| PART |
Description |
Maker |
| 449-10-206-00-560000 |
Interconnect Header .100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-164 349-10-164-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 349-10-106-00-560000 |
Interconnect Header.100 Grid; Surface Mount Pin Header
|
Mill-Max Mfg. Corp.
|
| 802-10-072-30-001000 |
Interconnect Header .100 Grid; Surface Mount Pin Header Double Row Gull Wing Double Row Surface Mount
|
Mill-Max Mfg. Corp.
|
| 480-90-202-00-001000 480-90-264-00-001000 450-90-2 |
HEADER STRIPS .100隆卤 Grid Solder Tail Double Row
HEADER STRIPS .100 Grid Solder Tail Double Row
HEADER STRIPS .100?/a> Grid Solder Tail Double Row
TWO PART BOARD CONNECTOR
|
Mill-Max Mfg. Corp.
MILL-MAX MFG CORP
|
| 414-43-272-41-117000 |
Interconnect Socket .100 Grid; Surface Mount Socket Stub Tail Double Row Surface Mount Accepts .015-.025" Leads
Interconnect Socket .100 Grid; Surface Mount Socket Stub Tail Double Row Surface Mount Accepts .015-.025 Leads
|
Mill-Max Mfg. Corp.
|
| SD-71308-001 0713085436 |
2.54mm (.100) Pitch C-Grid? Header
|
Molex Electronics Ltd.
|
| 0901362202 90136-2202 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Right Angle, Shrouded, 2 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating
|
Molex Electronics Ltd.
|
| 829-22-002-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 829-22-012-20-002101 |
Interconnect Header Spring-Loaded Header Horizontal Mount Single Row Through Hole
|
Mill-Max Mfg. Corp.
|
| 0901200140 90120-0140 |
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid III垄芒 Header, Single Row, Vertical, 20 Circuits, Tin (Sn) Plating
|
Molex Electronics Ltd.
|
