| PART |
Description |
Maker |
| M39P0R8070E2 M39P0R8070E2ZADE M39P0R8070E2ZADF |
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
|
Numonyx B.V
|
| M36P0R9060N0ZANE M36P0R9060N0ZANF M36P0R9060N0 |
512 Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 64 Mbit (Burst) PSRAM, 1.8V supply, Mux I/O, Multi-Chip Package
|
Numonyx B.V
|
| KAB04D100M-TNGP KAB01D100M KAB01D100M-TLGP KAB01D1 |
Multi-Chip Package MEMORY
|
SAMSUNG[Samsung semiconductor]
|
| A82DL16X4TU |
Stacked Multi-Chip Package
|
AMIC Technology
|
| KAB01D100M-TNGP KAB02D100M-TNGP KAB03D100M-TNGP KA |
Multi-Chip Package MEMORY
|
Samsung Electronic
|
| WED3C755E8M300BC WED3C755E8M350BC WED3C755E8M350BI |
RISC MICROPROCESSOR MULTI-CHIP PACKAGE
|
WEDC[White Electronic Designs Corporation]
|
| K5C6481NTBM |
Multi-Chip Package MEMORY Data Sheet
|
Samsung Electronic
|
| 23-22B-S2BHC-C30-2A |
Reverse Package Chip LED (Multi-Color)
|
Everlight Electronics Co., Ltd
|
| PC755BM8 |
PC755B 1MByte backside L2-cache Multi-Chip Package
|
Atmel
|
| AM41DL3208GB30IT AM41DL3208GB35IT AM41DL3208GB40IT |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| MB84VD23381FJ MB84VD23381FJ-80PBS |
Stacked MCP (Multi-Chip Package) FLASH MEMORY & FCRAM
|
Fujitsu Component Limited.
Fujitsu Limited
|
