| PART |
Description |
Maker |
| TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| M39P0R9070E2 M39P0R9070E2ZADE M39P0R9070E2ZADF |
256 or 512Mbit (x16, Multiple Bank, Multi-Level, Burst) Flash memory 128 Mbit Low Power SDRAM, 1.8V supply, Multi-Chip Package
|
Numonyx B.V
|
| KAB01D100M-TNGP KAB02D100M-TNGP KAB03D100M-TNGP KA |
Multi-Chip Package MEMORY
|
Samsung Electronic
|
| M36L0R7050L1ZAMF M36L0R7050L1ZAME M36L0R7060U1ZAMF |
128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package 128兆位（复用的I / O，多银行，多层次，多突发）快闪记忆体264兆移动存储芯片，1.8V电源多芯片封
128 Mbit (Mux I/O, Multiple Bank, Multi-Level, Burst) Flash memory, 32 or 64 Mbit PSRAM, 1.8V supply Multi-Chip Package 128兆位（复用的I / O，多银行，多层次，多突发）快闪记忆体24兆移动存储芯片，1.8V电源多芯片封
|
意法半导
STMicroelectronics N.V.
|
| W72M64VK-XBX W72M64VK90BC W72M64VK90BI W72M64VK90B |
2Mx64 3.3V Simultaneous Operation Flash Multi-Chip Package
|
White Electronic Designs Corporation
|
| TH50VSF3580AASB |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| TH50VSF3680 TH50VSF3681AASB TH50VSF368 |
SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA[Toshiba Semiconductor]
|
| AM42DL6404G |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| AM42DL640AH |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
Advanced Micro Devices
|
| W3H32M64E-XSBX W3H32M64E-400ES W3H32M64E-400ESC W3 |
32M x 64 DDR2 SDRAM 208 PBGA Multi-Chip Package
|
WEDC[White Electronic Designs Corporation]
|
| DS42515 AM29DL164D |
Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
|
AMD[Advanced Micro Devices]
|
