| PART |
Description |
Maker |
| LTW5AP |
black SMD package, colorless clear silicone resin, silicone lense
|
OSRAM GmbH
|
| LCW-CQAR.CC |
SMT ceramic package with silicone resin and silicone lens
|
OSRAM GmbH
|
| LCWCQ7P.EC LCW-CQ7P.EC |
SMT ceramic package with silicone resin and silicone lens
|
OSRAM GmbH
|
| D-300-03 D-300-01 D-300-02 610016-000 610015-000 6 |
CAP, SPLICE ENCAPSULATION
|
PANDUIT CORP.
|
| SM2615FTR845 |
High temperature molded encapsulation
|
List of Unclassifed Man...
|
| 2946117 |
Covering hood, for the contact and dust-protected encapsulation of the components, in green design.
|
PHOENIX CONTACT
|
| LECWE3B-NZQX-MRNU LECWE3B-NZQX-ORPU |
Lighting with Optics (silicone)
SINGLE COLOR LED, WHITE, 3.2 mm ROHS COMPLIANT PACKAGE-2
|
OSRAM GmbH
|
| 303DMQ600 |
High purity, high temperature epoxy encapsulation for enhanced mechanical strength and moisture resistance
|
Sangdest Microelectroni...
|
| GP-1000SF |
No silicone outgassing
|
List of Unclassifed Man...
|
| SPT36-C |
Silicone Photo-Transistor
|
Roithner LaserTechnik G...
|
| NTE303A |
Silicone Heat Sink Compound
|
NTE[NTE Electronics]
|
