| PART |
Description |
Maker |
| FCCSP |
a flip chip solution in a CSP package format.
|
Amkor Technology
|
| M6MGD13TW66CWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| M6MGD13VW66CWG-P |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
|
Renesas
|
| CHF15KE10 CHF15KE10A CHF15KE12 CHF15KE12A CHF15KE1 |
FLIP CHIP TVS DIODES
Patented Flip Chip Series 专利倒装芯片系列
From old datasheet system
Transient Voltage Suppressor
FLIP CHIP TVS DIODES 1500 W, UNIDIRECTIONAL, SILICON, TVS DIODE
CAP,CERAMIC,470PF,5%,50V,BOX,0.120(3.1)HX0.100(2.5 )TX0.138(3.5)LX0.100(2.5)LSX0 倒装芯片TVS二极
|
Microsemi, Corp.
MICROSEMI[Microsemi Corporation]
|
| M6MGD13TW34DWG |
Memory>MCP(Multi Chip Package)>S-CSP(Stacked CSP)
134,217,728-BIT (8,388,608-WORD BY 16-BIT) CMOS FLASH MEMORY & 33,554,432-BIT (2,097,152-WORD BY 16-BIT) CMOS MOBILE RAM
|
Renesas Electronics Corporation
|
| DBES105A DBES105A06 |
Flip-Chip Dual Diode
|
United Monolithic Semiconductors
|
| MA4GP907 MADP-000907-13050P |
GaAs Flip Chip PIN Diode
|
M/A-COM Technology Solutions, Inc.
|
| DBES105A-99F_00 DBES105A DBES105A-99F/00 |
Flip-Chip Dual Diode 倒装芯片双二极管
|
United Monolithic Semiconductors GmbH
UMS[United Monolithic Semiconductors]
|
| MA4E1310 |
GaAs Flip Chip Schottky Barrier Diode
|
M/A-COM Technology Solutions, Inc.
|
| MA4AGSBP907 |
AlGaAs Solder Bump Flip-Chip PIN Diode
|
M/A-COM Technology Solutions, Inc.
|
| NP383-28804-N NP383-28804-P NP383-84107-N NP383-84 |
Chip Scale Package -TH (CSP, 0.50mm Pitch)
|
Yamaichi Electronics Co., Ltd.
|
| MAVR-000120-1411-15 |
Solderable GaAs Constant Gamma Flip-Chip Varactor Diode
|
M/A-COM Technology Solu...
|
