| PART |
Description |
Maker |
| ENW89820A1KF ENW89820C3KF |
Bluetooth Smart (Low Energy) - PAN172x
|
Panasonic
|
| NRF51422 NRF51822 NRF51822-DK |
Multi-protocol Bluetooth Low Energy and 2.4GHz proprietary system-on-chip
|
List of Unclassifed Manufacturers
|
| CC2640R2FRGZR CC2640R2FRHBR CC2640R2FRGZT |
<font color=red>[Old version datasheet]</font> SimpleLink Bluetooth low energy Wireless MCU
|
TI store
|
| CC2540 |
<font color=red>[Old version datasheet]</font> 2.4-GHz Bluetooth low energy System-on-Chip
|
TI store
|
| DA14583-01F01AT2 |
Bluetooth Low Energy 4.2 SoC with Flash Memory
|
Dialog Semiconductor
|
| CYW4329 CYW4325 CYW4330 |
Bluetooth 4.0 EDR and Low Energy compliant
|
Cypress Semiconductor
|
| RN4870 RN4871 |
Bluetooth 4.2 Low Energy Module
|
Microchip Technology
|
| PC13180FC |
2.4 GHz Low Power Wireless Transceiver IC for Bluetooth Applications
|
Motorola, Inc
|
| JE93I9HTR5 JE9 JE9112HR1 JE9112HR2 JE9112HR3 JE911 |
Digital Media System-on-Chip (DMSoC) 338-NFBGA 大功率磁保持继电
2.0mV Quad Ultra Micropower Rail-to-Rail CMOS Operational Amplifier, 24L SOIC 大功率磁保持继电
HIGH POWER LATCHING RELAY 大功率磁保持继电
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 4.6mJ, 68msec@25mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 55mJ, 88msec@150mA
Energy Harvesting Module w/ connector, 3.1V to 5.2V, 8.3mJ, 80msec@25mA
Energy Harvesting Module w/ connector, 1.8V to 3.6V, 30mJ, 75msec@150mA
SOIC socket added to Adapter Module
|
Hongfa Relay
???瀹???靛０?′唤??????
Xiamen Hongfa Electroacoustic Co., Ltd.
厦门宏发电声股份有限公司
HONGFA[Hongfa Technology]
|
