47k [k] (Vi/Vx) -1)
CXA1511L/M
CXA1511L/M
Electrical Characteristics Measurement Circuit
1
2 470 0.01 S1 S2 S3
3
4
5
6
7
8
D
C
A
R6 47k
S4
0.47 S7 S8 S9 S5 330k S6 SG E1 1.0V 0.01 200k E2 5.0V
0.47 I1 100A 50
B
Application Circuit (CXA1511L)
(CXA1511M)
47 +5V 47 CXA1511L 200k 1% (fo = 40kHz) 6 5
1
2
3 470, 680
4
5
6
7
8 8
OUT 7
Photo Diode PH302B 0.01 0.01
200k OUT 1% (fo = 40kHz) 47 47 +5V Photo Diode PH302B 1
CXA1511M 2 3 470, 680 4
Description of Operation (See the Block Diagram.) Receives infrared signals transmitted from the infrared remote control commander with a photodiode to output them as rectangular waves. I/O pin Pin 1 Input waveform
40Vp-p to 2.5Vp-p 600s typ. 40kHz (typ.)
0.01
0.01
Waveform
Operation Converts the signal current of a photodiode into voltage and amplifies it.
Pin 3 BPF output waveform Hysteresis comparator input waveform Pin 7 Output waveform
5V 0.6V (typ.)
Suppresses the noise component with BPF and BEF.
Detects the signal component and performs wave detection. Integrates the signal component and outputs it as rectangular wave from the hysteresis comparator.
-5-
CXA1511L/M
Example of Representative Characteristics
External resistor at Pin 2 vs. AV1 characteristics
0
VCC vs. ICC characteristics
BPF relative voltage gain [dB] (Pin 3)
-5
VIN = 50Vp-p (Pin 1) f = 40kHz Ta = 25C VCC = 5V
Ta = 25C 2.0
-10
ICC [mA]
1.5
-15
-20 100
1k 10k External resistor at Pin 2 []
1.0
4.0
5.0 VCC [V]
6.0
I1 vs. VIN2 characteristics Input voltage at Pin 1 vs. Output voltage at Pin 3 characteristics
5 f = 40kHz Ta = 25C VCC = 5V Ta = 25C VCC = 5V 4
BPF output (Pin 3)
VIN2 [V]
3
1 0.5
2
1
0.1 10
0 100 1m VIN [Vp-p] (Pin 1 input) 10m 100m 1
10 I1 [A]
100
f vs. AV1 characteristics
80 Ta = 25C VCC = 5V 100
External resistor at Pin 5 vs. Center frequency response
Ta = 25C VCC = 5V VIN = 50Vp-p (Pin 1)
Center frequency [kHz]
70
80
Av1 [dB]
60
60
50
40
40
20
30
10
20
30 40 f [kHz]
100
0
0
100
200
300
400
External resistor at Pin 5 [k]
-6-
CXA1511L/M
Package Outline CXA1511L
Unit: mm
8PIN SIP (PLASTIC)
+ 0.5 19.0 - 0.2
2.8 0.2
+ 0.5 6.4 - 0.2
1.2 MIN 3.0
1
8
8.3 MAX + 0.1 0.25 - 0.05
2.54
0.5 0.1 + 0.3 1.2 - 0.1
1.2 0.1
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SIP-8P-02 SIP008-P-0340 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER PLATING COPPER ALLOY 0.7g
CXA1511M
+ 0.4 5.0 - 0.1 8 5
8PIN SOP (PLASTIC)
+ 0.4 1.25 - 0.15 0.10 A + 0.3 4.4 - 0.1 6.4 0.4 + 0.15 0.1 - 0.1 0.5 0.2 0 to 10 (0.15) + 0.1 0.15 - 0.05 b = 0.4 0.03 + 0.03 0.15 - 0.01 + 0.1 b = 0.4 - 0.05 (0.4) DETAILA DETAIL B : PALLADIUM
1
4 1.27
b
0.24
M
B
DETAIL B : SOLDER
PACKAGE STRUCTURE
PACKAGE MATERIAL SONY CODE EIAJ CODE JEDEC CODE SOP-8P-L03 SOP008-P-0225 LEAD TREATMENT LEAD MATERIAL PACKAGE MASS EPOXY RESIN SOLDER/PALLADIUM PLATING 42/COPPER ALLOY 0.1g
NOTE : PALLADIUM PLATING This product uses S-PdPPF (Sony Spec.-Palladium Pre-Plated Lead Frame). -7-

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