| PART |
Description |
Maker |
| LH-FSLH-S090C-0406A FSLH-S090C |
850 MHz - 950 MHz RF/MICROWAVE SPLITTER AND COMBINER, 1 dB INSERTION LOSS
2012 Size 850/950 MHz Chip Multilayer Splitter/Combiner
|
HITACHI METALS LTD
HIROSE[Hirose Electric]
Hirose Electric USA, INC.
|
| V23818-H308-L57 |
Small Form Factor Multimode 850 nm 622 Mbit/s OC-12 Transceiver with LCConnector 纤巧多模850纳米622兆比秒的OC - 12收发器连接器会⑩
Small Form Factor Multimode 850 nm 622 Mbit/s OC-12 Transceiver with LC⑩ Connector
Small Form Factor Multimode 850 nm 622 Mbit/s OC-12 Transceiver with LC Connector
|
Infineon Technologies AG
|
| MCE-8V4C-302 |
850 nm VCSEL
|
Unity Opto Technology
|
| PL-SXX-00-S20-CX |
850 nm 2.5 G VCSEL TOSA
|
JDS Uniphase Corporation
|
| DS850-3 |
850 Watts 12V
|
ASTEC[Astec America, Inc]
|
| 0866BL15C200E 0866BL15C200 0866BL15C200S |
850 MHz Balun
|
Johanson Technology Inc.
Johanson Technology Inc...
|
| TRX10GVP2001 |
10Gbit/s XFP SR, 850 nm Transceiver
|
FCI connector
|
| Q65111A2364 |
OSLON Black Series (850 nm)
|
OSRAM GmbH
|
| PL-DD0-00-S30-C0 |
850 nm 2.5 G GaAs PIN Die
|
JDS Uniphase Corporation
|
| SFH4050 |
High Power Infrared Emitter (850 nm)
|
OSRAM GmbH
|
| SFH4257 |
High Power Infrared Emitter (850 nm)
|
OSRAM GmbH
|
| ZL60001TBD ZL60001 |
High speed 2.5 Gbps 850 nm VCSEL
|
ZARLINK[Zarlink Semiconductor Inc]
|
