| PART |
Description |
Maker |
| AP2305AGN-HF |
3.2 A, 30 V, 0.06 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
|
| FDG6322C |
Very small package outline SC70-6.
|
TY Semiconductor Co., L...
|
| SSOP24 |
24-LEAD SHRINK SMALL OUTLINE PACKAGE
|
STMicroelectronics
ST Microelectronics
|
| POWERSOP |
Power Small Outline Package,PowerSOP
|
Amkor Technology
|
| POWERSO-10 |
10LEADS POWER SMALL OUTLINE PACKAGE
|
STMicroelectronics
|
| FPT-28P-M17 |
SMALL OUTLINE L-LEADED PACKAGE 28 PIN PLASTIC
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| FPT-8P-M02 |
SMALL OUTLINE L-LEADED PACKAGE 8 PIN PLASTIC
|
Fujitsu Component Limited.
Fujitsu Media Devices Limited
|
| AP9451GG |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
|
| AP2325GEN-HF AP2325GEN-HF-14 |
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics Corp.
Advanced Power Electronics ...
|
| LC33832M-70 LC33832P-70 LC33832M-10 LC33832PL-10 L |
Small outline package version of the LC33832SL
x8 Pseudo-Static RAM
|
Sanyo Semiconductor
|
| SOT108-1 |
SO14: plastic small outline package; 14 leads; body width 3.9 mm
|
NXP Semiconductors
Philips Semiconductors
|
| RM-8 |
8-Lead Mini Small Outline Package [MSOP] Dimensions shown in millimeters
|
Analog Devices
|
