PART |
Description |
Maker |
LBT-121 |
Compact package based on the double-mold method.
|
ETC[ETC]
|
28333-PCN-001-A |
Mold Compound and Die Attach Change for ETQFP Package
|
M/A-COM Technology Solutions, Inc.
|
GL561 GL560 |
Low Peak Forward Voltage Type Φ 5 Resin Mold Package Infrared Emitting Diodes Low Peak Forward Voltage Type フ 5 Resin Mold Package Infrared Emitting Diodes Low Peak Forward Voltage Type 5 Resin Mold Package Infrared Emitting Diodes Low Peak Forward Voltage Type 5 Resin Mold Package Infrared Emitting Diodes
|
SHARP[Sharp Electrionic Components] Sharp Corporation
|
2SC5179-T1 2SC5179-T2 2SC5179 |
NPN EPITAXIAL SILICON TRANSISTOR IN SMALL MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION
|
NEC
|
2SC5182-T1 2SC5182-T2 2SC5182 |
NPS EPITAXIAL SILICON TRANSISTOR IN MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION From old datasheet system
|
NEC Corp.
|
2SC5186-T1 2SC5186 |
NPN EPITAXIAL SILICON TRANSISTOR IN ULTRA SUPER MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION
|
NEC
|
2SC5185 2SC5185-T1 2SC5185-T2 |
NPN EPITAXIAL SILICON TRANSISTOR IN SUPER MINI-MOLD PACKAGE FOR LOW-NOISE MICROWAVE AMPLIFICATION From old datasheet system
|
NEC Corp.
|
PS21204 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Corporation
|
PS21964-ST09 |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
PS21997-4 PS21997-4A PS21997-4C PS21997-4W |
Dual-In-Line Package Intelligent Power Module TRANSFER-MOLD TYPE INSULATED TYPE
|
Mitsubishi Electric Semiconductor
|
BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Component Limited. FUJITSU[Fujitsu Media Devices Limited]
|