| PART |
Description |
Maker |
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| ELANSC520-100AC ELANSC520-100AI |
PLASTIC BGA, CAVITY UP(BGA)
|
ADVANCED MICRO DEVICES INC
|
| FGA292-720G FGA272-720G FGAX168-720G 1FGA241-720G |
292 POS 1.27MM BGA SMT ADAPTER BGA292, IC SOCKET
272 POS 1.27MM BGA SMT ADAPTER BGA272, IC SOCKET
BGA168, IC SOCKET
BGA241, IC SOCKET
BGA521, IC SOCKET
BGA204, IC SOCKET
352 POS 1.27MM BGA SMT ADAPTER
BGA416, IC SOCKET
|
Advanced Interconnections, Corp.
ADVANCED INTERCONNECTIONS CORP
|
| FDZ4670 |
N-Channel PowerTrench?MOSFET BGA 30V, 25A, 2.5mΩ
N-Channel PowerTrench㈢MOSFET BGA 30V, 25A, 2.5mヘ
|
Fairchild Semiconductor
|
| FDZ291P06 FDZ291P |
P-Channel 1.5 V Specified PowerTrench? BGA MOSFET
P-Channel 1.5 V Specified PowerTrench㈢ BGA MOSFET
|
FAIRCHILD[Fairchild Semiconductor]
|
| IBM25PPC440GX-3FB533C IBM25PPC440GX-3CB533C IBM25P |
32-BIT, 533 MHz, RISC PROCESSOR, PBGA552 25 X 25 MM, FLIP CHIP, PLASTIC, BGA-552
32-BIT, 533 MHz, RISC PROCESSOR, CBGA552 25 X 25 MM, CERAMIC, BGA-552
32-BIT, 667 MHz, RISC PROCESSOR, CBGA552 25 X 25 MM, CERAMIC, BGA-552
|
Mitsubishi Electric, Corp.
|
| K7P401811M-HC160 K7P403611M-HC200 K7P403611M |
128Kx36 & 256Kx18 Synchronous Pipelined SRAM Data Sheet
128K X 36 STANDARD SRAM, 2.5 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
256K X 18 STANDARD SRAM, 3 ns, PBGA119 14 X 22 MM, 1.27 MM PITCH, BGA-119
|
Samsung Electronic
|
| FDZ294N |
N-Channel 2.5V Specified PowerTrench® BGA MOSFET
N-CHANNEL 2.5 V SPECIFIED POWERTRENCH BGA MOSFET
|
Fairchild Semiconductor
|
| IBM25PPC750FX-GB0132T IBM25PPC750FX-EB1032T IBM25P |
32-BIT, 600 MHz, RISC PROCESSOR, CBGA292 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
32-BIT, 733 MHz, RISC PROCESSOR, CBGA292 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
32-BIT, 700 MHz, RISC PROCESSOR, CBGA292 21 X 21 MM, 1 MM PITCH, CERAMIC, BGA-292
|
Fox Electronics
|
| W9864G2DB-7 |
BGA SDRAM
|
Winbond Electronics
|
|
