PART |
Description |
Maker |
LTV844 LTV814 LTV824 LTV824M LTV824S LTV-844 LTV84 |
1 CHANNEL AC INPUT-TRANSISTOR OUTPUT OPTOCOUPLER SURFACE MOUNT, DIP-4 Aluminum Electrolytic Capacitor; Capacitor Type:High Temperature; Voltage Rating:16VDC; Capacitor Dielectric Material:Aluminum Electrolytic; Operating Temperature Range:-55 C to C; Capacitance:270uF RoHS Compliant: No 按揭- 844S 50 OHM STRAIGHT T/H JACK RECEPTACLE LTV-844S (LTV8xx) NPN-OUTPUT AC-INPUT OPTOCOUPLER (LTV8xx) LTV-844x
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LITE-ON ELECTRONICS INC Lite-On Technology, Corp. 光宝科技股份有限公司 LITEON Lite-On Technology Corporation
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MCF53017CMJ240 MCF53014CMJ240 MCF53015CMJ240 MCF53 |
Version 3 ColdFire? core with EMAC Version 3 ColdFire庐 core with EMAC Version 3 ColdFire垄莽 core with EMAC
|
Freescale Semiconductor, Inc
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74062-2504 0740622504 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits
|
Molex Electronics Ltd.
|
74062-2594 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 8-RowGuide Pin Signal Module, Shield End Version, Pin End Version, 200 Circuits, Pin
|
Molex Electronics Ltd.
|
0740592514 |
2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 150 Circuits, Pin
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http://
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UPD703100AGJ-33-UEN UPD703100GJ-33-UEN UPD703101AG |
ROM-less version; Internal RAM: 4K bytes Mask ROM version; Mask ROM: 96K bytes; Internal RAM: 4K bytes Mask ROM version; Mask ROM: 128K bytes; Internal RAM: 4K bytes Flash version; Internal flash: 128K bytes; Internal RAM: 4K bytes 32-bit RISC microcontroller (V850E/MS2:ROMless,Internal RAM: 4 KB)
|
NEC
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74059-1014 0740591014 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Leng 2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row, Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length 5.15mm (.203)
|
Molex Electronics Ltd.
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PIC16C73A-I/SPREL PIC16LC74A-04/L PIC16LC74A-04/P |
A newer version of this device is available. Please consider PIC16C73B orPIC16F73. A newer version of this device is available. Please consider PIC16C74B or PIC16F74. A newer device is available. Please consider PIC16F76. This powerful (200 nanosecond instruction execution) yet easy-to-program ... A newer device is available. Please consider PIC16F77. This powerful (200 nanosecond instruction execution) yet easy-to-program ... A newer version of this device is available. Please consider PIC16C72A or PIC16F72.
|
Microchip
|
PIC16F83T-10/SO PIC16F83T-10I/SO PIC16CR83 PIC16CR |
A newer version of this device is available. Please consider PIC16F84A. This powerful (400 nanosecond instruction execution) yet easy-to-program (only 35 single word instructions) CMOS ROM/EEPROM-based 8-bit microcontroller packs Microchips powerful PIC architecture into an 18-pin package. Easily adapted A newer version of a device is available. Please consider PIC16F84A
|
Microchip
|
74059-1004 0740591004 |
2.00mm (.079") Pitch VHDM庐 Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Lengt 2.00mm (.079) Pitch VHDM? Board-to-Board Backplane Header, Vertical, 6-Row,Guide Pin Signal Module, Shield End Version, Pin End Version, 60 Circuits, Pin Length
|
Molex Electronics Ltd.
|
R1LV0408CSP-7LI R1LV0408CSA-5SI R1LV0408CSA-7LI R1 |
Memory>Low Power SRAM Wide Temperature Range Version 4M SRAM (512-kword 】 8-bit) Wide Temperature Range Version 4M SRAM (512-kword 隆驴 8-bit) Wide Temperature Range Version 4M SRAM (512-kword × 8-bit) Wide Temperature Range Version 4M SRAM (512-kword 8-bit)
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Renesas Electronics Corporation HITACHI[Hitachi Semiconductor]
|
U3666M U3666M-MFP U3666M-MDP |
Baseband Delay Line o.o64 ms (Improved Version of U3665M) Baseband Delay Line 64 xs (Improved Version of U3665M) Baseband Delay Line 64 us (Improved Version of U3665M)
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Atmel TEMIC[TEMIC Semiconductors]
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