| PART |
Description |
Maker |
| DB2230400L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Battery Group
|
| DB2460500L |
Embossed type (Thermo-compression sealing) : 3 000 pcs / reel (standard)
|
Panasonic Semiconductor
|
| 0674901235 67490-1235 |
1.27mm (.050) Pitch Serial ATA Header, Standard Type, Surface Mount, Right Angle7 Circuits, with Mylar, 0.38μm (15μ) Gold (Au) Plating, Embossed Tape on ReelPackage, Lead-free
|
Molex Electronics Ltd.
|
| BM03B-ZESS-TBTLFSN |
ZE CONNECTOR EMBOSSED-TAPING
|
Lightel Technologies INC.
|
| LLA215R70J474MA14K LLA215R70J474MA14L |
φ180, 330mm Embossed taping
|
Murata Manufacturing Co., Ltd.
|
| LMK212ABJ106KGHT |
Standard packaging quantity (minimum) Taping Embossed 3000pcs
|
Taiyo Yuden (U.S.A.), I...
|
| HMK316AC7225ML-TE |
Standard packaging quantity (minimum) Taping Embossed 2000pcs
|
Taiyo Yuden (U.S.A.), I...
|
| 0714392464 71439-2464 |
1.00mm (.039") Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row,Vertical Stacking, Embossed Tape on Reel, 0.76渭m (30渭") Gold (Au), 64 Circuits Pick
1.00mm (.039) Pitch Mezzanine IEEE 1386 Receptacle, Surface Mount, Dual Row,Vertical Stacking, Embossed Tape on Reel, 0.76μm (30μ) Gold (Au), 64 Circuits Pick
|
Molex Electronics Ltd.
|
| 87985-8030 |
2.00mm (.079) Pitch Milli-Grid IDT Receptacle, Dual Row, with Center Polarization Key and Embossed Metal Latch, 30 Circuits
|
Molex Electronics Ltd.
|
| 0671300806 67130-0806 |
1.27mm (.050) Card Bus Header: One Slot, Flush Profile, Top Mount, Right AngleSMT, with Mylar, Embossed Tape on Reel Packaging, Lead-free
1.27mm (.050") Card Bus Header: One Slot, Flush Profile, Top Mount, Right AngleSMT, with Mylar, Embossed Tape on Reel Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0791098407 |
2.00mm (.079) Pitch Milli-Grid Receptacle, Surface Mount, Vertical, Top/Bottom Entry, without Press-fit Plastic Pegs, with Cap, Embossed Tape on Reel
|
Molex Electronics Ltd.
|
|
