| PART |
Description |
Maker |
| MPC7450RXLDPND MPC7450RXLDPNS |
MPC7450 Specification for the XPC7450RXnnnLD Series part number specification pns
Part Number Specification for the XPC7450RXnnnLD Series
Part Number Specification for the XPC7451RXnnnLD Series
|
Motorola
|
| 55PC1221 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC1246 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC2224 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 55PC0226 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
TE Connectivity Ltd
|
| 55PC2221 |
This specification sheet forms a part of the latest issue of Raychem Specification 55PC.
|
Tyco Electronics
|
| 749010013 744761068A |
All 16 terminals must lie on a plane within 004 of surface A after lead tinning
specification for release
specification for release
|
Wurth Elektronik GmbH & Co. KG, Germany.
Wurth Elektronik GmbH &...
|
| MPC8308101 MPC8308 MPC8308CVMADDA MPC8308CVMAFDA M |
MPC8308 PowerQUICC II Pro Processor Hardware Specification
MPC8308 PowerQUICC II Pro Processor Hardware Specification
|
Freescale Semiconductor, Inc
|
| TFS170D |
Specification
|
VECTRON[Vectron International, Inc]
|
| CL05A474KQ5NNNC |
SPECIFICATION
|
Samsung semiconductor
|
| CL10A226MQ8NRNE |
SPECIFICATION
|
Samsung semiconductor
|
