PART |
Description |
Maker |
DPH-2-XX-SG-320-110-300 |
STACKED PIN HEADER
|
Adam Technologies, Inc.
|
0746501002 74650-1002 |
2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Pin End Version, 60 Circuits, Pin Length 6.25mm (.246)
|
Molex Electronics Ltd.
|
75198-1001 0751981001 |
2.00mm (.079) Pitch 8-Row VHDM? Lite Backplane Header, Guide Pin Signal Module,Pin End Version, 80 Circuits, Pin Length 4.75mm (.187)
|
Molex Electronics Ltd.
|
75198-1002 |
2.00mm (.079) Pitch 8-Row VHDM? Lite Backplane Header, Guide Pin Signal Module, Pin End Version, 80 Circuits, Pin Length 6.25mm (.246)
|
Molex Electronics Ltd.
|
74981-8504 0749818504 |
2.00mm (.079) Pitch 6-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Pin End Version, 100 Circuits, Pin Length 5.15mm (.202)
|
Molex Electronics Ltd.
|
0746501112 74650-1112 |
2.00mm (.079) Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin SignalModule, Signal Pin End Version, Advanced Mate Shield, 60 Circuits, Pin Length
|
Molex Electronics Ltd.
|
449-10-208 449-10-208-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
449-10-272-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
ZP9-68-G2T ZP9-14-G2T ZP9-22-G2T ZP9-24-G2T ZP9-34 |
90隆? Active Eject Pin Header 90掳 Active Eject Pin Header 90° Active Eject Pin Header
|
Yamaichi Electronics Co., Ltd.
|
|