| PART |
Description |
Maker |
| 21-0542 |
PACKAGE OUTLINE 12 BUMPS, WLP PKG, 0.4MM PITCH
|
Maxim Integrated Products
|
| ICS280PGLF ICS280 ICS280PG ICS280PGILF ICS280PGI |
From old datasheet system
Package Outline and Package Dimensions (16-pin TSSOP,173 Mil. Body) 封装和封装尺寸（16引脚TSSOP封装173军医。体
|
Integrated Circuit Solu...
ICSI[Integrated Circuit Solution Inc]
Intersil, Corp.
|
| AP2305BGN-HF AP2305BGN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| AP2305GN-HF AP2305GN-HF-14 |
4.2 A, 20 V, 0.053 ohm, P-CHANNEL, Si, POWER, MOSFET HALOGEN FREE AND ROHS COMPLIANT PACKAGE-3
Simple Drive Requirement, Small Package Outline
|
Advanced Power Electronics, Corp.
Advanced Power Electronics Corp.
Advanced Power Electron...
|
| WLCSP2X4-8 |
Package Outline
|
Global Mixed-mode Techn...
|
| TDFN1.6X1.6-6 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-14 |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-14-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| TSSOP-28-EP |
Package Outline
|
Global Mixed-mode Techn...
|
| SOT416 |
Package outline
|
NXP Semiconductors
Philips Semiconductors
|
| WLCSP6X7-42 |
Package Outline
|
Global Mixed-mode Techn...
|
