PART |
Description |
Maker |
AS3SSD4GB8PBG |
SPECIALTY MICROPROCESSOR CIRCUIT, PBGA381 31 X 31 MM, 5.01 MM HEIGHT, 381 PIN
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Micross Components
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S73WS-P S75WS256NDGBFWLH2 S75WS256NDGBFWLH0 S75WS2 |
Stacked Multi-Chip Product (MCP) SPECIALTY MEMORY CIRCUIT, PBGA84 Stacked Multi-Chip Product (MCP) 堆叠式多芯片产品(MCP
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Spansion Inc. Spansion, Inc.
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AM50DLI28BG AM50DL128BG |
Am50DL128BG - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM Am50DL128BG -堆叠式多芯片封装(MCP)闪存和SRAM
|
Advanced Micro Devices, Inc. Spansion, Inc.
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S70WS512N00BFWA23 S70WS512N00BAWAB3 S70WS512N00BAW |
Same-Die Stacked Multi-Chip Product (MCP) 512 Megabit (32M x 16 bit) CMOS 1.8 Volt-only Simultaneous Read/Write, Burst-mode Flash Memory 同硅晶片堆叠多芯片产品(MCP)的512兆位2兆16位)的CMOS 1.8伏,只有同时写,突发模式闪存
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Spansion Inc. Spansion, Inc.
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S72WS-N S72WS512NEG-LY S72WS512NFG-LY S72WS512NFG- |
Based MCP/PoP Products 基于MCP流行产品 Based MCP/PoP Products SPECIALTY MEMORY CIRCUIT, PBGA137
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Spansion Inc. Spansion, Inc.
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S71PL129JB0BAW9U3 S71PL129JB0BAI9U0 S71PL129JB0BAI |
JT 18C 18#20 PIN WALL RECP 堆叠式多芯片产品(MCP)的快闪记忆 JT 15C 14#20 1#16 PIN WALL REC SPECIALTY MEMORY CIRCUIT, PBGA64 JT 15C 14#20 1#16 SKT PLUG 堆叠式多芯片产品(MCP)的快闪记忆 JT 37C 37#22D SKT PLUG Circular Connector; No. of Contacts:37; Series:MS27473; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:14; Circular Contact Gender:Pin; Circular Shell Style:Straight Plug; Insert Arrangement:14-35 RoHS Compliant: No Stacked Multi-Chip Product (MCP) Flash Memory
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Spansion, Inc. Spansion Inc.
|
R3131N46AA3-TR R3131N40DA R3131N46EC8-TR R3131N44A |
PC 5/12-GF-7,62 TVFKCL 1,5/ 8-ST PT 1.5/20-3.5H PC 5/10-GF-7,62 VFB:GROSSE BUCHST. CONN TONGUE SPADE #10 18-22AWG IMC 1.5/ 7-ST-3.81-CRWH DFK-PC 5/ 3-STF-7,62 PC 5/11-GU-7,62 TVFKCL 1,5/ 9-ST PC 5/ 3-GF-7,62 MSTB 2,5/ 2-STZ-5,08 DFK-PC 5/ 3-STF-SH-7,62 低电压检测器内置延迟电路 FAN 24VDC SPINNAKER SPD24B1 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 PC 5/ 9-GF-7,62 低电压检测器内置延迟电路 PC 5/ 8-GF-7,62 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 TVFKCL 1,5/ 7-ST 低电压检测器内置延迟电路 PTSA 1,5/ 2-3,5-F GY 低电压检测器内置延迟电路 MKDS 10 HV/ 8-ZB-10.16 低电压检测器内置延迟电路 Low Voltage Detector with built-in Delay Circuit 低电压检测器内置延迟电路 Low Voltage Detector with built-in Delay Circuit 1-CHANNEL POWER SUPPLY SUPPORT CKT, PDSO3 PC 5/ 9-GU-7,62 低电压检测器内置延迟电路 High Speed CMOS Logic 3-to-8 Line Decoder Demultiplexer Inverting and Non-Inverting 16-SOIC -55 to 125 高速CMOS逻辑3/8线性反同相解码多路解复用器 SOIC-16封装 工作温度55℃_125 PC 5/ 2-GU-7,62 低电压检测器内置延迟电路
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Ricoh Co., Ltd. RICOH COMPANY LTD RICOH electronics devices division RICOH electronics devices d... RICOH electronics devic...
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A82DL3234 A82DL3244 A82DL3224UG-70 A82DL3224TG-70 |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAMA82DL32x4T(ü)32兆位Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL32x4T(ü)32兆位Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行 Stacked Multi-Chip Package (MCP) Flash Memory and SRAM, A82DL32x4T(U) 32 Megabit (4Mx8 Bit/2Mx16 Bit) CMOS 3.3 Volt-only, Simultaneous Operation Flash 堆叠式多芯片封装(MCP)闪存和SRAM,A82DL32x4T(ü)32兆位4Mx8 Bit/2Mx16位)的CMOS 3.3伏只,同时闪电行
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AMIC Technology, Corp. AMIC Technology Corporation
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S71GL032A40BFI0B2 S71GL064A80BAI0B3 S71GL064A80BAI |
Stacked Multi-Chip Product (MCP) Flash Memory and RAM SPECIALTY MEMORY CIRCUIT, PBGA56 DIODE ZENER 200MW 5.1V 1005 SPECIALTY MEMORY CIRCUIT, PBGA56 DIODE ZENER 200MW 9.1V 1005 SPECIALTY MEMORY CIRCUIT, PBGA56 Stacked Multi-Chip Product (MCP) Flash Memory and RAM 堆叠式多芯片产品(MCP)的闪存和RAM DIODE ZENER 200MW 4.7V 1005 INDUCTOR POWER 3.3UH 5.4A SMD INDUCTOR,TOROID,HORIZONTAL, 22.0 uH,7.0 IDC,0.015 OHM,
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Spansion, Inc. Spansion Inc.
|
K522H1HACF-B050 |
MCP Specification
|
Samsung semiconductor
|