| PART |
Description |
Maker |
| B72580T0600S172 B72580T0950S172 B72580T6750K072 B7 |
Multilayer technology MLV; Telecom Series 多层技术反转录电信系列
|
EPCOS AG
|
| MLVS-0603 |
This specification is applicable to Chip Metal Oxide Varistor in multilayer technology 本规范适用于金属氧化物压敏电阻片的多层技
|
Electronic Theatre Controls, Inc.
|
| PIC18F2685-I/ML PIC18LF2685-I/SO PIC18F2685-I/P PI |
28/40/44-Pin Enhanced Flash Microcontrollers with ECAN Technology, 10-Bit A/D and nanoWatt Technology
|
Microchip Technology
|
| SIGC07T60SNC |
IGBT Chip in NPT-technology 600V NPT technology positive temperature coefficient
|
Infineon Technologies AG
|
| B72588G3140S200 B72548G3140S200 B72587E3200K000 |
Combination of a multilayer ceramic capacitor and a multilayer varistor, leaded
|
EPCOS AG
|
| 1206J6300180KCT 1206J6300180KCR 1206J6300101KCR 12 |
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000018 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000022 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00015 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.001 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.00018 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.000012 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 630 V, C0G, 0.0000018 uF, SURFACE MOUNT, 1206 CHIP
|
Syfer Technology, Ltd.
|
| CR1209X7R104Z3F5 CR1209X7R104Z3NG5 CR1209X7R104Z3F |
CAPACITOR, CERAMIC, MULTILAYER, 100 V, X7R, 0.1 uF, SURFACE MOUNT, 1209 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.00047 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0056 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0022 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0033 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.0012 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.001 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0015 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0047 uF, SURFACE MOUNT, 0603 CHIP
|
Presidio Components, Inc.
|
| ILBB0603-RK300V ILBB0603RK300V ILBB-0603 |
Multilayer Ferrite Bead
Multilayer Ferrite Beads
SWITCH DIP 8POS SIDE ACT LONG
|
VISAY[Vishay Siliconix]
Vishay Intertechnology,Inc.
|
| 2222207556 2238207556 2255207555 2250207555 222220 |
General Purpose & High Capacitance
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
This specification describes X7R series chip capacitors with lead-free terminations
SURFACE-MOUNT CERAMIC MULTILAYER CAPACITORS
SURFACE-MOUNT CERAMICV MULTILAYER CAPACITORS
|
YAGEO Corporation
List of Unclassifed Manufac...
|
| SIGC156T60SNR2C |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip
|
Infineon Technologies AG
|
| SIGC03T60SNC |
IGBT Chip in NPT-technology 600V NPT technology 100μm chip
|
Infineon Technologies AG
|
| IGB15N60T |
Low Loss IGBT in Trench and Fieldstop technology 在戴低损失和场终止IGBT技
1200V IGBT for frequencies up to 10kHz for hard switching applications and up to 30kHz for soft switching. Combined Trench- and Fieldstop-Technology. ...
|
INFINEON[Infineon Technologies AG]
|
|
