| PART |
Description |
Maker |
| LLP75-6A |
Package Dimensions in mm
|
Vishay Intertechnology,Inc.
VISAY[Vishay Siliconix]
|
| PM2SL1 |
Package Dimensions in mm
|
VISAY[Vishay Siliconix]
|
| MELF |
Package Dimensions
|
Galaxy Semi-Conductor H...
|
| 081029132746 SOT-143 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132723 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029132758 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 081029133013 |
PACKAGE OUTLINE DIMENSIONS
|
Galaxy Semi-Conductor H...
|
| 8DIP300 |
8-DIP-300 Package Dimensions
|
FAIRCHILD[Fairchild Semiconductor]
|
| DIMENSIONF5CPF6CP F6CP DIMENSION_F5CP_F6CP F5CP |
2.5 x 2.0mm package F5CP / F6CP Dimensions & Pin Configuration
|
Fujitsu Microelectronics
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
Fujitsu Limited
|
| HT-210UDUYG HT-210USDNB HT-210SDYG HT-210YYG HT-21 |
Package Outline Dimensions
Package Outline Dimensions
|
List of Unclassifed Manufacturers
List of Unclassifed Man...
|
| 528-45AB |
Heat Sink; Package/Case:Half Brick; Body Material:Aluminum; Thermal Resistance:3.2 C/W; Color:Black; Size/Dimensions:0.450H x 2.240W x 2.280L"
|
Wakefield Thermal Solutions
|
