| PART |
Description |
Maker |
| G751-2P8 G751 G751-1P1 G751-2P1 |
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Case Size: 1.6x3.2 mm; Packaging: Tape & Reel
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Packaging: Tape & Reel
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Case Size: 1.6x3.2 mm; Packaging: Tape & Reel
Tantalum Conformal-Coated Capacitor; Capacitance: 33uF; Voltage: 6.3V; Packaging: Tape & Reel
Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
|
Global Mixed-mode Technology Inc.
GMT[Global Mixed-mode Technology Inc]
|
| 0878580250 87858-0250 |
2.00mm (.079) Pitch Milli-Grid Breakaway Header, Surface Mount, Single Row, Vertical, without Peg, with Kapton Tape, Tape on Reel Packaging
|
Molex Electronics Ltd.
|
| KAB02D100M-TLGP KAB04D100M-TLGP KAB03D100M-TLGP KA |
Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
Multi-Chip Package MEMORY
CONNECTOR ACCESSORY
Tantalum Conformal-Coated Capacitor; Capacitance: 22uF; Voltage: 10V; Packaging: Tape & Reel
SPECIALTY MEMORY CIRCUIT, PBGA80
|
SAMSUNG SEMICONDUCTOR CO. LTD.
|
| CT10-1532-G2 |
Tape and reel packaging
|
Coto Technology
|
| M513 |
Tape and Reel Packaging for Surface Mount Components
|
M/A-COM Technology Solutions, Inc.
|
| WAN-0165 |
Safe Handling and Packaging of Tape and Reel Product to be Returned
|
Wolfson Microelectronics plc
|
| 87759-0874 |
2.00mm (.079 (15μ Cap, Tape and Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| JG7905 |
Tantalum Conformal-Coated Capacitor; Capacitance: 68uF; Voltage: 6.3V; Packaging: Tape & Reel
JG7905
|
PerkinElmer Inc.
PERKINELMER[PerkinElmer Optoelectronics]
|
| AM29F800BT-90WBC AM29F800BT-55WBI AM29F800BB-55WBE |
and flexible way to implement power solutions for the latest high performance CPUs and ASICs.; Same as IR3087 with bag packaging
30V Single N-Channel HEXFET Power MOSFET in a I-Pak package; Similar to IRFU3709Z with Lead Free Packaging
40V Single N-Channel HEXFET Power MOSFET in a SO-8 package; Similar to IRF7470 with Lead Free Packaging
Complete VR11.0 or AMD PVID power solution.; A IR3505M packaged on tape and reel 3000 per reel
8 PWM 400 KHz Sync Contr in a 8-Pin SOIC(NB) package; A IRU3037ACS with Standard Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRLZ44NS with Lead Free Packaging
The XPHASE Control IC combined with an IR XPhase TM Phase IC provides a full featured and flexible way to implement a complete an Opteron or Athlon 64 power solution.; A IR3082M with Tape and Reel Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; Similar to IRLL024Z with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a SOT-223 package; A IRLL2705 with Standard Packaging
75V Single N-Channel HEXFET Power MOSFET in a TO-262 Package; Similar to IRF2807ZL with Lead Free Packaging
55V Single N-Channel HEXFET Power MOSFET in a D2-Pak package; Similar to IRF3805S with Lead Free Packaging
x8/x16 Flash EEPROM x8/x16闪存EEPROM
XPHASE VRD10 Control IC with VccVid and Overtemp Detect; Similar to IR3080M with Lead Free Packaging on Tape and Reel x8/x16闪存EEPROM
XPHASE IC with Fault and Overtemp Detect; Same as the IR3088AM with Tape and Reel Packaging. x8/x16闪存EEPROM
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 70 ns, PDSO44
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO48
8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 5.0 Volt-only, Boot Sector Flash Memory 512K X 16 FLASH 5V PROM, 150 ns, PDSO44
|
Linear Technology, Corp.
ATM Electronic, Corp.
Integrated Device Technology, Inc.
Advanced Micro Devices, Inc.
|
| V23833-G6005-A101 |
Tantalum Molded Capacitor; Capacitance: 1uF; Voltage: 35V; Case Size: 3.2x1.6 mm; Packaging: Tape & Reel
|
Infineon Technologies AG
|
