| PART |
Description |
Maker |
| SYC130 NEC256 SHC130 SEC130 SGC130 SRC130 NEC250 S |
LED Displays
Optoelectronic
From old datasheet system
Intel® 82566MC Gigabit Ethernet PHY, Single Port, Pb-Free 2LI, FCBGA, Tray
Box-shaped pin header, Discrete wire crimping connection, Discrete wire connectors; HRS No: 543-0659-0 05; No. of Positions: 18; Connector Type: Wire
(degrees C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Inch type screw; MIL-C-24308
C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Locking device with rectangular mating locking base; Through hole
C): -55 to 85; Generic Name: D-SUB; General Description: Receptacle; Right angle; Field-mounting locking device; PCB locking clip; MIL-C-24308
Optoelectronic 光电
|
IDEA
NEC
AME, Inc.
Sanken Electric Co., Ltd.
|
| HM5164400LJ-5 HM5165400LJ-5 HM5165400J-5 HM5164400 |
IEC 61754-6; HRS No: 710-0087-3 40; Mating/Unmating Cycles: 500; Operating Temperature Range (degrees C): -25 to 70; Generic Name: MU; General Description: Cap
IEC 61754-6; HRS No: 710-0076-7 00; Insertion Loss (dB): 0.5; Return Loss (dB)(Min.): 40; Generic Name: MU; General Description: Plug insertion/extraction tool
x4 Fast Page Mode DRAM x4快速页面模式的DRAM
|
3M Company
|
| ICPL2630-12 ICPL2631 |
DESCRIPTION
|
ISOCOM COMPONENTS
|
| STA-6033 |
Product Description
|
List of Unclassifed Manufacturers
Sirenza Microdevices
ETC[ETC]
Electronic Theatre Controls, Inc.
|
| ANTDB1HDPXXX |
Product Description
|
List of Unclassifed Man...
|
| HT3400 |
GENERAL DESCRIPTION
|
TY Semiconductor Co., Ltd
TY Semiconductor Co., L...
|
| 2SP0115T |
Description and Application Manual
|
Concept
|
| AN1235 |
package description and recommendations for use
|
STMicroelectronics
|
| TMS27PC512-12DDE TMS27PC512-12DDE4 TMS27PC512-10DU |
PLCC Clip-on Adapters; Top Pin Count: 32; Bottom Pin Count: 32; Part Description: PLCC IC Clip;
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.5; IC Size X (mm): 4; IC Size Y (mm): 4; Socket Lid: Swivel; Max Pincount: 20; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
Diamond Particle Interconnect GHz MLF/QFN Sockets; Top Pitch (mm): 0.65; IC Size X (mm): 6; IC Size Y (mm): 6; Socket Lid: Swivel; Max Pincount: 28; Part Description: Diamond GHz QFN/MLF Socket (ZIF);
x8 EPROM x8存储
FPGA Development: XILINX; Top Pin Count: 84; Bottom Pin Count: 84; Top Interface: PLCC SOCKET; Bottom Interface: PLCC PLUG; Device Specific: yes; Devices Supported: XC3020, 3030, 3042; Part Description: Xilinx FPGA adapter; x8存储
|
Maxim Integrated Products, Inc.
Clare, Inc.
TE Connectivity, Ltd.
|
| AOI4286L |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
| AOK30B60D |
TO247 PACKAGE MARKING DESCRIPTION
|
Alpha & Omega Semiconductors
|
