| PART |
Description |
Maker |
| MBR10H45 |
Plastic package has Underwriters Laboratory Flammability Classification 94 V-0
|
Kersemi Electronic Co.,...
|
| TO-263AB |
Plastic package has Underwriters Laboratory Flammability Classification 94 V-0
|
Kersemi Electronic Co.,...
|
| MBR2545CT |
Plastic package has Underwriters Laboratory Flammability Classifications 94V-0
|
Kersemi Electronic Co., Ltd.
|
| MBRB20H100CT MBR20H100CT |
Plastic package has Underwriters Laboratory Flammability Classification 94V-0
|
Kersemi Electronic Co., Ltd.
Kersemi Electronic Co.,...
|
| MBRF10100 MBRB10100 MBR10100 |
Plastic package has Underwriters Laboratory Flammability Classifications 94V-0
|
Kersemi Electronic Co., Ltd.
Kersemi Electronic Co., Ltd...
|
| MBRF10H1000CT |
Plastic package has Underwriters Laboratory Flammability Classification 94V-0
|
Kersemi Electronic Co., Ltd.
|
| R1A |
Plastic Case Material has UL Flammability Classication Rating 94V-0
|
Sangdest Microelectroni...
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| KD3004-DC70A KD3003-DF10A |
Thick film thermal printhead (with thermal historical control)
Compact high speed thick film thermal printhead (12 dots / mm)
|
ROHM[Rohm]
|
| FDMF5822DCCT-ND |
FDMF5822DC-Smart Power Stage (SPS) Module with Integrated Thermal Warning and Thermal Shutdown
|
Fairchild Semiconductor
|
| KD3003-DC72A |
Thick film thermal printhead (with thermal historical control)
|
Rohm
|
