| PART |
Description |
Maker |
| 0479890132 47989-0132 |
1.00mm (.039") by 1.00mm (.039") Pitch rPGA 989 Notebook PC CPU Socket, with Pick-and-Place Cover, Hard Tray Packaging, 989 Circuits, Lead free
1.00mm (.039) by 1.00mm (.039) Pitch rPGA 989 Notebook PC CPU Socket, with Pick-and-Place Cover, Hard Tray Packaging, 989 Circuits, Lead free
|
Molex Electronics Ltd.
|
| 87914-2815 0879142815 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75渭m (30渭) Gold (Au) Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 0.75楼矛m (30楼矛) Gold (Au) Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87914-2216 0879142216 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0528304422 52830-4422 |
Modular Jack, Right Angle, 4/4, 0.38渭m (15渭") Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
Modular Jack, Right Angle, 4/4, 0.38μm (15μ) Gold (Au) Plating, with Beveled MetalPins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 3-6318491-6 |
HARD TRAY ASSY FH 0.5BTB CONNECTOR 220POS PLUG 8H WITH GROUND PLATE
|
Tyco Electronics
|
| 87891-4006 |
2.54mm (.100) Pitch KK庐 Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50渭m (100渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch KK? Header, Through Hole, Breakaway, Vertical, 40 Circuits, 2.50μm (100μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 1-2013311-6 |
Memory Sockets; SEMI-HARD TRAY DDR3 204P 9.2H RVS B-L076 ( Tyco Electronics )
|
Tyco Electronics
|
| 0877580816 87758-0816 |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, 8 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Pocket Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0879143416 87914-3416 |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 87957-1005 0879571005 |
2.50mm (.098) Pitch Header, Right Angle, Through Hole, 5 Circuits, Tin (Sn) Overall Plating, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
| 0674921321 67492-1321 |
1.27mm (.050") Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.25mm (.207"), 0.76渭m (30渭") Gold (Au) Plating, Tray Packaging, 22 Circuits, Le
1.27mm (.050) Pitch Serial ATA Host Receptacle, Right Angle, SMT, Mating Height5.25mm (.207), 0.76μm (30μ) Gold (Au) Plating, Tray Packaging, 22 Circuits, LeadFree
|
Molex Electronics Ltd.
|
| 52830-6442 0528306442 |
Modular Jack, Right Angle, 6/4 Circuits, 1.3μm (50μ ) Gold (Au) Selective Plating, withBeveled Metal Pins, Tray Packaging, Lead-free
|
Molex Electronics Ltd.
|
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