| PART |
Description |
Maker |
| MDP0040 |
PACKAGE OUTLINE DRAWING QSOP - 0.150 NARROW BODY PACKAGE
|
Elantec Semiconductor
|
| SC70-5 |
Surface mounted, 5 pin package Package outline
|
ZETEX[Zetex Semiconductors]
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| TO92 |
Through hole, 3 pin package Package outline
|
Zetex Semiconductors
|
| PG-LQFP-64-13 PG-LQFP-64-5 PG-LQFP-64-4 |
Package Outline
|
Infineon
|
| TQFN4X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| LQFP44 |
Package outline
|
Philips
|
| TQFN2X2-12 |
Package Outline
|
Global Mixed-mode Techn...
|
| TQFN3X4-20 |
Package Outline
|
Global Mixed-mode Techn...
|
| SOD882 |
Package outline
|
STANFORD[Stanford Microdevices]
|
| TSSOP-24 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|
