| PART |
Description |
Maker |
| AP2R403GMT-HF |
Simple Drive Requirement, SO-8 Compatible with Heatsink
|
Advanced Power Electronics Corp.
|
| AP93T03AGMT-HF |
Simple Drive Requirement, SO-8 Compatible with Heatsink
|
Advanced Power Electronics Corp.
|
| 308CL-02500-A-200 310CL-02500-A-200 308CL-01500-A- |
Low-Power, Single-/Dual-Level Battery Monitors with Hysteresis and Integrated µP Reset
HEATSINK 0.9C/W
HEATSINK 1.7C/W
|
散热
|
| 193AB2500B 193AB1500B 192AB2000B |
HEATSINK 0.32C/W
HEATSINK 0.4C/W 散热.4C /
HEATSINK 0.62C/W 散热.62C /
|
JKL Components, Corp.
AVX, Corp.
|
| PT2270 PT2270-L2-S PT2270-L2 PT2270-L3 PT2270-L3-S |
HEATSINK CPU 28MM SQBLK W/O TAPE
HEATSINK CPU 28MM SQ BLK W/TAPE
Remote Control Decoder 遥控解码
|
http://
Princeton Technology Corporation
Princeton Technology, Corp.
|
| 05738 05738-2 |
HEATSINK CROSSFLOW, MINI MOD (40 HG, SLOTTED) 散热器横流，迷你国防部（40汞，开槽）
HEATSINK CROSSFLOW MINI MOD (40 HG SLOTTED)
|
Vicor, Corp.
VICOR[Vicor Corporation]
|
| H7422 H7422-01 H7422P-50 H7422-02 H7422-20 H7422-4 |
Jack Screw; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No
OSC 5V SMT PLAS 14X9 CMOS
Slidelock; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No RoHS Compliant: No
Photosensor Modules
|
Hamamatsu Photonics
HAMAMATSU[Hamamatsu Corporation]
|
| MIC5231-3.0BM5 MIC5231-3.3BM5 MIC5231-2.75BM5 MIC5 |
Multiconductor Cable; Jacket Material:Polyvinylchloride (PVC); Leaded Process Compatible:Yes RoHS Compliant: Yes
ECONOLINE: RZ - 1kVDC Isolation- SMD Package Styles- 5V, 12V and 15V Output- UL94V-0 Package Material- No Heatsink Required- No Extern. Components- Toroidal Magnetics- Efficiency to 62%
Micropower レCap LDO Regulator Preliminary Information
Micropower Cap LDO Regulator Preliminary Information
Micropower μCap LDO Regulator Preliminary Information
|
Micrel Semiconductor,Inc.
MICREL[Micrel Semiconductor]
|
