| PART |
Description |
Maker |
| CL21B104KCFSFNE |
Multi-layer Ceramic Capacitor
|
Samsung semiconductor
|
| CL31B472KBCNNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL21B683KBCNNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL21B223KBANNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL31B105KBHNNNE |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL31A476MPHNNNE |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CL05B103KB5NNNC |
Multi Layer Ceramic Capacitor (MLCC)
|
Samsung semiconductor
|
| CE201210-6N8J CE201210-5N6J CE201210-4N7J CE201210 |
IC,MOT,MC68HC908GR8CP, DIP-28, MCU FLASH 8BIT 8MHZ 4K
IC,MCU,MC68HC908JB8ADW,8-BIT SOIC-28,21 I/O,3MHZ
IC,MCU,MC68HC711E9CFN2,8-BIT 2MHz,PLCC52
8-BIT, OTPROM, 2.1 MHz, MICROCONTROLLER, PDIP20
IC,MCU,MC68HC908KX8CDW,8-BIT SOIC-16,13 I/O,8MHZ
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0056 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.33 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
IC,MCU,MC68HC705C9ACFN,8-BIT PLCC-44,31 I/O,2MHZ 多层片式电感
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210 |
Multi-Layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-Layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
|
Bourns Inc.
Bourns, Inc.
|
| BCM5646 BCM564603 |
StrataSwitch® II Integrated Multilayer Switch
STRATASWITCH II BCM5646 INTEGRATED MULTI-LAYER SWITCH
INTEGRATED MULTI LAYER SWITCH
|
BOARDCOM[Broadcom Corporation.]
ETC
|
| NEXC224Z5.5V10.5X8.5TRF NEXC474Z3.5V10.5X8.5TRF NE |
CAPACITOR, ELECTRIC DOUBLE LAYER, 5.5 V, 220000 uF, SURFACE MOUNT CHIP, LEAD FREE
CAPACITOR, ELECTRIC DOUBLE LAYER, 3.5 V, 470000 uF, SURFACE MOUNT CHIP, LEAD FREE
CAPACITOR, ELECTRIC DOUBLE LAYER, 5.5 V, 47000 uF, SURFACE MOUNT CHIP, LEAD FREE
CAPACITOR, ELECTRIC DOUBLE LAYER, 3.5 V, 220000 uF, SURFACE MOUNT CHIP, LEAD FREE
|
NIC Components, Corp.
|
| 2508056007Y0 |
MULTI-LAYER CHIP BEAD
|
Fair-Rite Products Corp...
|
|
