PART |
Description |
Maker |
HHM1903A1 |
Multilayer Chip Baluns
|
TDK
|
LDB183G6010G-120 LDB211G8105C-001 LDB211G8110C-001 |
Chip Multilayer Hybrid Baluns
|
Murata Manufacturing Co., Ltd. Murata Manufacturing Co., L... Murata Manufacturing Co...
|
LDB211G9010C-001 LDB212G4005C-001 LDB181G8405C-110 |
Chip Multilayer Hybrid Baluns
|
MURATA[Murata Manufacturing Co., Ltd.]
|
HHM1523B3 |
Multilayer Chip Baluns For AGSM/Tx & Rx
|
TDK Electronics
|
HHM1518A3 |
Multilayer Chip Baluns For DCS-PCS/Tx & Rx
|
TDK Electronics
|
HHM1525 |
Multilayer Chip Baluns For DCS-PCS/Tx & Rx
|
TDK Electronics
|
HHM1522A7 |
Multilayer Chip Baluns For AGSM/Tx & Rx Multilayer Chip Baluns For AGSM/Tx & Rx
|
TDK Electronics
|
GMC45Z5U225G25NT GMC40Z5U225G25NT GMC02Y5V153Z6R3N |
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 2.2 uF, SURFACE MOUNT, 1825 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 2.2 uF, SURFACE MOUNT, 1808 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.015 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.022 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.027 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X7R, 0.001 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.15 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.12 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.018 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X7R, 0.00001 uF, SURFACE MOUNT, 0201 CHIP, ROHS COMPLIANT 1 UF 10% 25V X7R (1206) CHIP CAP TR CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 1 uF, SURFACE MOUNT, 1206 0.022 UF 10% 50V X7R (0603) CAP TR CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.022 uF, SURFACE MOUNT, 0603
|
Cal-Chip Electronics
|
NMC0805Y5V105Z6.3TRP3KF NMC0603Y5V105Z6.3TRP3KF NM |
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 1 uF, SURFACE MOUNT, 0805 Multilayer Ceramic Chip Capacitors 多层陶瓷芯片电容 Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 1 uF, SURFACE MOUNT, 1206
|
NIC Components Corp. NIC Components, Corp.
|
AMK063BJ224ZP-F JMK063BJ473ZP-F EMK063BJ682ZP-F EM |
CAPACITOR, CERAMIC, MULTILAYER, 4 V, X5R, 0.22 uF, SURFACE MOUNT, 0201 CHIP CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 0.047 uF, SURFACE MOUNT, 0201 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.0068 uF, SURFACE MOUNT, 0201 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.0033 uF, SURFACE MOUNT, 0201 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.0047 uF, SURFACE MOUNT, 0201 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, X5R, 0.0015 uF, SURFACE MOUNT, 0201 CHIP CAPACITOR, CERAMIC, MULTILAYER, 10 V, X5R, 0.022 uF, SURFACE MOUNT, 0201 CHIP CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.022 uF, SURFACE MOUNT, 0201 CHIP CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.047 uF, SURFACE MOUNT, 0201 CHIP
|
Taiyo Yuden Co., Ltd.
|
CL10F224ZB8NNNC CL05F103ZB5NNNC CL05F103ZB5NNNO CL |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.22 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.01 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 10 V, X7R, 0.1 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 25 V, X7R, 0.068 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.068 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X7R, 0.1 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000012 uF, SURFACE MOUNT, 0603 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, X7R, 0.1 uF, SURFACE MOUNT, 0402 CHIP CAPACITOR, CERAMIC, MULTILAYER, 16 V, Y5V, 2.2 uF, SURFACE MOUNT, 0805 CHIP CAPACITOR, CERAMIC, MULTILAYER, 50 V, X7R, 0.01 uF, SURFACE MOUNT, 0603 CHIP
|
Samsung Semiconductor Co., Ltd. Union Technologies, Corp.
|
HK10052N7S HK1005XXXX HK1608XXXX |
(HK1005xxx) MultiLayer Chip Inductor (HK1608xxx) MultiLayer Chip Inductor
|
Taiyo Yuden
|
|