| PART |
Description |
Maker |
| HHM1518A3 |
Multilayer Chip Baluns For DCS-PCS/Tx & Rx
|
TDK Electronics
|
| HHM1523B3 |
Multilayer Chip Baluns For AGSM/Tx & Rx
|
TDK Electronics
|
| SR0603BX222P2NGD SR0603BX102P3NGD SR0402BX821P1NGD |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.0022 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.001 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.00082 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0047 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 100 V, BX, 0.00033 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, BX, 0.00056 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 16 V, BX, 0.0012 uF, SURFACE MOUNT, 0402 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 25 V, BX, 0.0033 uF, SURFACE MOUNT, 0603 CHIP
|
Presidio Components, Inc.
|
| RF3108 RF3108PCBA |
TRIPLE-BAND GSM/DCS/PCS POWER AMP MODULE 三频的GSM / DCS / PCS的功率放大器模块
|
RF Micro Devices, Inc.
RFMD[RF Micro Devices]
|
| C0603Z5U250-154ZNR C0603Z5U250-154ZN6R C0603Z5U250 |
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.15 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.15 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 1.2 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Z5U, 0.15 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 10 V, Y5V, 1 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.12 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Y5V, 0.12 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, Y5V, 1.2 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.18 uF, SURFACE MOUNT, 1812 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 1.2 uF, SURFACE MOUNT, 1210 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 2.2 uF, SURFACE MOUNT, 1812 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.18 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Z5U, 0.18 uF, SURFACE MOUNT, 1812 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.12 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.01 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.01 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 2.2 uF, SURFACE MOUNT, 1210 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 1.2 uF, SURFACE MOUNT, 1812 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.33 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.015 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.18 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.33 uF, SURFACE MOUNT, 0603 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.012 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.12 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.018 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, Z5U, 0.1 uF, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 50 V, Z5U, 0.12 uF, SURFACE MOUNT, 1206 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 16 V, C0G, 0.0000018 uF, SURFACE MOUNT, 01005 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0000082 uF, SURFACE MOUNT, 0402 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 47 uF, SURFACE MOUNT, 1210 CHIP, ROHS COMPLIANT
CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, X5R, 100 uF, SURFACE MOUNT, 1210 CHIP, ROHS COMPLIANT
|
Venkel, Ltd.
Analog Devices, Inc.
Vishay Intertechnology, Inc.
|
| MF1084V-3 |
From old datasheet system
FOR DCS MOBILE TELEPHONE, Tx
FOR DCS MOBFOR TELEPHONE, Tx
|
http://
MITSUBISHI[Mitsubishi Electric Semiconductor]
Mitsubishi Electric Corporation
|
| NMC1206Y5V103Z6.3TRPLP3KF NMC0402Y5V103Z6.3TRPLP3K |
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.01 uF, SURFACE MOUNT, 0805
Multilayer Ceramic Chip Capacitors 多层陶瓷芯片电容
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 6.3 V, Y5V, 0.01 uF, SURFACE MOUNT, 1206
Multilayer Ceramic Chip Capacitors CAPACITOR, CERAMIC, MULTILAYER, 50 V, Y5V, 0.01 uF, SURFACE MOUNT, 1206
|
NIC Components Corp.
NIC Components, Corp.
|
| HK10052N7S HK1005XXXX HK1608XXXX |
(HK1005xxx) MultiLayer Chip Inductor
(HK1608xxx) MultiLayer Chip Inductor
|
Taiyo Yuden
|
| 1206M430F500BT 1206M430F500ET 1210M430F501BT 1206M |
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000043 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, C0G, 0.000043 uF, SURFACE MOUNT, 1210 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, C0G, 0.000043 uF, SURFACE MOUNT, 1206 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, C0G, 0.000043 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000043 uF, SURFACE MOUNT, 0603 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000043 uF, SURFACE MOUNT, 1210 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000043 uF, SURFACE MOUNT, 1808 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000043 uF, SURFACE MOUNT, 0504 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 50 V, C0G, 0.000043 uF, SURFACE MOUNT, 0805 CHIP
CAPACITOR, CERAMIC, MULTILAYER, 500 V, C0G, 0.000043 uF, SURFACE MOUNT, 1808 CHIP
|
Novacap
|
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