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EM42CM1684RTA - Burst Length (B/L) of 2, 4, 8

EM42CM1684RTA_6037303.PDF Datasheet


 Full text search : Burst Length (B/L) of 2, 4, 8
 Product Description search : Burst Length (B/L) of 2, 4, 8


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PART Description Maker
GS820E32T-66 GS820E32T-100 GS820E32Q-150 GS820E32Q 138MHz 9.7ns 64K x 32 2M synchronous burst SRAM
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64K X 32 CACHE SRAM, 12 ns, PQFP100
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Socket Adapter; For Use With:ATMEGA168-TQFP32, ATMEGA48-TQFP32, ATMEGA88-TQFP32, ATMEGA8L-TQFP32, ATMEGA8L(FAST)-TQFP32; Pitch Spacing:.8mm
64K x 32 / 2M Synchronous Burst SRAM
117MHz 11ns 64K x 32 2M synchronous burst SRAM
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GSI Technology
Electronic Theatre Controls, Inc.
List of Unclassifed Manufacturers
GS84032AB-100 GS84032AB-100I GS84032AB-150 GS84032 100MHz 12ns 128K x 32 4Mb sync burst SRAM
150MHz 10ns 128K x 32 4Mb sync burst SRAM
166MHz 8.5ns 128K x 32 4Mb sync burst SRAM
GSI Technology
CY7C1514KV18 CY7C1514KV18-300BZXC CY7C1512KV18-300 72-Mbit QDR II SRAM 2-Word Burst Architecture Two-word burst on all accesses
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 2Mb x 36; Vcc (V): 1.7 to 1.9 V 2M X 36 QDR SRAM, 0.45 ns, PBGA165
72-Mbit QDR(TM)-II SRAM 2-Word Burst Architecture; Architecture: QDR-II, 2 Word Burst; Density: 72 Mb; Organization: 4Mb x 18; Vcc (V): 1.7 to 1.9 V 4M X 18 QDR SRAM, 0.45 ns, PBGA165
Cypress Semiconductor, Corp.
GS88218AB-150I GS88218AD-250 GS88218AB-250 GS88218 9Mb Burst SRAMs
512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs
GSI[GSI Technology]
GS88136BD-200I GS88136BD-133I GS88136BD-150 GS8813 200MHz 6.5ns 256K x 36 9Mb sync burst SRAM
133MHz 8.5ns 256K x 36 9Mb sync burst SRAM
150MHz 7.5ns 256K x 36 9Mb sync burst SRAM
166MHz 7ns 256K x 36 9Mb sync burst SRAM
GSI Technology
EDI2DL32256V EDI2DL32256V35BC EDI2DL32256V40BC EDI TMS320C6202. TMS320C6203. TMS320C6204. TMS320C6 Families
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256Kx32 Synchronous Pipline Burst SRAM 3.3V(3.3V,4.0ns,256Kx32同步流水线脉冲静态RAM)
256Kx32 Synchronous Pipline Burst SRAM 3.3V(3.3V,3.5ns,256Kx32同步流水线脉冲静态RAM)
256Kx32 Synchronous Pipline Burst SRAM 3.3V(3.3V,3.8ns,256Kx32同步流水线脉冲静态RAM)
WEDC[White Electronic Designs Corporation]
BCM3037 QAMlink® Upstream Burst Modulator
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Broadcom Corporation.
BOARDCOM
CY7C1418AV18-267BZC 36-Mbit DDR-II SRAM 2-Word Burst Architecture; Architecture: DDR-II CIO, 2 Word Burst; Density: 36 Mb; Organization: 2Mb x 18; Vcc (V): 1.7 to 1.9 V
CYPRESS SEMICONDUCTOR CORP
0757571261 3.50mm (.138) Pitch, MX150 Header, Breakaway, Vertical, 12 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
Molex Electronics Ltd.
75757-1231 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, Gold (Au) Flash Plating, 11.20mm (.441) Mating Pin Length, 3.05mm (.120) PC Tail Length
Molex Electronics Ltd.
75757-5431 3.50mm (.138) Pitch, MX150?/a> Header, Breakaway, Vertical, 6 Circuits, 1.5μm (60μ) Tin (Sn) Plating, 16.09mm (.633) Mating Pin Length, 3.05mm (.120) PC Tail Length
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